Littelfuse Debuts Ultra-Compact Surface-Mount Half-Pitch DIP Switches
https://www.electronics-lab.com/littelfuse-debuts-ultra-compact-surface-mount-half-pitch-dip-switches/
The new TDB series offers a 1.27 mm half-pitch, surface-mount DIP switch solution with gold-plated contacts and a washable sealing, optimized for high-density PCB designs.
Vividnode Mobile AI Mini PC Packs 60 TOPS RISC-V Performance
https://www.electronics-lab.com/vividnode-mobile-ai-mini-pc-packs-60-tops-risc-v-performance/
Powered by SpacemiT K3, this compact system delivers 60 TOPS AI compute, 32GB RAM, and rich I/O for local LLM inference and edge AI development.
SeeedStudio reTerminal D1001 Packs ESP32-P4 with 8-inch LCD Touch Display
https://www.electronics-lab.com/seeed-studio-reterminal-d1001-packs-esp32-p4-with-8-inch-lcd-touch-display/
An ESP32-P4-based HMI device featuring an 8-inch LCD Touch Display, Wi-Fi 6, camera, and audio for AIoT dashboards, smart panels, and edge applications at $84.90.
Microchip Releases Digital Signal Controller for Secure, High-Efficiency Designs
https://www.electronics-lab.com/microchip-releases-digital-signal-controller-for-secure-high-efficiency-designs/
The device is the latest addition to the dsPIC33A family, featuring a 200 MHz 32-bit core, 78 ps high-resolution PWMs, and library support for post-quantum cryptography.
FLiP Microcontroller Module Rev B Adds USB-C and Wider VIN Range
https://www.electronics-lab.com/flip-microcontroller-module-rev-b-adds-usb-c-and-wider-vin-range/
Parallax FLiP Microcontroller Module Rev B features USB-C, 5–16V input, and an 8-core Propeller MCU with improved protection and power handling.
Solenoid & DC Motor Driver Shield for OLEDUINO v2
https://www.electronics-lab.com/project/solenoid-dc-motor-driver-shield-for-oleduino-v2/
OLEDUINO-V2 Shield is able to drive up to 3.7A/24V for motors & solenoids. PWM control with sleep and back-EMF brake modes.
Murata Scales Capacitance Density With Seven New AEC-Q200-Qualified MLCCs
https://www.electronics-lab.com/murata-scales-capacitance-density-with-seven-new-aec-q200-qualified-mlccs/
The company’s latest automotive multilayer ceramic capacitors (MLCCs) offer increased capacitance for their size, targeting advanced driver assistance systems and autonomous vehicles.
Clintech Pico Packs 48 GPIOs in Raspberry Pi RP2354B Board
https://www.electronics-lab.com/clintech-pico-packs-48-gpios-in-raspberry-pi-rp2354b-board/
A compact RP2354B-based board with full 48 GPIO breakout, USB-C, dual-core Arm/RISC-V support, and 2MB flash, designed for flexible embedded development.
ASRock AI BOX-A395 Packs Ryzen AI Max+ Power for Edge AI
https://www.electronics-lab.com/asrock-ai-box-a395-packs-ryzen-ai-max-power-for-edge-ai/
Compact edge system with 16-core Ryzen AI Max+, 50 TOPS NPU, up to 128GB LPDDR5X, and 10GbE for local AI workloads without discrete GPUs.
Würth Elektronik Launches Heat Sink Portfolio for Power Electronics and ICs
https://www.electronics-lab.com/wurth-elektronik-launches-heat-sink-portfolio-for-power-electronics-and-ics/
The new heat sinks target THT-TO packages and flat-surface ICs, with pre-coated thermal interface material variants available from stock.