Forlinx FAI-ARA240-M Edge AI Accelerator with 40 eTOPS and NXP’s i.MX95 SoM Support
https://www.electronics-lab.com/forlinx-fai-ara240-m-edge-ai-accelerator-with-40-etops-and-nxps-i-mx95-som-support/
Compact M.2 DNPU accelerator delivers high-efficiency AI with up to 40 eTOPS and seamless integration with NXP's i.MX95 SoM for edge applications.
Grinn ReneSOM-V2H System-on-Module Supports Renesas RZ/V2H Vision AI SoC
https://www.electronics-lab.com/grinn-renesom-v2h-system-on-module-supports-renesas-rz-v2h-vision-ai-soc/
Designed for edge AI applications, the module integrates the Renesas RZ/V2H processor, DRP-AI3 accelerator, and multiple camera interfaces for embedded vision and robotics systems.
Rivian Develops Armv9-Based RAP1 Autonomy Processor for Vehicle AI Interface
https://www.electronics-lab.com/rivian-develops-armv9-based-rap1-autonomy-processor-for-vehicle-ai-interface/
A custom RAP1 chip using Arm Cortex-A720AE cores forms the core of Rivian’s third-generation autonomy platform for EVs, enabling efficient AI compute and safety-focused vehicle processing.
Engicam SmarCore iQ6 SMARC Module Runs Qualcomm IQ-615 Processor With Adreno GPU
https://www.electronics-lab.com/engicam-smarcore-iq6-smarc-module-runs-qualcomm-iq-615-processor-with-adreno-gpu/
The SMARC 2.2 SmarCore iQ6 integrates Qualcomm’s IQ-615 processor, LPDDR4X memory, and multiple high-speed interfaces for industrial IoT, edge AI, and embedded computing applications.
Grinn Delivers High-Performance Edge AI in Tiny 25 x 25 mm System-on-Module
https://www.electronics-lab.com/grinn-delivers-high-performance-edge-ai-in-tiny-25-x-25-mm-system-on-module/
The Grinn AstraSOM-261x is an Edge AI SoM built on the Synaptics Astra SL2610 processor, packing a 1 TOPs NPU and advanced graphics into an ultra-compact industrial-grade footprint.
Avalue EMX-PTLP Thin Mini-ITX Motherboard Features Intel Panther Lake-H Processors
https://www.electronics-lab.com/avalue-emx-ptlp-thin-mini-itx-motherboard-features-intel-panther-lake-h-processors/
Designed for embedded and industrial systems, this Mini-ITX motherboard supports Intel Core Ultra processors, DDR5 memory, PCIe Gen5 expansion, and multiple display interfaces.
Cadence’s Tensilica HiFi iQ DSP Features Voice AI and Audio Processing
https://www.electronics-lab.com/cadences-tensilica-hifi-iq-dsp-features-voice-ai-and-audio-processing/
The new DSP IP core improves AI and audio performance with FP8/BF16 support, enhanced SIMD processing, and lower power consumption for voice-enabled embedded systems.
Meet the Arduino VENTUNO Q: A “Dual-Brain” Architecture on a Single Board
https://www.electronics-lab.com/meet-the-arduino-ventuno-q-a-dual-brain-architecture-on-a-single-board/
The new board pairs a Dragonwing IQ8 series processor with an STM32H5 microcontroller, targeting edge AI, robotics, and motion control applications.
Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems
https://www.electronics-lab.com/everspins-unisyst-mram-combines-code-and-data-storage-for-embedded-systems/
The new UNISYST MRAM family unifies code and data storage in a single device, offering up to 2 Gb density, 400 MB/s reads, and a migration path from its existing PERSYST platform.
SECO Unveils MediaTek Genio 360/360P-Based Cost-Efficient Edge AI SOMs
https://www.electronics-lab.com/seco-unveils-mediatek-genio-360-360p-based-cost-efficient-edge-ai-soms/
The SOM-Trizeps-X-Genio360/360P Edge AI SOMs are built on MediaTek's 6 nm Genio 360/360P IoT processors, offering cost-effective industrial-grade operation in a compact 67.6 × 36.7 mm SODIMM module.