Heltec WiFi LoRa 32 (V4) Expansion Kit with ESP32-S3 and SX1262
https://www.electronics-lab.com/heltec-wifi-lora-32-v4-expansion-kit-with-esp32-s3-and-sx1262/
ESP32-S3-based IoT kit with Wi-Fi, BLE 5.0, and SX1262 LoRa, offering long-range communication, battery and solar support, OLED display, and rich expansion options.
Infineon Releases Ultra-Low-Power, Wi-Fi 7 IoT 20 MHz Tri-Radio Family of SoCs
https://www.electronics-lab.com/infineon-releases-ultra-low-power-wi-fi-7-iot-20-mhz-tri-radio-family-of-socs/
The AIROC ACW741x SoC family integrates 20 MHz Wi-Fi 7, Bluetooth LE 6.0, and IEEE 802.15.4 Thread technology in a single device, offering energy-efficient IoT device connection across industries.
Microchip LAN866x Enables Zonal Networking with 10BASE-T1S Endpoints
https://www.electronics-lab.com/microchip-lan866x-enables-zonal-networking-with-10base-t1s-endpoints/
LAN866x 10BASE-T1S endpoint ICs support multidrop Ethernet and RCP, enabling centralized control, reduced cabling, and simpler sensor, lighting, and audio integration.
Insight SIP Expands BLE Module Series With Power and Memory Variants
https://www.electronics-lab.com/insight-sip-expands-ble-module-series-with-power-and-memory-variants/
The ISP2454 series, based on Nordic Semiconductor’s nRF54L15 BLE chip, now includes versions for power-hungry and memory-intensive applications, including cellular radios and Matter-based systems.
Waveshare RP2350 Devkit – A Round Touch Display with Optional Speaker and Battery
https://www.electronics-lab.com/waveshare-rp2350-devkit-a-round-touch-display-with-optional-speaker-and-battery/
Waveshare Raspberry Pi RP2350 dev board sports a 1.85-inch round touch display and mic. An optional Box model adds a speaker and battery for portable HMI projects.
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
https://www.electronics-lab.com/innodisk-teams-up-with-qualcomm-develops-com-hpc-mini-module/
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with wide-temperature operation for industrial edge applications.
VEGA AS2161 DHRUV64: India’s Indigenous RISC-V Dual-Core Microprocessor
https://www.electronics-lab.com/vega-as2161-dhruv64-indias-indigenous-risc-v-dual-core-microprocessor/
C-DAC’s VEGA AS2161 DHRUV64 is a 64-bit dual-core RISC-V processor with Linux support, advanced MMU, and debug features, strengthening India’s self-reliant chip ecosystem.
Dracula Technologies Announces Enhanced Light Energy Harvesting OPV
https://www.electronics-lab.com/dracula-technologies-announces-enhanced-light-energy-harvesting-opv/
At CES 2026, Dracula Technologies unveiled the next generation of its LAYER OPV module, targeting battery-free IoT devices in indoor ambient lighting conditions.
Banana Pi BPI-SM9 16-ENC-A3 SoM Features SOPHGO BM1688 AI SOC
https://www.electronics-lab.com/banana-pi-bpi-sm9-16-enc-a3-som-features-sophgo-bm1688-ai-soc/
The BPI-SM9 16-ENC-A3 pairs the BM1688 AI chip with multimedia and I/O for multi-stream video analytics and edge AI applications.
CES 2026: Qualcomm Debuts Next-Gen Dragonwing Q-Series Processors
https://www.electronics-lab.com/ces-2026-qualcomm-debuts-next-gen-dragonwing-q-series-processors/
The new Dragonwing Q-8750 and Q-7790 processors feature on-device AI, enhanced multimedia capabilities, and high-performance processing to advance consumer and industrial edge devices.