Congatec Introduces Rugged COM Express Compact Module for Edge Applications
https://www.electronics-lab.com/congatec-introduces-rugged-com-express-compact-module-for-edge-applications/
The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer a -40 to 85°C industrial-grade temperature range.
Espressif Integrates Tri-Band Wi-Fi 6E and Dual-Mode Bluetooth Into Single SoC
https://www.electronics-lab.com/espressif-integrates-tri-band-wi-fi-6e-and-dual-mode-bluetooth-into-single-soc/
The ESP32-E22 SoC operates across the 2.4 GHz, 5 GHz, and 6 GHz Wi-Fi bands and supports Classic Bluetooth and Bluetooth LE 5.4 for advanced wireless connectivity in industrial and consumer markets.
Littelfuse’s Omnipolar TMR Switches Target Compact, Battery-Powered Electronics
https://www.electronics-lab.com/littelfuses-omnipolar-tmr-switches-target-compact-battery-powered-electronics/
The new LF21173TMR and LF21177TMR switches feature a low 160 nA power consumption and a wide 1.8 V to 5.5 V operating range in a compact LGA4 package.
TDK’s High-Current DC-Link Capacitors Operate at 105 °C Without Derating
https://www.electronics-lab.com/tdks-high-current-dc-link-capacitors-operate-at-105-c-without-derating/
Designed for high current density in power electronics, the new ModCap UHP series combines a high-temperature dielectric with a modular form, enabling a 200,000-hour lifetime in high temperatures.
AMD Announces Ryzen AI Embedded P100 and X100 Series Processors
https://www.electronics-lab.com/amd-announces-ryzen-ai-embedded-p100-and-x100-series-processors/
The new processors combine Zen 5 CPU cores, AMD RDNA 3.5 GPU, and AMD XDNA 2 NPU to power AI-driven automotive and industrial applications at the edge.
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
https://www.electronics-lab.com/innodisk-teams-up-with-qualcomm-develops-com-hpc-mini-module/
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with wide-temperature operation for industrial edge applications.
STMicroelectronics Launches MPUs for Cost and Power-Constrained Designs
https://www.electronics-lab.com/stmicroelectronics-launches-mpus-for-cost-and-power-constrained-designs/
The STM32MP21 MPUs feature a 1.5 GHz Arm Cortex-A35 core and a 300 MHz Cortex-M33 core, offering high-performance, efficiency, and security in industrial applications and edge devices.
SECO Rolls Out COM Express Type 6 Module for Mission-Critical Designs
https://www.electronics-lab.com/seco-rolls-out-com-express-type-6-module-for-mission-critical-designs/
The new COM is powered by Intel Core Ultra Series 3 processors, delivers up to 180 platform TOPS AI acceleration, and features industrial-grade specifications for next-generation embedded applications.
AGS Devices and Celus Accelerate End-to-End Design to Procurement
https://www.electronics-lab.com/ags-devices-and-celus-accelerate-end-to-end-design-to-procurement/
The Celus Design platform is now available through AGS Devices, featuring AI-powered application-ready schematic generation with AGS Devices’ real-time component sourcing.
TDK Launches Vibration-Resistant Hybrid Polymer Electrolytic Capacitors
https://www.electronics-lab.com/tdk-launches-vibration-resistant-hybrid-polymer-electrolytic-capacitors/
The new vibration-resistant capacitors use four base-plate posts to withstand mechanical accelerations up to 30 g, providing stable performance in demanding automotive and industrial applications.