Geniatech AIM-B2 Edge AI Module Delivers 40 TOPS with PCIe Gen4
https://www.electronics-lab.com/geniatech-aim-b2-edge-ai-module-delivers-40-tops-with-pcie-gen4/
Powered by the Kinara Ara-2 processor, the AIM-B2 supports LLaMA 2, Stable Diffusion, and PCIe Gen4 connectivity in a 12W module.
Geniatech AIM-M-K AI Accelerator Brings 40 TOPS AI to M.2 Edge Systems
https://www.electronics-lab.com/geniatech-aim-m-k-ai-accelerator-brings-40-tops-ai-to-m-2-edge-systems/
Geniatech AIM-M-K is an M.2 AI accelerator with NXP Ara-240 NPU, 40 TOPS performance, and support for LLMs and vision AI workloads.
Forlinx FAI-ARA240-M M.2 AI Accelerator Delivers 40 eTOPS
https://www.electronics-lab.com/forlinx-fai-ara240-m-m-2-ai-accelerator-delivers-40-etops/
Forlinx Embedded launches an M.2 AI module with NXP Ara240, 16GB RAM, and PCIe Gen4, enabling high-throughput edge AI and Llama2-7B inference at 14 tokens/s.
Radxa AICore DX-M1M Edge AI Acceleration Module Hits 25 TOPS
https://www.electronics-lab.com/radxa-aicore-dx-m1m-edge-ai-acceleration-module-hits-25-tops/
Compact Radxa module with DeepX NPU delivers 25 TOPS at 3W for efficient edge AI workloads.
Cadence’s Tensilica HiFi iQ DSP Features Voice AI and Audio Processing
https://www.electronics-lab.com/cadences-tensilica-hifi-iq-dsp-features-voice-ai-and-audio-processing/
The new DSP IP core improves AI and audio performance with FP8/BF16 support, enhanced SIMD processing, and lower power consumption for voice-enabled embedded systems.
HBM4 Is Here: Samsung Begins Mass Production of Commercial Units
https://www.electronics-lab.com/hbm4-is-here-samsung-begins-mass-production-of-commercial-units/
The high-bandwidth memory 4 (HBM4) delivers consistent 11.7 Gbps transfer speeds on its 1c DRAM process node with a 4 nm logic base die.
ASUS UGen300 Βrings Hailo-10H Εdge AI Αcceleration Οver USB-C
https://www.electronics-lab.com/asus-ugen300-%ce%b2rings-hailo-10h-%ce%b5dge-ai-%ce%b1cceleration-%ce%bfver-usb-c/
The ASUS UGen300 is a USB AI accelerator with Hailo-10H, 40 TOPS performance, and 8GB memory, enabling plug-and-play edge inference on Linux, Windows, and Android systems.
SECO Rolls Out COM Express Type 6 Module for Mission-Critical Designs
https://www.electronics-lab.com/seco-rolls-out-com-express-type-6-module-for-mission-critical-designs/
The new COM is powered by Intel Core Ultra Series 3 processors, delivers up to 180 platform TOPS AI acceleration, and features industrial-grade specifications for next-generation embedded applications.
Exclusive Interview: How DRAM Volatility is Redefining Edge AI
https://www.electronics-lab.com/exclusive-interview-how-dram-volatility-is-redefining-edge-ai-architecture/
In this Electronics-Lab exclusive, Hailo CTO Avi Baum explains how rising costs are driving a pivot to efficient, low-memory models and dedicated accelerators.
A Raspberry Pi-like RISC-V SBC with an NPU and Ubuntu 24.04 support
https://www.electronics-lab.com/a-raspberry-pi-like-risc-v-sbc-with-an-npu-and-ubuntu-24-04-support/
Canonical and ESWIN's EBC77 is a Raspberry Pi-sized RISC-V SBC with a 20-TOPS NPU. It runs Ubuntu 24.04 LTS and has a SiFive P550 SoC.