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Asahi Kasei Microdevices Introduces New Operational Amplifiers for Premium Audio Systems
Asahi Kasei Microdevices Introduces New Operational Amplifiers for Premium Audio Systems
Audio
Rohm NFC Wireless Power Chipset for Ultra-Compact Wearable Devices
Rohm NFC Wireless Power Chipset for Ultra-Compact Wearable Devices
Consumer Electronics ICs Power RF / Wireless
Schurter Releases TCS43 Microminiature SMT Tactile Switch
Schurter Releases TCS43 Microminiature SMT Tactile Switch
Components
56G MezzaWave Connectors Provide Drop-In Compatibility for Rugged Systems
56G MezzaWave Connectors Provide Drop-In Compatibility for Rugged Systems
Cables & Connectors Comm and Networking
Rambus Addresses AI Data Center Power Constraints With SOCAMM2 Chipset
Rambus Addresses AI Data Center Power Constraints With SOCAMM2 Chipset
ICs Memory
Murata Introduces Ultra-Low-Power AMR Sensors for Space-Constrained Designs
Murata Introduces Ultra-Low-Power AMR Sensors for Space-Constrained Designs
Sensors
Raltron Launches Low Phase Noise 100 MHz Voltage Controlled Crystal Oscillator
Raltron Launches Low Phase Noise 100 MHz Voltage Controlled Crystal Oscillator
Analog Components ICs
STMicroelectronics Releases High-Precision, 36 V Dual Operational Amplifier
STMicroelectronics Releases High-Precision, 36 V Dual Operational Amplifier
Analog ICs
GigaDevice’s New 32-Bit Microcontrollers Target HMI and IoT Edge Applications
GigaDevice’s New 32-Bit Microcontrollers Target HMI and IoT Edge Applications
Digital ICs Microcontrollers
Congatec Targets Low-Power Edge AI With Entry-Level COM Express Module
Congatec Targets Low-Power Edge AI With Entry-Level COM Express Module
AI / ML Embedded and Edge Processors SoM / CoM