Samsung unveils 12-layer 3D-TSV chip packaging technology
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Samsung unveils 12-layer 3D-TSV chip packaging technology

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @...

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Wi-Fi 6 milestone reached
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Wi-Fi 6 milestone reached

Wi-Fi 6, the newest generation of Wi-Fi connectivity, reached a significant milestone a few days ago with official certification. The Wireless Broadband Alliance (WBA) is the not-for-profit industry body for the Wi-Fi ecosystem whose members include BT, AT&T and Google. The...

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Shaping light electronically with a Smartlens
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Shaping light electronically with a Smartlens

A team of researchers reports on a dynamically tuneable lens capable of achieving almost any complex optical function. Camera performance on mobile devices has proven to be one of the features that most end-users aim for. The importance of optical image quality improvement, and the...

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A Carbon Nanotube Microprocessor Mature Enough to Say Hello
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A Carbon Nanotube Microprocessor Mature Enough to Say Hello

Did you know that researchers are looking for an alternative to silicon? Did you know in principle that Carbon Nanotubes processor could run three times faster while consuming about one-third of the energy of their silicon predecessor? The Engineers at MIT and Analog Devices have created...

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MIT engineers build advanced microprocessor out of carbon nanotubes
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MIT engineers build advanced microprocessor out of carbon nanotubes

New approach harnesses the same fabrication processes used for silicon chips, offers key advance toward next-generation computers. by Rob Matheson | MIT News Office After years of tackling numerous design and manufacturing challenges, MIT researchers have built a modern microprocessor...

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3D memory die boasts 100+ layer design
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3D memory die boasts 100+ layer design

Samsung Electronics announced it has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integrates the company’s sixth-generation (1xx-layer) 256-gigabit (Gb) three-bit V-NAND for global PC OEMs. by Julien Happich @ eenewseurope.com Utilizing...

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Beyond 5G: Wireless Transceiver With Ultra-Fast Data Processing
Technology

Beyond 5G: Wireless Transceiver With Ultra-Fast Data Processing

A new wireless transceiver invented by electrical engineers at the University of California, Irvine boosts radio frequencies into 100-gigahertz territory, quadrupling the speed of the upcoming 5G wireless communications standard. by Jens Nickel @ elektormagazine.com Labeled an...

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Chip Hall of Fame: Intel 4004 Microprocessor
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Chip Hall of Fame: Intel 4004 Microprocessor

The first CPU-on-a-chip was a shoestring crash project. The Intel 4004 was the world’s first microprocessor—a complete general-purpose CPU on a single chip. Released in March 1971, and using cutting-edge silicon-gate technology, the 4004 marked the beginning of Intel’s rise to...

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