Cambridge GaN devices launched second series of its ICeGaN 650 V Gallium Nitride HEMT family
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Cambridge GaN devices launched second series of its ICeGaN 650 V Gallium Nitride HEMT family

Second series of ICeGaN 650 V Gallium Nitride HEMT family deliver best-in-class robustness, Ease-Of-Use & high efficiency Cambridge GaN Devices launched the second series of its ICeGaN 650 V gallium nitride HEMT family, delivering industry-leading robustness, ease-of-use and...

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Audio Pioneer xMEMS Announces General Availability of the World’s Only All-Silicon, Solid-State FidelityTM Micro Speakers
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Audio Pioneer xMEMS Announces General Availability of the World’s Only All-Silicon, Solid-State FidelityTM Micro Speakers

xMEMS Labs, pioneers in Solid-State Fidelity, today announced the general availability of three revolutionary solutions for immediate integration into next-generation true wireless (TWS) earphones, in-ear-monitors (IEMs), digital hearing aids, and other emerging personal audio...

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Thermal Cutoff Overtemperature (TCO) Protection Devices – AD & SD Series
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Thermal Cutoff Overtemperature (TCO) Protection Devices – AD & SD Series

Bourns' TCO mini-breaker devices are tested to AEC-Q200-listed stress tests AD and SD series resettable miniature thermal cutoff (TCO) mini-breaker devices from Bourns, Inc. are the first TCO devices tested by Bourns to AEC-Q200-listed stress tests. The AD and SD series’ advanced...

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Discover LEMO’s new 12G-SDI 4K Ultra High Definition transmission push-pull connectors
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Discover LEMO’s new 12G-SDI 4K Ultra High Definition transmission push-pull connectors

LEMO is thrilled to announce the expansion of its field-proven S Series push-pull connectors with the new 1S.275 Series for 12G-SDI (Serial Digital Interface) 4K Ultra High Definition transmission. The new robust push-pull connectors are compliant with the SMPTE ST 2082-1 standard for...

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Fischer Connectors enhances IIoT connectivity with ultra-rugged solutions using Single Pair Ethernet and USB 3.2 protocols
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Fischer Connectors enhances IIoT connectivity with ultra-rugged solutions using Single Pair Ethernet and USB 3.2 protocols

Fischer Connectors, the Swiss-based global leader in high-performance connectivity, releases ultra-robust Single Pair Ethernet (SPE) and USB 3.2 Gen 2 connectivity solutions to meet the specific requirements of Industrial Internet of Things (IIoT) applications in rugged...

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MOSFET optimized for small, thin devices
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MOSFET optimized for small, thin devices

Rohm has introduced a high-efficiency 20-V N-channel MOSFET, targeting small, thin devices including smartphones, wearables, and hearables. Rohm Semiconductor has developed a compact, high-efficiency 20-V N-channel MOSFET in a DSN1006-3 WLCSP (1.0 × 0.6 mm) package, delivering...

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CUI Devices Introduces Ultra-Compact 3 x 2 mm Tactile Switch
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CUI Devices Introduces Ultra-Compact 3 x 2 mm Tactile Switch

CUI Devices’ Switches Group today announced the introduction of one of the industry’s smallest tactile switches. Housed in an ultra-compact 3 x 2 x 0.6 mm package, the TS19 series carries an IP67 rating for dealing with moisture and environmental contaminants as well as a rugged...

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Meet the Tiny 0.5mAh Rechargeable 3D Solid State Batteries from ITEN
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Meet the Tiny 0.5mAh Rechargeable 3D Solid State Batteries from ITEN

ITEN, the specialist in the manufacturing and selling of energy and power solutions, has unveiled a really tiny battery that may soon replace non-rechargeable batteries found in most electronic designs — something that could solve the power supply issues in many different use...

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