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Seeedstudio LinkStar-H68K-1432 V2 is A Tiny Pocket Router with 2x1GbE + 2×2.5GbE ports

Posted on by Debashis Das

Seeed Studio'sSeeedstudio LinkStar-H68K-1432 router boasts 2x 1GbE, 2x 2.5GbE, Wi-Fi 6, and 4K HDMI, and supports Android 11 and open-wrt.

After the succession of LinkStar-H68K, Seed Studio has announced LinkStar-H68K-1432 V2 a pocket-sized router powered by the Rockchip RK3568 SoC. The most interesting feature of this router is that it features 2 x 1GbE and 2 x 2.5GbE ports with dual-band Wi-Fi 6 and a 4K-capable HDMI 2.0 output. Not only that it will also come with Android 11 preinstalled, so it’s more like a media server rather than a router.

The RK3568 is a Quad-core 64-bit CPU with a Cortex-A55 CPU running at 2.0GHz it also has an ARM-G52 2EE GPU with support for 4K 60FPS video output. Additionally, the device has multiple storage options! including a 32GB onboard eMMC, a microSD card slot for more, and a USB 3.0 Type-C port (now with SATA support) all these features with that 2.5GbE network connectivity make it a good NAS.

This device features improved thermal management, replacing the standard mesh finish with an integrated heat dissipation strip for better cooling. Additionally, the router now supports a wider power input voltage range of 5-24V, including convenient powering via a 5V Type-C connection.

Seeedstudio LinkStar-H68K-1432 Specifications

  • Processor: Rockchip RK3568 quad-core 64-bit Cortex-A55, up to 2.0GHz
    • GPU: ARM G52 2EE
    • NPU: 1 TOPS@INT8
  • Storage:
    • 32GB onboard eMMC
    • 1x SD card slot for storage expansion
  • NIC:
    • 2x 1G Ethernet NIC RTL8211F
    • 2x 2.5G Ethernet NIC RTL8125B
  • Wireless: Dual-band 2.4G/5G Wi-Fi 6 M7921E module
  • Video Output: 1x HDMI2.0 interface for 4K output
  • Multi-Media:
    • Supports 4K@60fps H.265/H.264/VP9 video decoding
    • Supports 1080@60fps H.265/H.264 video encoding
    • Supports 8M ISP, HDR
  • USB:
    • 1x USB 3.0 Type-A
    • 1x USB 3.0 Type-C (supports storage expansion, 5V-20V wide voltage DC input, power requirement >10W)
    • 1x USB 2.0 Type-A
  • Power Supply:
    • Supports CC line PD fast charging
    • Supports 5V-20V wide voltage DC input, power requirement >10W (12V DC interface power supply canceled)
  • Power Consumption: 7.5W (With fully loaded network port)
  • Operating Temperature: -10°C to 55°C
  • Dimensions: 80 x 60 x 40mm

The router supports OpenWRT and Armbian operating systems, enabling specialized network configurations such as VPN, game servers, print serving, and ad-blocking setups.

The LinkStar-H68K-1432 V2 is priced at $99.00 and can be purchased from the SeeedStudio website. It comes with Android 11 pre-installed, as mentioned on the product page.

Unexpected Maker NanoS3 Features ESP32-S3 in Self-proclaimed world’s smallest from factor

Posted on by Debashis Das

Unexpected Maker NANOS3 claims to be the world's smallest fully-featured ESP32-S3 module, boasting all peripherals and wireless connectivity in the size of TinyPICO Nano.

Seon Rozenblum, better known as Unexpected Maker, has recently launched what they claimed to be the world’s smallest fully-featured ESP32-S3 module it packs all the peripherals, and wireless connectivity features of an ESP32-S3 module and features the tiny package size as the original TinyPICO Nano. The board will come in two varieties one with an Onboard antenna and the other with an u.FL connector onboard making sure that it will fit your needs.

The board centers on ESP32-S3FN8, boasting 2x Xtensa LX7 cores clocked at 240MHz, alongside 1x RISC-V, 1x FSM, 512K SRAM, 8MB PSRAM, 8MB Flash, and 27 GPIO pins.

Previously we have covered many different types of development boards and display modules powered by the ESP32-S3, including Waveshare ESP32-S3 GEEK, LILYGO T4 S3, Adafruit Metro ESP32-S3, feel free to check them out if you are interested in those.

Unexpected Maker NANOS3 Specifications

  • Microcontroller
    • Espressif Systems’ ESP32-S3 with
    • Dual-core 32bit Xtensa LX7 microcontroller up to 240MHz
    • RISC-V ULP Co-processor
    • 512KB SRAM
    • 2.4GHz Wifi 4 (802.11b/g/n)
    • Bluetooth 5.0 BLE + Mesh
  • Memory: 8MB QSPI PSRAM
  • Flash: 8MB to 16MB depending on the model.
  • JTAG: Yes
  • ADC: 2x 12-bit SAR/20 chan
  • DAC: 3
  • PWM Channels: 5x TX chan, 5x RX chan
  • LED: Onboard RGB LED
  • NeoPixel Support: Yes (up to 1515 Neopixels)
  • Antenna: Onboard or External u.FL
  • Release Date: July 2023

For simplicity, the company offers a comprehensive pinout diagram to streamline the setup process. The diagram clearly showcases the pinouts for both USB and external Vin connections, making it easy to get started.

The board is completely open-sourced and a set of resources including essential files like 3D STEP files, KiCAD symbols and footprints, reference designs, PDF schematics, and high-resolution pinout reference cards for the NanoS3 board on the Unexpected Maker ESP32-S3 GitHub repository.

The NanoS3 ships with the latest version of CircuitPython that supports the ESP32-S3. It also ships with the UF2 bootloader, so you can easily update your NanoS3 with the latest CircuitPython firmware, whenever you desire.

The Unexpected Maker NANOS3  board is priced around $19.00 and can be found on their shop page.

Espressif ESP32-C5 Test Board Features Dual USB-C Port and Dual SMA Connectors

Posted on by Debashis Das

Espressif launched a Hardwear Guide for ESP32-C5 Test Board with Zigbee 3.0 and Thread 1.3, hinting at an 802.15.4-based radio integration.

Back in June 2022, Espressif unveiled the ESP32-C5, their first dual-band SoC. But since then we haven’t heard any update on that part nor has any development board been showcased, but that changed very recently as they released an official design guide for an ESP32-C5 Test Board.

When the board was first released, it was marketed only as a dual-band chip. Now, with the board out we can see that it also has support for Zigbee 3.0 and Thread 1.3, which means that the company has also included a 802.15.4-based radio within the chip.

This new board design by Espressif features two SMA connectors one for 2.5GHz and another for 5GHz radio. It also has dual USB-C ports one goes through a USB-to-UART bridge and another directly connects to the ESP32-C5 port additionally it has two 12-pin GPIO headers, Boot and Reset buttons, an RGB LED, and a 2-pin header for current measurements.

ESP32-C5 Test Board Specifications:

  • Processor: Single-core 32-bit RISC-V processor with clock speeds up to 240 MHz.
  • Memory: 400KB on-chip SRAM, 384KB on-chip ROM, and support for external flash storage.
  • Wireless Connectivity:
    • Dual-band 802.11ax WiFi 6 (2.4GHz and 5GHz) with backward compatibility for older WiFi standards (802.11b/g/n).
    • Bluetooth 5.0 LE.
    • 802.15.4 radio for Zigbee 3.0 and Thread 1.3.
  • Storage: 4MB SPI flash.
  • I/O:
    • USB Type-C port for USB Serial/JTAG (USB 2.0 full speed).
    • USB Type-C to UART port.
    • 12-pin GPIO headers (J5 and J6).
    • Boot and Reset buttons.
  • Other Highlights:
    • Power and RGB LEDs.
    • 32.768 KHz and 48 MHz crystals.
    • 5V to 3.3V DC/DC switching regulator for power efficiency.

More design details about the board can be found in the user guide provided by Espressif. At the time of writing, I couldn’t find any software details in the guide, but it’s likely to be supported by ESP-IDF. That means it will probably also be supported by the Arduino IDE. The company hasn’t made any official announcements yet, but when they do, we’ll likely see a lot of third-party boards launched at the same time.

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free IoT

Posted on by mixos

Silicon Labs’ most energy-efficient Wireless SoC to date with energy harvesting-ready capabilities

Silicon Labs, a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG22E family of Wireless SoCs, Silicon Labs’ first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E. As Silicon Labs’ most energy-efficient SoCs to date, all three SoCs will enable IoT device makers to build high-performance, Bluetooth Low Energy (LE), 802.15.4-based, or Sub-Ghz wireless devices for battery-optimized and battery-free devices that can harvest energy from external sources in their environments like indoor or outdoor ambient light, ambient radio waves, and kinetic motion.

To help device manufacturers build a complete energy harvesting solution, Silicon Labs is also announcing their partnership with e-peas, a provider of industry-leading Power Managed Integrated Circuits (PMICs) designed for energy harvesting. Through this partnership, Silicon Labs and e-peas co-developed two energy harvesting shields for Silicon Labs’ new, energy-optimized xG22E Explorer Kit. To better develop within the tight constraints that energy harvesting requires, the new xG22E Explorer Kit allows developers to customize the peripherals and debugging options that best match their application and get highly accurate measurements to better build their applications and devices with the energy harvesting shields. The energy harvesting shields are each tuned and optimized for different energy sources and energy storage technologies. They are custom-fit to slot onto the Explorer Kit. Notably, one of the shields uses e-peas’ latest AEM13920 dual-harvester, which allows it to pull energy simultaneously from two distinct energy sources, like indoor or outdoor light, thermal gradients, and electromagnetic waves without sacrificing on energy conversion efficiency. The second co-developed shield is based on e-peas’ AEM00300 shield, and is dedicated to harvesting power from random pulsed energy sources.

“As the market for energy harvesting and low-power solutions grows, Silicon Labs remains dedicated to enhancing our wireless MCU and radio stack capabilities to advance the development of battery-free IoT solutions,” said Ross Sabolcik, Senior Vice President for the Industrial and Commercial Business Unit at Silicon Labs. “Our efforts to prioritize energy efficiency and increase device longevity underscore our commitment to fostering a more sustainable IoT ecosystem.”

xG22E Designed to Address Energy Efficiency Challenges for the IoT

The evolution and widespread deployment of the Internet of Things (IoT) faces a significant challenge related to powering low-complexity, small-form-factor devices. Traditional sources like mains power or batteries pose scalability and maintenance issues. The emergence of the Ambient IoT addresses this challenge by introducing a class of connected devices primarily powered through energy harvesting from ambient sources like radio waves, light, motion, and heat.

The all new xG22E SoC, Silicon Labs’ most energy efficient SoC to date. Credit: Silicon Labs

Silicon Labs aims to build a device that can address one of the significant challenges in Ambient IoT: creating a platform that can optimize its energy consumption and prolong its lifespan. The xG22E family comes equipped with several features designed to minimize energy use and make it the platform of choice for energy harvesting, including:

  • Ultra-fast, low-energy cold start for applications starting from a zero-energy state to transmit packets and then rapidly return to sleep. An xG22E device wakes up in only eight milliseconds and uses only 150 micro-Joules, or roughly 0.003% of the energy needed to power a 60-watt equivalent LED lightbulb for one second.
  • Energy conserving deep sleep swift wake-up reduces wake-up energy by 78% compared to other Silicon Labs devices.
  • Power-efficient energy mode transition to smoothly transition in and out of energy modes by mitigating current spikes or inrush, which can harm energy storage capacity.
  • Multiple deep sleep wake-up options, such as RFSense, GPIO, and RTC wake-up sources from the deepest EM4 sleep mode, are ideal for extended storage.

Energy Harvesting Applications Enable a More Sustainable IoT

Energy harvesting and conservation technologies offer significant benefits across industries, including reduced energy costs, elimination of battery dependence, and reduced operational carbon footprint by changing energy consumption sources and minimizing battery waste. It also complements many existing IoT applications. For example, electronic shelf labels are being rapidly adopted by retailers across the globe to allow for more accurate pricing, inventory management, and even loss prevention. However, with a single location having as many as thousands of labels, they require a lot of batteries. Fortunately, electronic shelf labels do not need a lot of power, nor do they require always-on connectivity, making them an excellent fit for energy harvesting. By using Ambient IoT energy sources, retailers can reduce or eliminate their need for batteries for shelf labels. Other examples in the consumer space include television remote controls that use solar energy and movable, wireless light or appliance switches.

Silicon Labs actively supports companies developing successful low-power devices and pursuing battery-free designs, fostering an environmentally sustainable leadership within their respective fields.

To learn more about how to begin developing battery-free IoT devices using Silicon Labs, be sure to visit:

MYIR Remi Pi Features Renesas RZ/G2L SoC and Costs Just $55.00

Posted on by Debashis Das

MYIR Remi Pi, a Renesas RZ/G2L-based SBC, offers dual Gigabit Ethernet ports, dual display support, and a MIPI-CSI camera interface.

MYIR Remi Pi is a Renesas RZ/G2L-based SBC, with dual Gigabit Ethernet ports, dual display support, and a MIPI-CSI camera interface. It also features 3D graphics functions powered by Arm Mali-G31. Additionally, it features HDMI, LVDS, and MIPI-CSI for seamless connectivity with various display devices

The specific SoC that powers this SBC is called the R9A07G044L23GBG it features a dual-core ARM Cortex-A55 processor, running at speeds of up to 1.2GHz with FPU support, along with a single Arm Cortex-M33 processor clocked at up to 200MHz. The Arm Mali-G31 in the SoC is clocked to 500MHz. It also includes a video codec supporting H.264 for efficient multimedia processing across various applications.

Previously we have covered different SBCs including the Milk-V Duo S, Banana Pi BPI-M2, Radxa Zero 3W, and many others, feel free to check those out if you are looking for SBCs.

MYIR Remi Pi Specifications

  • CPU:
    • RENESAS RZ/G2L processor (R9A07G044L23GBG)
    • 1.2 GHz Dual-core ARM Cortex-A55
    • 200 MHz ARM Cortex-M33
    • 3D graphics functions (Arm Mali-G31)
    • Video codec (H.264)
  • kaMemory:
    • 1GB DDR4
  • Storage:
    • 8GB eMMC
    • 32KB EEPROM
  • PMIC (Power Management IC):
    • RAA215300
  • Communications:
    • 2 x Debug UART
    • 2 x 10/100/1000M Ethernet
    • 2 x USB2.0 Host (Type-A)
    • 1 x USB2.0 OTG (Type-C)
    • 1 x USB-UART debug interface
    • 1 x 2.4GHz/5GHz WiFi and Bluetooth 4.2 Module
    • 1 x Micro SD card slot
  • Display:
    • 1 x HDMI Display Interface
    • 1 x LVDS Display Interface
    • 1 x MIPI-CSI Camera Interface
    • 1 x Audio Input and Output Interface
  • User I/O:
    • 1 x 2.54mm 2 x 20-pin male expansion header
    • Supports GPIO/I2C/UART/SPI/CAN
  • Power supply:
    • USB power supply
  • Others:
    • 3 x Buttons (Reset, Power On/Off, User)
    • 2 x LEDs (Power indicator, System Status LED)
    • 1 x RTC Battery Holder
  • OS support:
    • Linux 5.10.83
  • Working Temp.:
    • 0~70 Celsius (commercial grade)
  • Dimensions:
    • 70mm x 120mm (6-layer PCB design)

MYIR’s SBC is Linux 5.10.83 compatible, offering configurations like myir-image-full for HMI and myir-image-core for industrial use which all can be found on their downloads page, including RT-Linux and FreeRTOS. Ubuntu and Debian support is forthcoming. The company also offers additional modules like the MY-CAM003M Camera Module and MY-LVDS070C LCD to enhance compatibility with Pi extension modules for versatile project adaptation.

The MYIR Remi Pi SBC offers detailed technical specifications and purchasing options on its website. priced at $55.00 you can get the board from their products page.

The MINIX Z100-AERO – An Intel N100-Powered Mini PC with 2.5GbE and 1GbE Ethernet Support

Posted on by Debashis Das

The MINIX Z100-AERO mini PC features Intel's N100 CPU and dual Ethernet ports, serving efficiently as a router with Untangle or OPNsense.

The MINIX Z100-AERO is a compact mini PC powered by the Intel N100 CPU, designed to serve efficiently as a router when paired with software like Untangle or OPNsense. This device stands out due to its dual Ethernet ports: a 2.5GbE port managed by the TL8125BG-CG NIC and a 1GbE port handled by the RTL8111H chip.

This mini PC supports DDR4 3200MHz SO-DIMM memory, upgradeable to 32GB, and offers storage options up to 4TB. It features the Wireless-AC 9560 module, providing Wi-Fi 5 and Bluetooth 5.1 connectivity. For high-speed data transfer, there is support for M.2 PCIe 3.0 x1 NVMe SSDs.

The device includes robust connectivity options with an HDMI 2.1 port, one DisplayPort, and a USB 3.2 Gen 2 Type-C port. Additionally, its anti-static design enhances durability, making the MINIX Z100-AERO a versatile and robust choice for various applications.

In the past, we’ve explored a variety of mini PCs similar to the MINIX Z100-AERO Mini PC,. Notable mentions include the MINIX NEO Z100-0dB, a silent mini PC, that is renowned for its silent operation, the ASUS Mini PC PL64, and the widely acclaimed Pantera Pico PC. If you are interested in mini PCs, we recommend checking out these reviews for a broader perspective on the available options.

MINIX Z100-AERO Mini PC with Cooler

MINIX Z100-AERO Mini PC Specification

  • Processor: Intel® Alder Lake-N Quad-Core N100 (Base Frequency 0.8 GHz, Max Turbo Frequency 3.40 GHz)
  • Graphics Engine: Intel® UHD Graphics
  • Display Outputs:
    • 1 x HDMI® 2.1, 3840×2160@60Hz
    • 1 x DP (4K@60Hz)
    • 1 x USB 3.2 Gen 2 Type-C (4K@60Hz)
  • Memory Slot: 1 x 260-pin DDR4 3200MHz SO-DIMM 4/8/16GB, upgradeable to 32GB Max
  • Storage: 128/256/512GB M.2 PCIe 3.0 x1 NVMe SSD, upgradeable to 4TB Max
  • Ethernet:
    • 1 x Realtek® RTL8125BG-CG for 2.5G Ethernet
    • 1 x Realtek® RTL8111H for 1G Ethernet
  • LED Indicators: LEDs for Power, LAN (Active, Status)
  • WIFI/BT: Intel® Wireless-AC 9560 Wi-Fi 5 (802.11ac), Bluetooth 5.1
  • LAN Ports: 2 x RJ45, 1G + 2.5G Dual Ethernet
  • USB-A Ports: 4 x USB 3.2 Gen 1 Type-A, support up to 5Gbps
  • USB-C Ports: 1 x USB 3.2 Gen 2 Type-C (data transfer up to 5Gbps, PD-enabled, video output up to 4K@60Hz, Audio)
  • DP Ports: 1 x DisplayPort (4K@60Hz)
  • Audio Jack: 3.5mm Mic-in and Headphone-out Combo Jack
  • Antennas: 2 x External Wi-Fi Antennas
  • Buttons:
    • 1 x Power Button
    • 1 x Clear CMOS Button (Reset BIOS)
  • BIOS: AMI EFI X64
  • Power Requirement: 12V/3A DC-IN
  • Power Consumption: 10-12W (Typical), 25-27W (Turbo)
  • Certifications: CE, FCC, RCM, RoHS
  • Form Factor: Mini PC
  • Enclosure: Plastic Housing
  • Weight: 0.8 kg
  • Dimensions: 127 x 127 x 43 mm (5″ x 5″ x 1.69″)

The Z100-AERO Mini PC is available in two versions: one with 8GB RAM and a 256GB SSD, priced at $219, currently out of stock; and another with 16GB RAM and a 512GB SSD, available for $249 on the MINIX website and Amazon. Both configurations include Windows 11 Professional.

Hailo Closes New $120 Million Funding Round and Debuts Hailo-10, A New Powerful AI Accelerator Bringing Generative AI to Edge Devices

Posted on by mixos

Hailo’s funding now exceeds $340 million as the company introduces its newest AI accelerator specifically designed to process LLMs at low power consumption for the personal computer and automotive industries, bringing generative AI to the edge.

Hailo, the pioneering chipmaker of edge artificial intelligence (AI) processors, today announced it has extended its series C fundraising round with an additional investment of $120 million. At the same time, the company announced the introduction of its innovative Hailo-10 high-performance generative AI (GenAI) accelerators that usher in an era where users can own and run GenAI applications locally without registering to cloud-based GenAI services.

The new funding round was led by current and new investors including the Zisapel family, Gil Agmon, Delek Motors, Alfred Akirov, DCLBA, Vasuki, OurCrowd, Talcar, Comasco, Automotive Equipment (AEV), and Poalim Equity. To date the company has raised more than $340 million.

“The closing of our new funding round enables us to leverage all the exciting opportunities in our pipeline, while setting the stage for our long-term future growth. Together with the introduction of our Hailo-10 GenAI accelerator, it strategically positions us to bring classic and generative AI to edge devices in ways that will significantly expand the reach and impact of this remarkable new technology,” said Hailo CEO and Co-Founder Orr Danon. “We designed Hailo-10 to seamlessly integrate GenAI capabilities into users’ daily lives, freeing users from cloud network constraints. This empowers them to utilize chatbots, copilots, and other emerging content generation tools with unparalleled flexibility and immediacy, enhancing productivity and enriching lives,” he emphasized.

Hailo-10: Generative AI at the Edge

The new Hailo-10 GenAI accelerator enables a whole spectrum of applications that maintain Hailo’s leadership in both performance-to-cost ratio and performance-to-power consumption ratio. Hailo-10 leverages the same comprehensive software suite used across the Hailo-8 AI accelerators and the Hailo-15 AI vision processors, enabling seamless integration of AI capabilities across multiple edge devices and platforms.

Enabling GenAI at the edge ensures continuous access to GenAI services, regardless of network connectivity; obviates network latency concerns, which can otherwise impact GenAI performance; promotes privacy by keeping personal information anonymized and enhances sustainability by reducing reliance on the substantial processing power of cloud data centers.

By unlocking the power of GenAI on edge devices, such as personal computers, smart vehicles, and commercial robots, Hailo-10 allows users to completely own their GenAI experiences, making them an integral part of their daily routine. Hailo accomplishes this immersive GenAI experience through a Hailo-10 architecture that supports maximum GenAI performance with minimum required power.

“As GenAI on the edge becomes immersive, the focus turns to handling large LLMs in the smallest possible power envelope — essentially less than five watts,” Danon continued.

Among popular GenAI platforms, Hailo-10 can run Llama2-7B with up to 10 tokens per second (TPS) at under 5W of power. In processing Stable Diffusion 2.1, a popular model that produces images from text prompts, Hailo-10 is rated at under 5 seconds per image in the same ultra-low power envelope.

Hailo-10 is capable of up to 40 TOPS (tera operations per second), a new performance standard for edge AI accelerators. Hailo-10 is faster and more energy efficient than integrated neural processing unit (NPU) solutions and delivers at least 2X more performance at half the power of Intel’s Core Ultra NPU, according to recently published benchmarks.

Early applications of Hailo-10 GenAI accelerators will be targeting PCs and automotive infotainment systems, empowering current and future CPUs that cannot by themselves power the chatbots, copilots, personal assistants, and speech-operated operating systems that have become standard today. Hailo will begin shipping samples of the Hailo-10 GenAI accelerator in Q2 of 2024.

“Whether users employ GenAI to automate real-time translation or summarization services, generate software code, or images and videos from text prompts, Hailo-10 lets them do it directly on their PCs or other edge systems, without straining the CPU or draining the battery,” Danon concluded.

Since its founding in Israel in 2017, Hailo has become a leading global supplier of intelligent AI chips that serves more than 300 customers around the world. The company has offices in the United States, Europe, Japan, South Korea, China, and Taiwan.

For more information about Hailo’s AI processors for edge devices, visit www.hailo.ai. Hailo will be present at the Embedded World exhibition in Nuremberg, April 9-11, Booth 126, Hall 1, and at the ISC West exhibition in Las Vegas, April 10-12, Booth #31065. To schedule a meeting with Hailo at these events visit: https://hailo.ai/company-overview/newsroom/

Digi ConnectCore MP25 SoM Features STM32MP25 SoC with 1.35 TOPS NPU in a Tiny Form Factor

Posted on by Debashis Das

Digi International debuted the ConnectCore MP25 SoM with STM32MP25 SoC, Wi-Fi 5, Bluetooth 5.2, and TSN Ethernet at Embedded World 2024.

At Embedded World 2024, Digi International unveiled the Digi ConnectCore MP25, an ultra-compact System-on-Module (SoM) powered by the STMicroelectronics STM32MP25 SoC. This module is equipped with advanced connectivity features including 802.11ac Wi-Fi 5, Bluetooth 5.2, options for cellular integration, and supports up to three Gigabit Ethernet ports with Time-Sensitive Networking (TSN). Additionally, it boasts a powerful 1.35 TOPS Neural Processing Unit (NPU) and an Image Signal Processor (ISP), enhancing its capabilities for complex IoT applications.

The Digi ConnectCore MP25 also includes interfaces for PCIe Gen2, USB 3.0, and triple CAN-FD, housed within a compact 30 x 30 mm form factor. This versatility makes it ideal for a wide range of IoT applications, from industrial automation to smart energy solutions, where performance, connectivity, and size are critical.

In previous articles, we have explored a variety of compact SoMs and development boards from STMicroelectronics, including the WeAct STM32G4, STM32H5 Discovery kit, and MicroGEA SoM among others. If you are interested in similar solutions, feel free to check out these reviews for more options in this category.

Digi ConnectCore MP25 SoM Carrier Board
Digi ConnectCore MP25 SoM Carrier Board

The company also offers a kit in which you will have access to features like HDMI, LVDS, and MIPI display options, a MIPI CSI-2 camera connector, and up to three Gigabit Ethernet ports. It also has one USB 3.0 OTG (Type-C), two USB 2.0 hosts, dual CAN-FD interfaces, and a MicroSD card socket. Expansion capabilities include a PCIe mini-card with SIM support, MikroE Click boards connector, and dual Digi XBee slots for cellular connectivity. Additional features are audio ports (microphone and headphones), user buttons, and LEDs, making it well-suited for diverse development needs.

Digi ConnectCore MP25 SoM and Specifications

  • Processor: Dual Cortex-A35 cores at 1.5GHz, with additional Cortex-M33 and Cortex-M0+ cores.
  • AI and ML: Integrated NPU delivering 1.35 TOPS and an image signal processor (ISP).
  • Wireless: Wi-Fi 5 (802.11ac), Bluetooth 5.2, and cellular integration options.
  • Memory and Storage: External memory and storage support tailored for industrial use.
  • Multimedia: Enhanced multimedia capabilities for graphics and video processing.
  • Networking: Supports Time-Sensitive Networking (TSN) and up to 3 Gigabit Ethernet ports.
  • Interfaces: Includes PCIe Gen2, USB 3.0, and 3 x CAN-FD.
  • Form Factor: Ultra-compact Digi SMTplus (30 x 30 mm).
  • Temperature Range: Industrial operating range from -40 to +85 °C

The SoM is supported by a 10-year+ longevity program and a 3-year warranty, accompanied by global technical support, ensuring long-term reliability. It features advanced security for Industry 4.0 applications and offers extensive development tools and community support, streamlining integration and enhancing innovation in various projects.

The Digi ConnectCore MP25 features a seamless cellular modem and Digi XBee® integration, supported by Digi ConnectCore® Cloud Services for remote management and OTA updates. It runs on Digi Embedded Yocto Linux with Digi TrustFence® security, and turnkey development services are available from Digi WDS to accelerate integration and deployment.

For further details, please visit the product announcement and the product page.

Olimex VGA2HDMI is an Open Source VGA to HDMI Converter Board

Posted on by Debashis Das

Olimex VGA2HDMI Converter Board built on the CV8986 IC is built for boards like CERBERUS 2100 as VGA phases out are now Available on Olimex.

Olimex has recently featured a new board named VGA2HDMI It is a VGA to HDMI  converter board that can take in VGA signals and convert them into HDMI signals. The reason it’s news is because one search will give you many HDMI to VGA converted and not the other way around.

The company announced this board because their old boards like the CERBERUS 2100, AgonLight 2, and Agon Origins boards all use A VGA connection as output and as that standard is getting obsolete the company specially designed and tested this convert to work with the old board.

Olimex is not the first company to design a VGA to HDMI converter; a quick search on Amazon search will reveal many such devices. However, the Olimex converter stands out as an excellent choice. It is competitively priced and is open-sourced, which means you can access schematics and KiCad source files directly on its product page. Additionally, more information and resources are available on its GitHub page under the reciprocal GNU General Public License 3.

The Olimex VGA to HDMI converter, built around the CV8986 IC, supports 1080p video and 24-bit audio ADC, potentially allowing audio transmission over HDMI when properly designed. The datasheet confirms these capabilities, alongside features like HDCP 1.3 and CEC 1.3 support. Curiously, it lacks a 3.5 mm audio jack. This 56-pin IC measures 7mm x 7mm, operates from -30 to 85 degrees Celsius, and includes a 32-bit Cortex M0+ core.

The company also provides an enclosed for the Board but that costs a little bit more than the original product.

Olimex VGA2HDMI Converter Specification:

  • Chipav CV8986 VGA to HDMI converter
  • VGA connector
  • HDMI connector
  • USB-C power connector
  • Dimensions – 55 x 31 mm

The Olimex VGA2HDMI board, compatible with any VGA and HDMI interfaces, is now on sale. It is priced at €15 to €17 (about $16 to $18.50) and is available through the Olimex store with an optional plastic case.

Avnet Unveils MaaXBoard OSM93: A Powerhouse for Edge AI Development

Posted on by Aditi Ambadkar

Avnet introduces the MaaXBoard OSM93, a Raspberry Pi-style semi-single-board computer designed to cater to energy-efficient edge artificial intelligence (edge AI) tasks. The board leverages the NXP i.MX 93 system-on-chip (SoC) to power its capabilities, offering a versatile platform for developers and embedded designers alike.

“The MaaXBoard OSM93 Development Kit is a great way for embedded designers to quickly evaluate and prototype both the i.MX 93 applications processor from NXP and the Avnet Embedded OSM-SF-IMX93 OSM,” highlights Jim Beneke from Avnet, emphasizing the board’s potential for high-volume applications. With its OSM-standard module and production-ready SBC form factor, the MaaXBoard suits various project scales and assembly needs efficiently.

The NXP i.MX 93 SoC boasts two Arm Cortex-A55 application-class processors clocked at up to 1.7GHz, complemented by a Cortex-M33 real-time core running at up to 250MHz. Additionally, it features an Ethos-U65 neural processing unit running at 1GHz, delivering up to 0.5 tera-operations per second (TOPS) for edge AI and machine learning tasks. The inclusion of an EdgeLock secure enclave system ensures robust security measures, making the MaaXBoard OSM93 a compelling choice for IoT applications requiring both performance and reliability.

Elsewhere on the board, users will find a robust set of features, including 2GB of LPDDR4 memory for smooth multitasking and performance, complemented by 640kB of on-chip RAM (OCRAM) for efficient data processing. Storage needs are addressed with 16GB of eMMC 5.1 storage and 16MB of QSPI NOR flash, ensuring ample space for applications and data.

Designed for energy-efficient edge AI experimentation, the MaaXBoard OSM93 opts for a very familiar footprint.

Connectivity options abound, with two USB 2.0 Type-A host ports and a USB 2.0 Type-C port for versatile peripheral connections. Display and camera interfaces include four-lane MIPI Display Serial Interface (DSI) and two-lane Camera Serial Interface (CSI) connectors, catering to diverse multimedia requirements. Network connectivity is robust with two gigabit Ethernet ports, while an M.2 E-key connector offers flexibility for optional wireless modules.

Additionally, the board features a 40-pin Raspberry Pi-style general-purpose input/output (GPIO) header, enabling easy interfacing with external devices and expansion boards. Debugging capabilities are enhanced with a JTAG debugging header, while analog input needs are met with a four-pin header. Moreover, a six-pin CAN-FD header and SAI digital audio header, combined with onboard PDM microphone sensors, further extend the board’s functionality for a wide range of applications.

Avnet has confirmed it will be showing off the MaaXBoard OSM93 at Embedded World in Nuremberg, Germany, April 9-11 at Booth 1-510; the board and module will both become generally available in the second quarter, with pricing yet to be confirmed. More information is available on the Avnet website.

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