Infineon Integrates TLVR Technology Into a Compact Quad-Phase Power Module
https://www.electronics-lab.com/infineon-integrates-tlvr-technology-into-a-compact-quad-phase-power-module/
The new TDM24745T module features four power stages, a trans‑inductor voltage regulator inductor, and decoupling capacitors, delivering over 2 A/mm² current density in a compact package.
AOS Launches Low- and Medium-Voltage MOSFETs With Double-Sided Cooling
https://www.electronics-lab.com/aos-launches-low-and-medium-voltage-mosfets-with-double-sided-cooling/
The new AONC40202 25 V and AONC68816 80 V MOSFETs are available in a DFN 3.3×3.3 source-down packaging with double-sided cooling and a center-gate layout for AI servers and data centers.
Hitachi Energy and Pakal Technologies Produce High-Voltage Power Modules
https://www.electronics-lab.com/hitachi-energy-and-pakal-technologies-produce-high-voltage-power-modules/
Hitachi will integrate Pakal’s insulated gate turn-off (thyristor) silicon power switch into ≥3.3 kV modules, aiming for 30% lower conduction losses than IGBTs for rail, renewables, and data centers.
HBM4 Is Here: Samsung Begins Mass Production of Commercial Units
https://www.electronics-lab.com/hbm4-is-here-samsung-begins-mass-production-of-commercial-units/
The high-bandwidth memory 4 (HBM4) delivers consistent 11.7 Gbps transfer speeds on its 1c DRAM process node with a 4 nm logic base die.
GigaDevice Releases High-Speed Dual-Voltage SPI NOR Flash for 1.2 V SoCs
https://www.electronics-lab.com/gigadevice-releases-high-speed-dual-voltage-spi-nor-flash-for-1-2-v-socs/
The new GD25NX series xSPI NOR Flash features a dual-voltage design with 1.2 V I/O to enable direct connection to 1.2 V SoCs and reduce read power.
Onsemi Develops Vertical Gallium Nitride Power Semiconductor Technology
https://www.electronics-lab.com/onsemi-develops-vertical-gallium-nitride-power-semiconductor-technology/
The vertical gallium nitride (vGaN) semiconductors vertically conduct current through the chip, enabling higher operating voltages, faster switching, and reduced energy loss compared to traditional silicon.
Nuvoton Releases All-in-One BMC Platform To Reduce Design Complexity
https://www.electronics-lab.com/nuvoton-releases-all-in-one-bmc-platform-to-reduce-design-complexity/
Nuvoton has built its NPCM8mnx system-in-package to include all necessary baseboard management controller components, reducing board space and design complexity in AI server and data center applications.
Lattice Launches Secure Control FPGA Family With Post-Quantum Security
https://www.electronics-lab.com/lattice-launches-secure-control-fpga-family-with-post-quantum-security/
The new MachXO5-NX TDQ FPGA family features full CNSA 2.0-compliant post-quantum cryptography support, hardware Root of Trust, and secure boot functionality.
Jitter No More: Skyworks Introduces Clock Buffers for High-Speed Infrastructure
https://www.electronics-lab.com/jitter-no-more-skyworks-introduces-clock-buffers-for-high-speed-infrastructure/
Skyworks' new line of clock fanout buffers is designed to simplify complex clock trees and improve signal integrity in high-speed systems like next-generation networks, data centers, and PCIe Gen 7.
Broadcom Aims to Solve the Distributed AI Networking Challenge
https://www.electronics-lab.com/broadcom-aims-to-solve-the-distributed-ai-networking-challenge/
The new Jericho4 router uses 3.2T HyperPorts and deep buffering to enable lossless RoCE performance, connecting massive XPU clusters across facilities separated by over 100 km.