Grinn Delivers High-Performance Edge AI in Tiny 25 x 25 mm System-on-Module
https://www.electronics-lab.com/grinn-delivers-high-performance-edge-ai-in-tiny-25-x-25-mm-system-on-module/
The Grinn AstraSOM-261x is an Edge AI SoM built on the Synaptics Astra SL2610 processor, packing a 1 TOPs NPU and advanced graphics into an ultra-compact industrial-grade footprint.
Avalue EMX-PTLP Thin Mini-ITX Motherboard Features Intel Panther Lake-H Processors
https://www.electronics-lab.com/avalue-emx-ptlp-thin-mini-itx-motherboard-features-intel-panther-lake-h-processors/
Designed for embedded and industrial systems, this Mini-ITX motherboard supports Intel Core Ultra processors, DDR5 memory, PCIe Gen5 expansion, and multiple display interfaces.
Cadence’s Tensilica HiFi iQ DSP Features Voice AI and Audio Processing
https://www.electronics-lab.com/cadences-tensilica-hifi-iq-dsp-features-voice-ai-and-audio-processing/
The new DSP IP core improves AI and audio performance with FP8/BF16 support, enhanced SIMD processing, and lower power consumption for voice-enabled embedded systems.
Meet the Arduino VENTUNO Q: A “Dual-Brain” Architecture on a Single Board
https://www.electronics-lab.com/meet-the-arduino-ventuno-q-a-dual-brain-architecture-on-a-single-board/
The new board pairs a Dragonwing IQ8 series processor with an STM32H5 microcontroller, targeting edge AI, robotics, and motion control applications.
Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems
https://www.electronics-lab.com/everspins-unisyst-mram-combines-code-and-data-storage-for-embedded-systems/
The new UNISYST MRAM family unifies code and data storage in a single device, offering up to 2 Gb density, 400 MB/s reads, and a migration path from its existing PERSYST platform.
SECO Unveils MediaTek Genio 360/360P-Based Cost-Efficient Edge AI SOMs
https://www.electronics-lab.com/seco-unveils-mediatek-genio-360-360p-based-cost-efficient-edge-ai-soms/
The SOM-Trizeps-X-Genio360/360P Edge AI SOMs are built on MediaTek's 6 nm Genio 360/360P IoT processors, offering cost-effective industrial-grade operation in a compact 67.6 × 36.7 mm SODIMM module.
SolidRun’s Fanless Industrial PCs Feature AMD Ryzen AI 300 Mobile AI SoC
https://www.electronics-lab.com/solidruns-fanless-industrial-pcs-feature-amd-ryzen-ai-300-mobile-ai-soc/
SolidRun has expanded its modular IPC lineup with the Bedrock RAI300, powered by AMD Ryzen AI 300 processors, targeting edge AI inference with higher NPU performance and fanless cooling.
Advantech 3.5-Inch SBC Features Qualcomm QCS6490 or QCS5430 SoC For Edge AI
https://www.electronics-lab.com/advantech-3-5-inch-sbc-features-qualcomm-qcs6490-or-qcs5430-soc-for-edge-ai/
The Advantech MIO-5355 is an industrial 3.5-inch SBC using Qualcomm QCS6490 or QCS5430 SoCs, offering LPDDR5 memory, rich I/O, edge AI acceleration, and long-term OS support.
AMD Launches Ryzen AI Embedded P100 and X100 With Up to 50 TOPS AI Power
https://www.electronics-lab.com/amd-launches-ryzen-ai-embedded-p100-and-x100-with-up-to-50-tops-ai-power/
AMD is bringing its "Ryzen AI" branding to the embedded sector, with Zen 5 CPUs, RDNA 3.5 graphics, and an XDNA 2 NPU for Edge AI applications.
CES 2026: Broadcom Brings Edge AI to Wi-Fi 8 with New BCM4918 APU
https://www.electronics-lab.com/ces-2026-broadcom-brings-edge-ai-to-wi-fi-8-with-new-bcm4918-apu/
The newly announced Wi-Fi 8 SoC integrates a proprietary Neural Engine and 10G PHYs to offload AI inference from the main CPU in next-gen residential access points.