Google OpenTitan and Microsoft Pluton create the Future of Security Chips

Before talking about OpenTitan and Microsoft Pluton – two security chips by two tech giants, let’s have an overview of what security chips actually are.

Today, the hardware-level security of an operating system is an extremely important matter and is taken very seriously by manufacturers. The core security of an operating system depends on a chip separate from the CPU. This chip is called TPM or Trusted Platform Module. TPM stores various keys and other sensitive information that saves the integrity of the entire system. Security chips are also used in embedded platforms where security is the utmost priority. A good example is IoT based smart home control system. If an attacker gets access to the secure keys of various APIs used for controlling “things” remotely, they can do anything. So, these types of keys are stored in TPM.

Silicon Root of Trust (RoT) chips can provide many security benefits by helping to:

  • Ensure that a server or a device boots up with the correct firmware and hasn’t been infected by low-level malware.
  • Provide a cryptographically unique machine identity, so an operator can verify that a server or a device is legitimate.
  • Protect secrets like encryption keys in a tamper-resistant way even for people with physical access (e.g., while a server or a device is being shipped).
  • Provide authoritative, tamper-evident audit records and other runtime security services.

Google OpenTitan

OpenTitan is the first open-source project building a transparent, high-quality reference design and integration guidelines for silicon root of trust (RoT) chips (such as TPMs). The main goal of OpenTitan is to make the silicon RoT design and implementation more transparent, trustworthy, and secure for enterprises, platform providers, and chip manufacturers. Big companies like Western Digital, Seagate, Nuvoton, etc. are partnering with Google in this project.

OpenTitan being open-source, Root of Trust chip designers can embed this in their design with little or no legal complexities. Also, numerous talented developers can contribute to this project and raise the security standard. Open-source silicon can enhance trust and security by design and implementation transparency. problems can be detected early, and bugs can be fixed. This will also provide implementation choices and preserve a set of common interfaces.

As per google, The OpenTitan project follows three key principles:

  • Transparency – anyone can inspect, evaluate, and contribute to OpenTitan’s design and documentation to help build more transparent, trustworthy silicon RoT for all.
  • High quality – we are building a high-quality logically-secure silicon design, including reference firmware, verification collateral, and technical documentation.
  • Flexibility – adopters can reduce costs and reach more customers by using a vendor- and platform-agnostic silicon RoT design that can be integrated into data center servers, storage, peripherals, and other devices.

The following image shows the key differences between a traditional RoT design and OpenTitan:

Traditional vs OpenTitan
Traditional vs OpenTitan

Microsoft Pluton

Even though TPM is the most commonly used RoT, there is one big problem – TPM lives outside of the main processor. An attacker with physical access to the computer can use a logic analyzer to steal information from the bus interface between the security processor and the main CPU. They can also modify the information using sophisticated attack techniques. So, with Pluton, Microsoft removes the potential for that communication channel to be attacked by building security directly into the CPU. In this way, it is almost impossible to tap the communication channel between the RoT and the CPU. Pluton is designed in collaboration with leading silicon partners AMD, Intel, and Qualcomm Technologies, Inc. So, processors made by these chip-designers will have Pluton security chip built-in.

Windows PCs using the Pluton architecture will first emulate a TPM that works with the existing TPM specs and APIs. This will enable customers to benefit from enhanced security for Windows features that rely on TPMs like BitLocker and System Guard. Even when an attacker has installed low-level malware or has physical access to the hardware, the secure information stored in Pluton cannot be removed. This is achieved by storing sensitive data like encryption keys securely within the Pluton processor, which is isolated from the rest of the system.

Microsoft Pluton
Microsoft Pluton

Conclusion

OpenTitan and Pluton have the same goal but with different philosophies. Both want to improve Root of Trust but google focuses to design an open standard for RoT design while Microsoft targets to embed RoT into the CPU to enhance Windows security. Both of them have the potential to be the future of security chips. Till now, neither OpenTitan nor Pluton has announced any specific processor that features either of them. Also, there’s is no release date available.

image source: depositphotos.com

GaN is as Easy to Use as Silicon: EPC Introduces a 48 V to 12 V Demo Board

EPC announces the availability of the EPC9157, a 300 W DC-DC demo board in the tiny 1/16th brick size, measuring just 33 mm x 22.9 mm x 9mm (1.3 x 0.9 x 0.35 in). The EPC9157 demo board integrates the Renesas ISL81806 80 V dual synchronous buck controller with the latest-generation EPC2218 eGaN FETs from EPC to achieve greater than 95% efficiency for 48 V input to 12 V regulated output conversion at 25 A. 

Brick DC-DC converters are widely used in data center, computing, telecommunication and automotive applications, converting a nominal 48 V to a nominal 12 V distribution bus, among other output voltages. The main trend has been towards higher power density. eGaN® FETs provide the fast switching, high efficiency and small size that can meet the stringent power density requirements of these leading-edge applications. EPC2218 is the smallest high efficiency 100 V eGAN FET on the market.

Renesas’ ISL81806 is the industry’s first 80V dual-output or two-phase synchronous buck controller with integrated GaN drivers, supporting switching frequencies up to 2 MHz. It uses peak current mode control and generates two independent outputs, or one output with two interleaved phases. It supports current sharing, synchronization for paralleling more controllers and/or more phases, enhanced light load efficiency, and low shutdown current. Protection features include input UVLO, over current, over voltage and over temperature. The ISL81806 can directly drive EPC GaN FETs, ensuring easy design, low component count and low solution cost. The highly integrated ISL81806 reduces BOM cost for GaN solutions because it does not require any microcontroller, current sense amplifiers, or housekeeping power.

Alex Lidow, CEO of EPC commented,

“Renesas’ synchronous buck controller IC makes using GaN even easier. We are delighted to work with Renesas to combine the benefits of its advanced controllers with the performance of GaN to provide customers with a low component-count solution that increases efficiency and power density and reduces system cost for 48 V power conversion.”

“The ISL81806 takes full advantage of the high performance of GaN FETs for high-power-density solutions while reducing BOM costs. It makes designing with GaN FETs as simple as using silicon-based FETs,” said Philip Chesley, Vice President, Industrial and Communications Business Division at Renesas. “We are excited to work alongside EPC to provide our customers with the latest in power conversion technology.”

More information is available at www.renesas.com/isl81806

3D printed liquid cooled heatsinks cool down TO-247 transistors

Standard Transistor Cooler Made by 3D-printing using SLM (Selective Laser Melting) A very effective way to dissipate the high heat flux densities of electronic power modules or power devices with high power density is the use of micro-coolers or micro-channel heat sinks made by SML. These active small cooling elements can transmit up to 1000 W/mm².Besides a design for the often used TO-247 housings, all other housing types are available. Even customized designs in other shapes and thicknesses are possible

The coolers are produced by SLM procedure, the Selective Laser Melting. The procedure is also known as LPBF (Laser Powder Bed Fusion).IQ evolution refined this 3D-metal-printing process over more than 10 years, especially to the requirements of building microstructures. Rapid Prototyping and completed mass production are both efficiently producible with this technology. For more information about the the3D-printing process please use our download-center: http://iq-evolution.com/downloads_de/

more information: www.iq-evolution.com & https://eepower.com/technical-articles/innovating-3d-printed-liquid-cooled-heatsinks/

XD6506 – 6.0V 150mA Ultra Low Power LDO Voltage Regulator

The XD6506 is a Voltage Regulator with ultra-low quiescent current, optimized for automotive applications. Consuming an incredibly low 0.8μA the XD6506 is the ideal choice for applications that require continuous, always ON operation. Furthermore, the CE function also allows the output of the regulator to be turned off, resulting in greatly reduced power consumption in standby mode.

The output voltage is selectable in 0.1V increments within the range of 1.2V to 5V using laser trimming technologies. The series is also compatible with low ESR ceramic capacitors, which give added output stability and the current limiter’s fold-back circuit also operates as short circuit protection for the output current limiter and the output pin.

The XD6506 is readily available in the industry-standard SOT25 package.

Key features

  • Low Power Consumption 0.8μA (typ.)
  • Stand-by Current less than 0.1μA
  • 150 mA Maximum Output Current
  • Small 0.1µF Ceramic Capacitors
  • AEC-Q100 qualified (-40 ˚C ~ +105 ˚C)

Key benefits

  • Ultra-low Quiescent Current
    • 0.8μA typ., 1.6μA max (-40ºC≤Ta≤105ºC)
  • Low Standby Current
    • 0.01μA typ., 0.3μA max (-40ºC≤Ta≤105ºC)

more information: https://www.torexsemi.com/file/xd6506/XD6506.pdf

Sensirion SEK-SCD41 CO2 Sensor Evaluation Kit

Sensirion SEK-SCD41 CO2 Sensor Evaluation Kit enables easy plug and play evaluation of the miniaturized SCD4x sensors and facilitates prototyping. Electrical interfacing can be realized either via the through-hole pads or alternatively via the included jumper cable that connects to the integrated JST connector. The compact design measuring 28mm x 24mm x 8mm, the large supply voltage range (2.4V to 5.5V), and the mounting holes allow versatile prototyping.

The SCD4x Miniature CO2 sensors build on the photoacoustic sensing principle and Sensirion’s patented PASens® and CMOSens® technology to offer high accuracy at an unmatched price in a small form factor. SMD assembly allows cost- and space-effective integration of the sensor combined with maximal freedom of design.

Features

  • Development board with SCD41 CO2 sensor
  • Plug and play sensor evaluation
  • Includes jumper cable for simple prototyping
  • 28mm x 24mm x 8mm compact design
  • Mounting holes for easy integration
  • 2.4V to 5.5V supply voltage range

more information: https://www.sensirion.com/en/environmental-sensors/evaluation-kit-sek-environmental-sensing/evaluation-kit-sek-scd41/

Maxim Integrated MAX38650 nanoPower Buck Converter

Maxim Integrated MAX38650 nanoPower Buck Converter provides an ultra-low 390nA quiescent current and operates from a 1.8V to 5.5V input voltage. The MAX38650 supports load currents of up to 100mA with peak efficiencies of 95%. The MAX38650 offers high efficiency throughout the load range with a small total solution size. The device is ideal for battery applications where extended battery life is required.

The Maxim MAX38650 nanoPower Buck Converter supports 100% duty cycle operation allowing seamless transition as battery discharges and falls below the target output voltage. The MAX38650 utilizes a unique control scheme that allows ultra-low quiescent current and high efficiency over a wide output current range.

The MAX38650 Converter is offered in a space-saving, 1.58mm x 0.89mm, 6-pin wafer-level package (WLP) (2 x 3 bumps, 0.4mm pitch), and is specified over the -40°C to +125°C operating temperature range.

Features

  • Extends battery life
    • 390nA Ultra-low quiescent supply current
    • 5nA Shutdown current
    • 95% Peak efficiency and over 85% at 10µA
  • Easy to use addresses popular operation
    • 1.8V to 5.5V Input Range
    • Single resistor-adjustable VOUT from 1.2V to 3.3V (MAX38650A)
    • Preprogrammed VOUT from 1.2V to 5V (MAX38650B) in steps of 50mV
    • 100% Duty cycle mode for low dropout operation
    • ±1.5% Output voltage accuracy
    • 100mA Load current
  • Protects system in multiple use cases
    • Reverse-current blocking in shutdown
    • Active discharge feature
  • Reduces size and increases reliability
    • -40°C to +125°C Operating temperature range
    • 1.58mm x 0.89mm, 0.4mm pitch, 6-pin (2 x 3) WLP

Application schematic

more information: https://www.mouser.com/catalog/specsheets/Maxim_01282021_MAX38650%20DS.pdf

Maxim Integrated MAX38911 LDO Linear Regulators

Maxim Integrated MAX38911 LDO Linear Regulators with low-power mode deliver up to a 500mA load current with only 11µVRMS of output noise from 10Hz to 100kHz.

The Maxim MAX38911 Regulators are set to have a single output voltage range of 0.8V to 5.0V. The output voltage on the MAX38912 is adjustable to a value range of 0.8V to 5.0V by using two external feedback resistors. The LDO Linear Regulators have protection features that provide programmable inrush current limiting, output overcurrent limiting, reverse current limiting, and thermal overload protection.

The MAX38911 is available in a 1.42mm x 0.83mm, 3 x 2, 6-bump, 0.4mm pitch WLP.

Features

  • Deliver wide, flexible operating range
    • 1.7V to 5.5V Input supply range
    • 0.8V to 5.0V Output voltage range
    • 500mA Maximum output current
    • 24.3mV Dropout at 500mA load and 5.0V input voltage
    • 19.2µA No-load supply current in low-power mode
    • 332µA Supply current in normal mode
    • <1µA Shutdown supply current
  • Reduce noise and improve accuracy
    • 11µVRMS output noise, 10Hz to 100kHz
    • 70dB PSRR at 10kHz, 250mA load current, and 300mV input and output voltage separation
    • ±1% DC accuracy over load, line, and temperature variations
  • Enable ease-of-use and robust protection
    • Stable with 2µF (minimum effective) output capacitance
    • Programmable soft-start rate
    • Overcurrent and overtemperature protection
    • Reverse-current protection
    • Power-OK output
  • Reduce size and improve reliability
    • 1.42mm x 0.83mm, 3 x 2, 6-Bump, 0.4mm pitch WLP
    • 2mm x 2mm, 8-pin TDFN package
    • -40°C to +125°C Operating temperature

Application Schematic

more information: https://datasheets.maximintegrated.com/en/ds/MAX38911.pdf

100V High-Current Photorelay Released in DIP4 Package for Industrial Equipment

Toshiba Electronics has released a 100 V high-current photorelay, TLP241B for industrial equipment building automation systems and mechanical relay replacements, security systems, heating, ventilation and air conditioning (HVAC), Battery Management System (BMS), etc. Encompassed in a DIP4 package, this new device comprises of a photo MOSFET optically coupled to an infrared light-emitting diode.

The ability of TLP241B photorelay to provide an isolation voltage of 5000 Vrms makes it ideal for applications that require reinforced insulation. The device can help extend, the OFF-state output terminal voltage extended to 100V which is a 150% improvement from the 40V of TLP241A. Moreover, it can deliver 100V OFF-state output terminal voltage, 2A ON-state current, and 5kV isolation voltage.

TLP241B can replace a 1-Form-A contact mechanical relay and unlike mechanical relays, it has no moving contacts to degrade. The low current drive feature helps improve the product’s life. Speedier response time and PCB space-saving due to smaller package size are its additional features. The maximum operating temperature rating of the device is 110℃, therefore; it is easy to obtain temperature design margins of equipment.

Key Features of TLP241B Photorelay

  • High ON-state current rating: ION=2A, IONP=6A (Pulsed)
  • OFF-state output terminal voltage rating: VOFF=100V
  • High operating temperature rating: Topr max=110℃
  • General-purpose DIP4 package with gull-wing option (SMT) available
  • Trigger LED current: 3 mA (max)
  • ON-state current: 2.0 A (max)
  • ON-state resistance: 200 m Ω
  • Isolation voltage: 5000 Vrms (min)

more information: https://toshiba.semicon-storage.com/ap-en/semiconductor/product/optoelectronics/photorelay-mosfet-output/detail.TLP241B.html

Bourns MF-MSHT PTC Resettable Fuses

Bourns MF-MSHT PTC Resettable Fuses are AEC-Q200 compliant and feature a 9V to 42V voltage range and up to 1.75A current rating. The MF-MSHT series offers a broader standard high-temperature PPTC for engineers with high working temperature and power rating requirements. These fuses utilize Bourns’ innovative freeXpansion™ design, increasing the performance of the resettable fuse with smaller footprints, improved resistance stability, and higher hold current ratings. Bourns MF-MSHT PTC Resettable Fuses are ideal for overcurrent surge protection of electronic equipment and robust resettable fault protection for industrial transportation.

Features

  • High power ratings with higher hold currents at elevated temperatures
  • -40°C to +125°C operating temperature range
  • Low thermal derating factor
  • Standard 1812 footprint size
  • Compliant with AEC-Q200 Rev-D stress test qualification
  • Surface-mount packaging for automated assembly
  • cUL and TÜV recognized
  • RoHS compliant

more information: https://gr.mouser.com/Search/Refine?Ntk=P_MarCom&Ntt=106696463

Panasonic Industrial Devices AQV209Gx PhotoMOS Relays

Panasonic Industrial Devices AQV209Gx PhotoMOS Relays are DIP 6-pin type with 1200V load voltage and low on-resistance of typical 1Ω. These PhotoMOS relays operate at 0.75A continuous load current. The AQV209Gx PhotoMOS relays are PCB mount relays with HF 1 Form A high capacity. These relays are capable to switch high voltage loads. The AQV209Gx relays offer a suitable substitution for replacing reed and mercury relays. Additionally, these relays offer high load switching for both industrial and test equipment environments. These relays are suitable for measuring equipment, testing equipment, and industrial equipment.

Specifications

  • 1200V (peak AC) load voltage
  • 1Ω (typical) on resistance
  • 0.75A continuous load current (A connection: Peak AC, DC)
  • DIP 6-pin/1 Form A package/output configuration

more information: https://na.industrial.panasonic.com/

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