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Congatec Introduces Rugged COM Express Compact Module for Edge Applications
Congatec Introduces Rugged COM Express Compact Module for Edge Applications
Data Centers Memory SoM / CoM
Espressif Integrates Tri-Band Wi-Fi 6E and Dual-Mode Bluetooth Into Single SoC
Espressif Integrates Tri-Band Wi-Fi 6E and Dual-Mode Bluetooth Into Single SoC
Audio RF / Wireless
Littelfuse’s Omnipolar TMR Switches Target Compact, Battery-Powered Electronics
Littelfuse’s Omnipolar TMR Switches Target Compact, Battery-Powered Electronics
Analog Components Power
TDK’s High-Current DC-Link Capacitors Operate at 105 °C Without Derating
TDK’s High-Current DC-Link Capacitors Operate at 105 °C Without Derating
High Voltage Passives Power
UDE 2026 Adds CPU Profiling, Python Debugger, and Expanded MCU Support
UDE 2026 Adds CPU Profiling, Python Debugger, and Expanded MCU Support
Microcontrollers Software
AMD Announces Ryzen AI Embedded P100 and X100 Series Processors
AMD Announces Ryzen AI Embedded P100 and X100 Series Processors
Embedded and Edge Industrial Processors
Infineon Releases Ultra-Low-Power, Wi-Fi 7 IoT 20 MHz Tri-Radio Family of SoCs
Infineon Releases Ultra-Low-Power, Wi-Fi 7 IoT 20 MHz Tri-Radio Family of SoCs
Comm and Networking IoT RF / Wireless
Insight SIP Expands BLE Module Series With Power and Memory Variants
Insight SIP Expands BLE Module Series With Power and Memory Variants
Comm and Networking ICs IoT
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
Business Memory SoM / CoM
Dracula Technologies Announces Enhanced Light Energy Harvesting OPV
Dracula Technologies Announces Enhanced Light Energy Harvesting OPV
IoT Optoelectronics Power