Digi ConnectCore MP25 SoM Features STM32MP25 SoC with 1.35 TOPS NPU in a Tiny Form Factor

Digi ConnectCore MP25 SoM Features STM32MP25 SoC with 1.35 TOPS NPU in a Tiny Form Factor

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At Embedded World 2024, Digi International unveiled the Digi ConnectCore MP25, an ultra-compact System-on-Module (SoM) powered by the STMicroelectronics STM32MP25 SoC. This module is equipped with advanced connectivity features including 802.11ac Wi-Fi 5, Bluetooth 5.2, options for cellular integration, and supports up to three Gigabit Ethernet ports with Time-Sensitive Networking (TSN). Additionally, it boasts a powerful 1.35 TOPS Neural Processing Unit (NPU) and an Image Signal Processor (ISP), enhancing its capabilities for complex IoT applications.

The Digi ConnectCore MP25 also includes interfaces for PCIe Gen2, USB 3.0, and triple CAN-FD, housed within a compact 30 x 30 mm form factor. This versatility makes it ideal for a wide range of IoT applications, from industrial automation to smart energy solutions, where performance, connectivity, and size are critical.

In previous articles, we have explored a variety of compact SoMs and development boards from STMicroelectronics, including the WeAct STM32G4, STM32H5 Discovery kit, and MicroGEA SoM among others. If you are interested in similar solutions, feel free to check out these reviews for more options in this category.

Digi ConnectCore MP25 SoM Carrier Board
Digi ConnectCore MP25 SoM Carrier Board

The company also offers a kit in which you will have access to features like HDMI, LVDS, and MIPI display options, a MIPI CSI-2 camera connector, and up to three Gigabit Ethernet ports. It also has one USB 3.0 OTG (Type-C), two USB 2.0 hosts, dual CAN-FD interfaces, and a MicroSD card socket. Expansion capabilities include a PCIe mini-card with SIM support, MikroE Click boards connector, and dual Digi XBee slots for cellular connectivity. Additional features are audio ports (microphone and headphones), user buttons, and LEDs, making it well-suited for diverse development needs.

Digi ConnectCore MP25 SoM and Specifications

  • Processor: Dual Cortex-A35 cores at 1.5GHz, with additional Cortex-M33 and Cortex-M0+ cores.
  • AI and ML: Integrated NPU delivering 1.35 TOPS and an image signal processor (ISP).
  • Wireless: Wi-Fi 5 (802.11ac), Bluetooth 5.2, and cellular integration options.
  • Memory and Storage: External memory and storage support tailored for industrial use.
  • Multimedia: Enhanced multimedia capabilities for graphics and video processing.
  • Networking: Supports Time-Sensitive Networking (TSN) and up to 3 Gigabit Ethernet ports.
  • Interfaces: Includes PCIe Gen2, USB 3.0, and 3 x CAN-FD.
  • Form Factor: Ultra-compact Digi SMTplus (30 x 30 mm).
  • Temperature Range: Industrial operating range from -40 to +85 °C

The SoM is supported by a 10-year+ longevity program and a 3-year warranty, accompanied by global technical support, ensuring long-term reliability. It features advanced security for Industry 4.0 applications and offers extensive development tools and community support, streamlining integration and enhancing innovation in various projects.

The Digi ConnectCore MP25 features a seamless cellular modem and Digi XBee® integration, supported by Digi ConnectCore® Cloud Services for remote management and OTA updates. It runs on Digi Embedded Yocto Linux with Digi TrustFence® security, and turnkey development services are available from Digi WDS to accelerate integration and deployment.

For further details, please visit the product announcement and the product page.

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About Debashis Das

Tech Content Creator | Hardware Design Engineer | IoT Enthusiast | Digital Storyteller | Video Creator | From crafting digital dialogues at Semicon Media to orchestrating online engagement at Electronics-lab.com, my journey is about making tech talk interesting and accessible. In the quiet corners of the day, I advocate for easier tech education, one tutorial at a time. Let's connect and keep the digital dialogue going!

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