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Grinn Delivers High-Performance Edge AI in Tiny 25 x 25 mm System-on-Module
Grinn Delivers High-Performance Edge AI in Tiny 25 x 25 mm System-on-Module
AI / ML SoM / CoM
Congatec Announces Edge Computing Modules and Full-Custom Design Service
Congatec Announces Edge Computing Modules and Full-Custom Design Service
Business Industrial Memory
GigaDevice Unveils Motor Control MCU and Expands 1.2 V SPI NOR Flash to 256 Mb
GigaDevice Unveils Motor Control MCU and Expands 1.2 V SPI NOR Flash to 256 Mb
Digital ICs Memory
Intelligent Tire Monitoring: BANF Integrates Silicon Labs’ Bluetooth LE SoC Into iSensor
Intelligent Tire Monitoring: BANF Integrates Silicon Labs’ Bluetooth LE SoC Into iSensor
Automotive Power
Meet the Arduino VENTUNO Q: A “Dual-Brain” Architecture on a Single Board
Meet the Arduino VENTUNO Q: A “Dual-Brain” Architecture on a Single Board
AI / ML Comm and Networking Software
Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems
Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems
Embedded and Edge ICs Memory
NFC Forum’s WLC and NDEF Specifications Formally Adopted as IEC Global Standards
NFC Forum’s WLC and NDEF Specifications Formally Adopted as IEC Global Standards
Business IoT RF / Wireless
Nordic Semiconductor Adds Entry-Level Bluetooth LE SoCs to nRF54L Series
Nordic Semiconductor Adds Entry-Level Bluetooth LE SoCs to nRF54L Series
ICs IoT Microcontrollers
STMicroelectronics Introduces Entry-Level MCU Series for Smart Devices
STMicroelectronics Introduces Entry-Level MCU Series for Smart Devices
ICs Memory
Bluetooth LE HDT: Rohde & Schwarz and Realtek Showcase Test Solution
Bluetooth LE HDT: Rohde & Schwarz and Realtek Showcase Test Solution
Comm and Networking IoT RF / Wireless