Nisshinbo’s Silicon Motherboard Merges ICs and Passives On-Die

Nisshinbo’s Silicon Motherboard Merges ICs and Passives On-Die

A new double-sided packaging method embeds resistors, capacitors, and inductors alongside active dies, cutting footprint by...


EPC’s EPC2370 GaN FET Targets High-Current AI Server Power Rails

EPC’s EPC2370 GaN FET Targets High-Current AI Server Power Rails

An 18 V eGaN transistor promises sub-milliohm conduction losses and dense power delivery for emerging 800 VDC data center...


IBM’s New Mainframe Chip Runs Arm and IBM Z Instructions Natively

IBM’s New Mainframe Chip Runs Arm and IBM Z Instructions Natively

A 2-nanometer processor core natively runs Arm and IBM Z instructions, allowing Arm-native Linux to operate alongside z/OS on the...


GigaDevice Enters EEPROM Market with Rugged GD24CL Series

GigaDevice Enters EEPROM Market with Rugged GD24CL Series

A new non-volatile memory family offers four million cycles and hardware ECC for high-reliability data storage in demanding...


IBM Unveils Sub-1 Nanometer Chip With New Nanostack Architecture

IBM Unveils Sub-1 Nanometer Chip With New Nanostack Architecture

A new three-dimensional transistor design pushes logic scaling past the 1-nm barrier, promising sizable gains in speed and...


Cirrus Logic Adds 32-Bit Stereo Converters for Pro Audio Designs

Cirrus Logic Adds 32-Bit Stereo Converters for Pro Audio Designs

Three new devices—an ADC, a DAC, and a codec—pair 115 dB dynamic range with hybrid gain control and 384 kHz sampling for mixing co...


ROHM 5th Gen SiC MOSFETs Cut High-Temperature On-Resistance by 30%

ROHM 5th Gen SiC MOSFETs Cut High-Temperature On-Resistance by 30%

New EcoSiC power devices target EV traction inverters, AI server PSUs, and industrial systems with improved efficiency and lower...


AOS Launches Low- and Medium-Voltage MOSFETs With Double-Sided Cooling

AOS Launches Low- and Medium-Voltage MOSFETs With Double-Sided Cooling

The new AONC40202 25 V and AONC68816 80 V MOSFETs are available in a DFN 3.3×3.3 source-down packaging with double-sided cooling ...


HBM4 Is Here: Samsung Begins Mass Production of Commercial Units

HBM4 Is Here: Samsung Begins Mass Production of Commercial Units

The high-bandwidth memory 4 (HBM4) delivers consistent 11.7 Gbps transfer speeds on its 1c DRAM process node with a 4 nm logic...


Infineon Expands Xensiv Family of Coreless Magnetic Current Sensors

Infineon Expands Xensiv Family of Coreless Magnetic Current Sensors

The new TLE4971/TLI4971 sensors are housed in a 300-mil package and offer a 0.7% total error for highly accurate, bidirectional...


Onsemi Develops Vertical Gallium Nitride Power Semiconductor Technology

Onsemi Develops Vertical Gallium Nitride Power Semiconductor Technology

The vertical gallium nitride (vGaN) semiconductors vertically conduct current through the chip, enabling higher operating...


Rohm Introduces Compact, Low-Power CMOS Op Amp for Battery-Powered Devices

Rohm Introduces Compact, Low-Power CMOS Op Amp for Battery-Powered Devices

The TLR1901GXZ is an ultra-small CMOS operational amplifier with a low, 160 nA operating circuit current, ideal for...