AAEON Intelli TWL01 Edge Industrial Mini-PC with Dual 4K Output
https://www.electronics-lab.com/aaeon-intelli-twl01-edge-industrial-mini-pc-with-dual-4k-output/
Fanless industrial mini-PC with Alder Lake-N/Twin Lake CPUs, dual HDMI 4K, up to 16GB LPDDR5, NVMe support, dual LAN, wide 9–36V input, and industrial I/O.
STMicroelectronics Releases High-Precision, 36 V Dual Operational Amplifier
https://www.electronics-lab.com/stmicroelectronics-releases-high-precision-36-v-dual-operational-amplifier/
The new TSB192 dual op amp offers a 20 µV max offset, 8 MHz gain bandwidth product, and a 4 V to 36 V supply range, suited for industrial, power supply, and automotive designs.
Firefly AIO-3588Q AI ARM Motherboard with 8K Multi-Display
https://www.electronics-lab.com/firefly-aio-3588q-ai-arm-motherboard-with-8k-multi-display/
Compact RK3588 board with 6 TOPS NPU, PCIe, 8K video, multi-display output, and industrial I/O for edge AI and embedded systems.
GigaDevice’s New 32-Bit Microcontrollers Target HMI and IoT Edge Applications
https://www.electronics-lab.com/gigadevices-new-32-bit-microcontrollers-target-hmi-and-iot-edge-applications/
The GD32F5HC series MCUs feature an Arm Cortex-M33 core with up to 2,048 KB Flash, TrustZone-enabled security, a full cryptographic accelerator suite, and a rich peripheral set, all in a compact package.
REYAX LoRa Module RYLR999 Adds BLE Bridge for Fast Prototyping
https://www.electronics-lab.com/reyax-lora-module-rylr999-adds-ble-bridge-for-fast-prototyping/
RYLR999 LoRa Module offers BLE-to-LoRa bridging, strong RF performance, and quick UART setup, but costs more and gives less flexibility than ESP32-based designs.
GL.iNet Comet 5G RedCap KVM Adds Cellular Failover and Touchscreen
https://www.electronics-lab.com/gl-inet-comet-5g-redcap-kvm-adds-cellular-failover-and-touchscreen/
A compact KVM over IP device with 5G RedCap, Wi-Fi 6, and Ethernet failover, offering remote access, 4K input, and a built-in touchscreen for control.
Congatec Targets Low-Power Edge AI With Entry-Level COM Express Module
https://www.electronics-lab.com/congatec-targets-low-power-edge-ai-with-entry-level-com-express-module/
The new conga-TC300 COM is based on Intel Core Series 3 processors, offering up to 41 TOPS within a 12 W to 28 W TDP envelope for cost-sensitive industrial edge applications.
A2560Me Mini-ITX Retro Motherboard with 68k CPU and FPGA
https://www.electronics-lab.com/a2560me-mini-itx-retro-motherboard-with-68k-cpu-and-fpga/
Built on MC68LC060 and Kintex-7 FPGA, the board combines legacy 68k computing with PCIe, DDR3, and extensive I/O for developers.
Electronic Weight Scale Shield For OLEDUINO-v2
https://www.electronics-lab.com/project/electronic-weight-scale-shield-for-oleduino-v2/
This compact shield is based on the HX711 ADC, specifically designed to interface load cells and strain gauge sensors. It can be paired with the OLEDUINO-V2, enabling the creation of a miniature electronic weighing scale. The HX711 load cell amplifier shield allows users to accurately measure data from load cells and strain gauges. At the […]
AAEON Introduces an “All-in-One” AI-Powered Robotics Development System
https://www.electronics-lab.com/aaeon-introduces-an-all-in-one-ai-powered-robotics-development-system/
The CEXD-INTRBL open robotic system utilizes Intel Core Ultra (Series 3) architecture and delivers up to 180 TOPS AI performance, targeting humanoid, autonomous mobile robot, and edge AI application development.