CES 2026: Intel Panther Lake-H Powers Vecow TGS-2000 Stackable Edge AI PCs
https://www.electronics-lab.com/ces-2026-intel-panther-lake-h-powers-vecow-tgs-2000-stackable-edge-ai-pcs/
Vecow’s compact TGS-2000 series uses Intel Core Ultra Series 3 Panther Lake-H CPUs to deliver up to 100 TOPS AI performance for industrial edge applications.
Youyeetoo K1 – A Palm-Sized x86 Edge AI SBC with Intel N100 SoC
https://www.electronics-lab.com/youyeetoo-k1-a-palm-sized-x86-edge-ai-sbc-with-intel-n100-soc/
The Youyeetoo K1 is an ultra-compact x86 Edge AI SBC with an Intel N100 CPU, dual 4K HDMI, dual GbE, M.2 NVMe/SATA, LPDDR5, and various industrial I/O
Congatec Introduces Rugged COM Express Compact Module for Edge Applications
https://www.electronics-lab.com/congatec-introduces-rugged-com-express-compact-module-for-edge-applications/
The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer a -40 to 85°C industrial-grade temperature range.
Toradex Luna Is a “Pro Consumer” Edge AI SBC with Synaptics SL1680 SoC
https://www.electronics-lab.com/toradex-luna-is-a-pro-consumer-edge-ai-sbc-with-synaptics-sl1680-soc/
Toradex Luna SL1680 is a pro-consumer SBC with a quad-core Cortex-A73 SoC, 7.9 TOPS NPU, Pi-like I/O, and Torizon Linux for Edge AI applications.
AMD Announces Ryzen AI Embedded P100 and X100 Series Processors
https://www.electronics-lab.com/amd-announces-ryzen-ai-embedded-p100-and-x100-series-processors/
The new processors combine Zen 5 CPU cores, AMD RDNA 3.5 GPU, and AMD XDNA 2 NPU to power AI-driven automotive and industrial applications at the edge.
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
https://www.electronics-lab.com/innodisk-teams-up-with-qualcomm-develops-com-hpc-mini-module/
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with wide-temperature operation for industrial edge applications.
Banana Pi BPI-SM9 16-ENC-A3 SoM Features SOPHGO BM1688 AI SOC
https://www.electronics-lab.com/banana-pi-bpi-sm9-16-enc-a3-som-features-sophgo-bm1688-ai-soc/
The BPI-SM9 16-ENC-A3 pairs the BM1688 AI chip with multimedia and I/O for multi-stream video analytics and edge AI applications.
CES 2026: Qualcomm Debuts Next-Gen Dragonwing Q-Series Processors
https://www.electronics-lab.com/ces-2026-qualcomm-debuts-next-gen-dragonwing-q-series-processors/
The new Dragonwing Q-8750 and Q-7790 processors feature on-device AI, enhanced multimedia capabilities, and high-performance processing to advance consumer and industrial edge devices.
SECO Rolls Out COM Express Type 6 Module for Mission-Critical Designs
https://www.electronics-lab.com/seco-rolls-out-com-express-type-6-module-for-mission-critical-designs/
The new COM is powered by Intel Core Ultra Series 3 processors, delivers up to 180 platform TOPS AI acceleration, and features industrial-grade specifications for next-generation embedded applications.
NestDisk – An Intel N150 NAS Come Mini PC With Four M.2 Slots and Dual 2.5GbE LAN
https://www.electronics-lab.com/nestdisk-an-intel-n150-nas-come-mini-pc-with-four-m-2-slots-and-dual-2-5gbe-lan/
The Intel N150–powered NestDisk is a compact mini PC and NAS with four M.2 PCIe slots, dual 2.5GbE networking, Wi-Fi 6, and support for Linux and Windows.