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pSemi’s New Power ICs Address Fast Charging and High-Voltage Conversion
pSemi’s New Power ICs Address Fast Charging and High-Voltage Conversion
ICs Power USB
AOS Launches Low- and Medium-Voltage MOSFETs With Double-Sided Cooling
AOS Launches Low- and Medium-Voltage MOSFETs With Double-Sided Cooling
ICs Semiconductors
Grinn Delivers High-Performance Edge AI in Tiny 25 x 25 mm System-on-Module
Grinn Delivers High-Performance Edge AI in Tiny 25 x 25 mm System-on-Module
AI / ML SoM / CoM
Congatec Announces Edge Computing Modules and Full-Custom Design Service
Congatec Announces Edge Computing Modules and Full-Custom Design Service
Business Industrial Memory
GigaDevice Unveils Motor Control MCU and Expands 1.2 V SPI NOR Flash to 256 Mb
GigaDevice Unveils Motor Control MCU and Expands 1.2 V SPI NOR Flash to 256 Mb
Digital ICs Memory
Intelligent Tire Monitoring: BANF Integrates Silicon Labs’ Bluetooth LE SoC Into iSensor
Intelligent Tire Monitoring: BANF Integrates Silicon Labs’ Bluetooth LE SoC Into iSensor
Automotive Power
Meet the Arduino VENTUNO Q: A “Dual-Brain” Architecture on a Single Board
Meet the Arduino VENTUNO Q: A “Dual-Brain” Architecture on a Single Board
AI / ML Comm and Networking Software
Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems
Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems
Embedded and Edge ICs Memory
NFC Forum’s WLC and NDEF Specifications Formally Adopted as IEC Global Standards
NFC Forum’s WLC and NDEF Specifications Formally Adopted as IEC Global Standards
Business IoT RF / Wireless
Nordic Semiconductor Adds Entry-Level Bluetooth LE SoCs to nRF54L Series
Nordic Semiconductor Adds Entry-Level Bluetooth LE SoCs to nRF54L Series
ICs IoT Microcontrollers