Dragon Q8B Packs Edge AI, Dual 2.5GbE, and Triple 4K Output
https://www.electronics-lab.com/dragon-q8b-packs-edge-ai-dual-2-5gbe-and-triple-4k-output/
Powered by Snapdragon 8cx Gen 3, the Dragon Q8B combines dual 2.5GbE, PCIe expansion, Wi-Fi 7 support, and up to 32GB RAM for edge AI applications.
Espressif ESP32-S31 CoreBoard and Korvo Kits Target AIoT, HMI, and Smart Audio Apps
https://www.electronics-lab.com/espressif-esp32-s31-coreboard-and-korvo-kits-target-aiot-hmi-and-smart-audio-apps/
Two new high-performance RISC-V devki/devboard have arrived, bringing Gigabit Ethernet, Wi-Fi 6, and advanced multimedia interfaces to smart home appliances
Qualcomm Dragonwing Development Kit Offers 24 TOPS Edge AI
https://www.electronics-lab.com/qualcomm-dragonwing-development-kit-offers-24-tops-edge-ai/
Thundercomm’s Qualcomm Dragonwing Development Kit features the Q-7790 SoC, 24 TOPS AI performance, Android/Linux support, and rich I/O for edge AI deployments.
Geniatech AIM-M-K AI Accelerator Brings 40 TOPS AI to M.2 Edge Systems
https://www.electronics-lab.com/geniatech-aim-m-k-ai-accelerator-brings-40-tops-ai-to-m-2-edge-systems/
Geniatech AIM-M-K is an M.2 AI accelerator with NXP Ara-240 NPU, 40 TOPS performance, and support for LLMs and vision AI workloads.
ESP32-P4-Pi Board Combines Wi-Fi 6, Ethernet, and Pi Form Factor
https://www.electronics-lab.com/esp32-p4-pi-board-combines-wi-fi-6-ethernet-and-pi-form-factor/
VIEWE’s dual-chip ESP32-P4 and ESP32-C6 platform targets HMI, edge AI, multimedia, and industrial IoT applications with rich multimedia and connectivity features.
MINIX ER939-AI Mini PC Features 126 TOPS NPU and High-Speed Connectivity
https://www.electronics-lab.com/minix-er939-ai-mini-pc-features-126-tops-npu-and-high-speed-connectivity/
This new compact workstation features an AMD Ryzen AI Max+ 395 processor, 128 GB of LPDDR5 memory, and support for quad-screen displays, targeting AI developers, content creators, and demanding industrial applications.
Radxa AICore DX-M1M Edge AI Acceleration Module Hits 25 TOPS
https://www.electronics-lab.com/radxa-aicore-dx-m1m-edge-ai-acceleration-module-hits-25-tops/
Compact Radxa module with DeepX NPU delivers 25 TOPS at 3W for efficient edge AI workloads.
ADLINK DLAP-701 Edge AI Platform Powered by NVIDIA Jetson Thor
https://www.electronics-lab.com/adlink-dlap-701-edge-ai-platform-powered-by-nvidia-jetson-thor/
ADLINK’s DLAP-701 uses NVIDIA Jetson Thor with up to 128GB LPDDR5X, high-speed I/O, and industrial design for robotics, vision, and AI workloads.
Forlinx FAI-ARA240-M Edge AI Accelerator with 40 eTOPS and NXP’s i.MX95 SoM Support
https://www.electronics-lab.com/forlinx-fai-ara240-m-edge-ai-accelerator-with-40-etops-and-nxps-i-mx95-som-support/
Compact M.2 DNPU accelerator delivers high-efficiency AI with up to 40 eTOPS and seamless integration with NXP's i.MX95 SoM for edge applications.
Grinn ReneSOM-V2H System-on-Module Supports Renesas RZ/V2H Vision AI SoC
https://www.electronics-lab.com/grinn-renesom-v2h-system-on-module-supports-renesas-rz-v2h-vision-ai-soc/
Designed for edge AI applications, the module integrates the Renesas RZ/V2H processor, DRP-AI3 accelerator, and multiple camera interfaces for embedded vision and robotics systems.