Dual 105mW Headphone Amplifier with Digital Volume Control and Shutdown Mode
https://www.electronics-lab.com/project/dual-105mw-headphone-amplifier-with-digital-volume-control-and-shutdown-mode/
This is a low noise Headphone Amplifier capable of delivering 105mW per channel of continuous average power into a 16Ω load with 0.1% (THD+N) from a 5V power supply. The project is based on the LM4811 chip from the boomer series. The board provides high-quality output power with a minimal number of external components. It […]
Dual Variable – Reluctance Sensor Interface Module – Stepper Motor Based Incremental Rotary Encoder
https://www.electronics-lab.com/project/dual-variable-reluctance-sensor-interface-module-stepper-motor-based-incremental-rotary-encoder/
This project offers a dual−channel low component count interface solution for ground-referenced variable reluctance sensors. Each of the two identical channels interfaces with a variable−reluctance sensor, and continuously compares the sensor output signal to a user−programmable internal reference. An alternating input signal of appropriate amplitude at IN1 or IN2 will result in a rectangular waveform […]
High Performance – High Reliability 50V DC Brush Motor Driver
https://www.electronics-lab.com/project/high-performance-high-reliability-50v-dc-brush-motor-driver/
This is a powerful yet small size low profile brushed DC motor drive system with a few key features like adjustable constant current control, direction control, brake controls, Alert output, PWM for speed control etc. BD63130AFM chip is the heart of the project which is an H-bridge motor driver for the DC brush motor. This […]
Enhanced AI Learning With ST’s Latest ISM330ISN Inertial Sensor
https://www.electronics-lab.com/enhanced-ai-learning-with-sts-latest-ism330isn-inertial-sensor/
The global semiconductor giant STMicroelectronics has simplified interaction with trained devices with its new inertial sensor ISM330ISN featuring an Intelligent Sensor Processing Unit (ISPU). ISPU is essentially a low-power, high-performance programmable core with high computational efficiency. As a result, this processor will be able to execute the signal processing and AI algorithms in real-time. Before […]
Smart Video ADK with exteded battery life
https://www.electronics-lab.com/smart-video-adk-with-exteded-battery-life/
Specialist in extreme low-power wireless IoT modules and a fabless semiconductor company, InnoPhase has announced its partnership with Ingenic Semiconductor Co Ltd. which is known to be superior in the world of microprocessors and CPU technologies. The primary aim of this partnership is to jointly market AI-vision systems. This remarkable collaboration has launched its Smart […]
New FSM-IMX547 Camera Kit from FRAMOS Demonstrates the Capabilities of SLVS-EC on AMD-Xilinx Kria KR260 Robotics Starter Kit
https://www.electronics-lab.com/new-fsm-imx547-camera-kit-from-framos-demonstrates-the-capabilities-of-slvs-ec-on-amd-xilinx-kria-kr260-robotics-starter-kit/
Since machine vision is increasingly becoming important in the field of robotics development, several top-level companies in the robotic industry are taking interest in projects that aid the rapid development of hardware-accelerated applications for robotics, machine vision, and communication and control. AMD-Xilinx recently designed the Kria KR260 Robotics Starter kit for robotics and industrial applications, […]
Brookman Technology develops a three-dimensional range image sensor for up to 30 meters
https://www.electronics-lab.com/brookman-technology-develops-a-three-dimensional-range-image-sensor-for-up-to-30-meters/
Japanese communications and embedded device manufacturer, Brookman Technology, collaborated on using a hybrid Time-of-Flight method developed by Prof. Shoji Kawahito of Shizuoka University. The collaboration has led to the (as claimed) “world’s first” next-generation 3D Time-of-Flight (ToF) distance sensor, which is capable of operating over a distance of up to 30 meters. This sensor is […]
First RISC-V-based SoC FPGA enters mass production with a smaller thermal footprint
https://www.electronics-lab.com/first-risc-v-based-soc-fpga-enters-mass-production-with-a-smaller-thermal-footprint/
Microchip Technology has announced the first system-on-chip Field Programmable Gate Array (FPGA), MPFS250T, based on the open-standard RISC-V instruction set architecture to enter mass production. The news comes as the continued adoption of PolarFire SoC FPGA and exponential growth for the Mi-V ecosystem streamline RISC-V adoption across various industrial, IoT, and edge computing embedded devices. […]
SONOFF POW Elite enables Smart Power Consumption
https://www.electronics-lab.com/sonoff-pow-elite-enables-smart-power-consumption/
The SONOFF POW Elite is a smart meter switch that tracks the real-time power consumption of an appliance. This smart monitoring device aims to serve household appliances. It can withstand a maximum load of 20A to monitor the power consumption in an entire room. Driven with the new dual-core ESP32 chip offering 300 % more […]
Maxim Integrated DS28E30 1-Wire® ECDSA Secure Authenticator
https://www.electronics-lab.com/maxim-integrated-ds28e30-1-wire-ecdsa-secure-authenticator/
Maxim Integrated DS28E30 1-Wire® ECDSA Secure Authenticator is a cryptographic-based authentication solution that provides a root-of-trust to detect and prevent counterfeit products and to enable secure use management of limited life peripherals. The DS28E30 provides a highly secure and easily deployed turnkey authentication solution based on the FIPS-186 ECDSA standard. The DS28E30 combines ECDSA challenge and […]