Banana Pi BPI-SM9 16-ENC-A3 SoM Features SOPHGO BM1688 AI SOC
https://www.electronics-lab.com/banana-pi-bpi-sm9-16-enc-a3-som-features-sophgo-bm1688-ai-soc/
The BPI-SM9 16-ENC-A3 pairs the BM1688 AI chip with multimedia and I/O for multi-stream video analytics and edge AI applications.
CES 2026: Qualcomm Debuts Next-Gen Dragonwing Q-Series Processors
https://www.electronics-lab.com/ces-2026-qualcomm-debuts-next-gen-dragonwing-q-series-processors/
The new Dragonwing Q-8750 and Q-7790 processors feature on-device AI, enhanced multimedia capabilities, and high-performance processing to advance consumer and industrial edge devices.
SECO Rolls Out COM Express Type 6 Module for Mission-Critical Designs
https://www.electronics-lab.com/seco-rolls-out-com-express-type-6-module-for-mission-critical-designs/
The new COM is powered by Intel Core Ultra Series 3 processors, delivers up to 180 platform TOPS AI acceleration, and features industrial-grade specifications for next-generation embedded applications.
NestDisk – An Intel N150 NAS Come Mini PC With Four M.2 Slots and Dual 2.5GbE LAN
https://www.electronics-lab.com/nestdisk-an-intel-n150-nas-come-mini-pc-with-four-m-2-slots-and-dual-2-5gbe-lan/
The Intel N150–powered NestDisk is a compact mini PC and NAS with four M.2 PCIe slots, dual 2.5GbE networking, Wi-Fi 6, and support for Linux and Windows.
Congatec Introduces Five New Intel Core Ultra Series 3 Processor-Based COMs
https://www.electronics-lab.com/congatec-introduces-five-new-intel-core-ultra-series-3-processor-based-coms/
The new COMs come in four form factors, with the ruggedized conga-TC1000r COM Express Compact module delivering up to 180 TOPS for high-performance applications in harsh environments.
Asus IoT PE3000N – A Rugged Jetson T5000 Edge AI Platform for Robotics
https://www.electronics-lab.com/asus-iot-pe3000n-a-rugged-jetson-t5000-edge-ai-platform-for-robotics/
Asus T5000 Edge AI system featrues NVIDIA Jetson T5000, modular I/O, 10GbE LAN, and support for up to 16 GMSL cameras for robotics, automation, and machine vision.
Exclusive Interview: How DRAM Volatility is Redefining Edge AI
https://www.electronics-lab.com/exclusive-interview-how-dram-volatility-is-redefining-edge-ai-architecture/
In this Electronics-Lab exclusive, Hailo CTO Avi Baum explains how rising costs are driving a pivot to efficient, low-memory models and dedicated accelerators.
GigaDevice Releases High-Speed Dual-Voltage SPI NOR Flash for 1.2 V SoCs
https://www.electronics-lab.com/gigadevice-releases-high-speed-dual-voltage-spi-nor-flash-for-1-2-v-socs/
The new GD25NX series xSPI NOR Flash features a dual-voltage design with 1.2 V I/O to enable direct connection to 1.2 V SoCs and reduce read power.
CamThink NeoEyes NE301: Ultra-Low-Power Edge-AI Vision Camera Launched
https://www.electronics-lab.com/camthink-neoeyes-ne301-ultra-low-power-edge-ai-vision-camera-launched/
The NeoEyes NE301 is a compact edge-AI camera with STM32N6, 0.6 TOPS NPU, Wi-Fi 6, 4MP sensor, and on-device YOLO support, designed for smart city, factory, and agriculture uses.
Firefly EC-AGXOrin AI System Supports 8 GMSL2 Cameras and 275 TOPS
https://www.electronics-lab.com/firefly-ec-agxorin-ai-system-supports-8-gmsl2-cameras-and-275-tops/
Jetson AGX Orin-based Firefly EC-AGXOrin edge AI system features 275 TOPS AI, 8 GMSL2 cameras, I/O, and Ubuntu support for robotics, vision, and industrial AI workloads.