SolidRun’s Fanless Industrial PCs Feature AMD Ryzen AI 300 Mobile AI SoC
https://www.electronics-lab.com/solidruns-fanless-industrial-pcs-feature-amd-ryzen-ai-300-mobile-ai-soc/
SolidRun has expanded its modular IPC lineup with the Bedrock RAI300, powered by AMD Ryzen AI 300 processors, targeting edge AI inference with higher NPU performance and fanless cooling.
Advantech 3.5-Inch SBC Features Qualcomm QCS6490 or QCS5430 SoC For Edge AI
https://www.electronics-lab.com/advantech-3-5-inch-sbc-features-qualcomm-qcs6490-or-qcs5430-soc-for-edge-ai/
The Advantech MIO-5355 is an industrial 3.5-inch SBC using Qualcomm QCS6490 or QCS5430 SoCs, offering LPDDR5 memory, rich I/O, edge AI acceleration, and long-term OS support.
AMD Launches Ryzen AI Embedded P100 and X100 With Up to 50 TOPS AI Power
https://www.electronics-lab.com/amd-launches-ryzen-ai-embedded-p100-and-x100-with-up-to-50-tops-ai-power/
AMD is bringing its "Ryzen AI" branding to the embedded sector, with Zen 5 CPUs, RDNA 3.5 graphics, and an XDNA 2 NPU for Edge AI applications.
CES 2026: Broadcom Brings Edge AI to Wi-Fi 8 with New BCM4918 APU
https://www.electronics-lab.com/ces-2026-broadcom-brings-edge-ai-to-wi-fi-8-with-new-bcm4918-apu/
The newly announced Wi-Fi 8 SoC integrates a proprietary Neural Engine and 10G PHYs to offload AI inference from the main CPU in next-gen residential access points.
CES 2026: Intel Panther Lake-H Powers Vecow TGS-2000 Stackable Edge AI PCs
https://www.electronics-lab.com/ces-2026-intel-panther-lake-h-powers-vecow-tgs-2000-stackable-edge-ai-pcs/
Vecow’s compact TGS-2000 series uses Intel Core Ultra Series 3 Panther Lake-H CPUs to deliver up to 100 TOPS AI performance for industrial edge applications.
Youyeetoo K1 – A Palm-Sized x86 Edge AI SBC with Intel N100 SoC
https://www.electronics-lab.com/youyeetoo-k1-a-palm-sized-x86-edge-ai-sbc-with-intel-n100-soc/
The Youyeetoo K1 is an ultra-compact x86 Edge AI SBC with an Intel N100 CPU, dual 4K HDMI, dual GbE, M.2 NVMe/SATA, LPDDR5, and various industrial I/O
Congatec Introduces Rugged COM Express Compact Module for Edge Applications
https://www.electronics-lab.com/congatec-introduces-rugged-com-express-compact-module-for-edge-applications/
The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer a -40 to 85°C industrial-grade temperature range.
Toradex Luna Is a “Pro Consumer” Edge AI SBC with Synaptics SL1680 SoC
https://www.electronics-lab.com/toradex-luna-is-a-pro-consumer-edge-ai-sbc-with-synaptics-sl1680-soc/
Toradex Luna SL1680 is a pro-consumer SBC with a quad-core Cortex-A73 SoC, 7.9 TOPS NPU, Pi-like I/O, and Torizon Linux for Edge AI applications.
AMD Announces Ryzen AI Embedded P100 and X100 Series Processors
https://www.electronics-lab.com/amd-announces-ryzen-ai-embedded-p100-and-x100-series-processors/
The new processors combine Zen 5 CPU cores, AMD RDNA 3.5 GPU, and AMD XDNA 2 NPU to power AI-driven automotive and industrial applications at the edge.
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
https://www.electronics-lab.com/innodisk-teams-up-with-qualcomm-develops-com-hpc-mini-module/
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with wide-temperature operation for industrial edge applications.