e-con Systems™, a global leader in embedded vision solutions, introduces a new Outdoor-Ready Global Shutter GigE camera — RouteCAM_CU25, the powerful addition to its high performance Ethernet camera series, RouteCAM. This Full HD Power over Ethernet (PoE) camera excels in delivering accurate and fast capture of moving scenes at high frame rate, making it ideal for applications like smart traffic, road safety and law enforcement, and forklift safety.
With PTP Synchronization, RouteCAM_CU25 camera achieves sub-microsecond levels of time synchronization for precision-critical applications and ensures that frames captured by multiple Ethernet cameras are precisely synchronized.
RouteCAM_CU25 camera seamlessly integrates with our cutting-edge cloud-based device management platform, CloVis Central™, providing comprehensive remote management of all on-field device operations. This integration facilitates quicker time to market, cost reductions, and improved application success rates. Additionally, the camera meets industrial-grade standards such as ISO 16750 and ISO 20653:2013, ensuring it can endure extreme temperatures and guaranteeing durability and resilience for outdoor use in any environment with an IP67 rating.
This GigE camera boasts the ability to stream high-quality, compressed Full HD data in a range of industry-standard formats including MJPEG, H.264, and H.265.
“Building on the success of our RouteCAM lineup, RouteCAM_CU25 combines Global Shutter and PoE technologies to deliver advanced capabilities for a wide range of industrial applications. The camera offers a significant competitive advantage with its direct cloud connectivity through our device management platform, CloVis Central™, streamlining maintenance and accelerating time to market while also providing PTP synchronization capabilities. With its high performance, rugged design, and flexible features, RouteCAM_CU25_IP67 is well-suited for applications such as Intelligent Transport Systems (ITS) for road safety, law enforcement, and smart parking, as well as industrial safety measures including perimeter safety for forklifts,” said Suresh Madhu, Head of Industrial Business Unit at e-con Systems.
Availability
To evaluate the capabilities of the RouteCAM_CU25, please visit the online web store and purchase the product.
What do alarm systems, timers, smart keychains, and other notification systems have in common? They all need a buzzer, and consequently, a buzzer driver. The driver must satisfy specific criteria, such as delivering the requisite current and intensity, the possibility to add different patterns, and others.
The aforementioned audible systems are usually battery-operated, so there is a need to increase the voltage for reliable operation and great sound. This can be done with a voltage DC-DC boost converter. The boost converter driver provides the necessary voltage for system operation and also includes overcurrent and undervoltage protections.
The HVPAK SLG47105 is a flexible configurable mixed-signal IC that combines a Boost DC-DC Converter and a Piezo Driver in a single package with a few external components.The main goal of this publication is to show how to configure HVPAK to drive a 2.5 kHz Piezo and how to create a Boost DC-DC Converter from 3 V to 13 V. The whole circuit is powered with a 3V CR2032 battery. Such a schematic can be used in devices that require short-term notifications (keychains for finding things, and others). When the push button is pressed, the DC-DC Converter boosts the voltage to 13 V which powers the Piezo Driver. Then the short pattern is played, and the circuit goes to sleep mode until the button is pressed again. When the circuit is ON – it consumes nearly 15 mA, and in sleep mode less than 50 nA. This ensures up to 800 activations on one battery.
Operating Principle and GreenPAK Design
The DC-DC Boost & Buzzer Driver Circuit Diagram is shown in Figure 1.
The design consists of a DC-DC Boost Converter and Buzzer Driver parts.
For the DC-DC Boost Converter, the PWM0 forms the ~197 kHz signal. The DFF1, DFF5, and DFF6 form the clock for a soft start to reduce inrush current, which can occur when the device is first turned on. Minimum and maximum duty cycles are set by Pipe Delay and CNT4/DLY4.
The VDD and VDD2_B are connected to a 3 V battery. VDD2_A is connected to Boost output. To monitor this voltage, the resistors R2 and R4 form the resistive divider with a feedback signal, which goes to PIN20 (Analog Input). This feedback voltage is compared with 1024 mV Vref by ACMP1H forming the ACMP signal which goes to the CHOP input of the PWM Chopper 0. If the VDD2 exceeds 9.5 V, the ACMP signal is HIGH and chop the formed PWM signal. The PWM Chopper 0 output goes to HV OUT CTRL1 (Half Bridge) input IN0. Then PIN 9 drives an NFET of Boost Converter.
To reduce the current consumption, a resistive divider is connected to PIN 10 (Low Side ON) with a GND input.
Note: it’s possible to change the ACMP1H Vref and boost the voltage up to 13 V.
The HV OUT CTRL0 (Full Bridge) drives a Piezo. PWM1 is used as a frequency divider and forms a 2.5 kHz signal (resonant frequency of a piezo), this signal comes to PH input of HV OUT CTRL0.
The 3-bit LUT4 forms the EN signal for the HV OUT CTRL0. It consists of the sound pattern signal and the general EN signal. The PGEN generates the sound pattern (01010101101011). The EN signal – the general ENABLE signal for the whole design is HIGH for 875 ms (CNT3/DLY3 One Shot) if the button is pressed (MF1) and the VDD is higher than ~2.6 V (ACMP0H + MF0).
The 3-bit LUT9 inverts the EN signal forming the SLEEP signal to shut down the blocks when they are not used to reduce the power consumption.
The 3-bit LUT0 forms the BOOST_SLEEP signal. The Boost will power down if there is no POR signal, the SLEEP signal is HIGH, or the OCP signal is HIGH. The CCMP0 monitors the piezo current and if it exceeds 200 mA, the OCP signal is HIGH (MF2).
Design Testing
Channel 1 (blue / 1st line) – PIN 7 (Piezo).
Channel 2 (yellow / 2nd line) – GND (current).
Figure 3. PIN 7 Piezo Signal (blue) & Current Consumption (yellow)
As can be seen in Figure 3, the VDD2 level is 9.5 V as expected, and the Piezo frequency is 2.5 kHz. The average current consumption is 15 mA. The current in sleep mode is below 50 nA, which means up to 800 activations without replacing the battery!
PCB Design
The proposed Demo PCB Design is shown in Figure 4 (top) and Figure 5 (bottom). As can be seen in Figure 4, the design is so compact that it can be placed under the buzzer.
List of Materials Used to Manufacture a Boost & Buzzer Driver
Conclusion
This article outlines the configuration process for the HVPAK SLG47105 to establish a Boost & Buzzer Driver device compatible with a single 3V CR2032 battery. By its notably low current consumption, it can accommodate up to 800 activations without necessitating battery replacement.
The internal resources of the device offer considerable flexibility, facilitating seamless adaptation to the specific requirements of users.
CUI Devices’ Motion and Control Group today announced the introduction of a new model to its AMT incremental encoder family that supports smaller motor shaft sizes from 1 mm to 6.35 mm (1/4 inch). The AMT12 series, based on CUI Devices’ proprietary capacitive ASIC technology, brings the same high levels of durability, accuracy, and immunity to environmental particulates as current AMT encoder models in an even more compact 22.2 x 22.2 x 12.8 mm package. Thanks to its 16 programmable resolutions from 96 to 4096 PPR and low current consumption of 16 mA at 5 V, the AMT12 incremental encoder is ideally suited for a variety of robotics, industrial, and automation applications.
Available in radial or axial orientations, the AMT12 series carries a wide -40 to +125°C operating temperature range and single-ended quadrature A/B output channels. Its digital nature and compatibility with CUI Devices’ AMT Viewpoint™ software makes the AMT12 encoder highly customizable with the ability to easily configure the resolution and set the zero position.
Possible users: Robotics, industrial, automation applications
Primary features: Supports shaft sizes from 1 to 6.35 mm, compact 22 mm package
Cost: $21.66 per unit at 100 pieces through distribution
The AMT12-V kit affords users further flexibility in their design with the support of 8 different sleeve bore sizes from 1 mm to 6 mm and simple mounting tools to assist in the easy installation process onto a motor.
The AMT12 series is available immediately with prices starting at $21.66 per unit at 100 pieces through distribution. Please contact CUI Devices for OEM pricing.
For helpful resources and tools on encoders and motion control, check out our Resource Library which houses a range of blog posts, videos, and more. Or for specific questions on our AMT encoder line, search our AMT FAQ page.
Rohde & Schwarz has developed the R&S RT-ZISO isolated probing system, further elevating its cutting-edge oscilloscope portfolio. The new R&S RT-ZISO enables extremely accurate measurements of fast switching signals, especially in environments with high common-mode voltages and currents. Also new is the R&S RT-ZPMMCX passive probe with MMCX connector, which complements the isolated probe system perfectly for certain measurement tasks.
At the PCIM Europe International Exhibition and Conference in Nuremberg, Germany, Rohde & Schwarz is giving a sneak peek at its next generation R&S RT-ZISO isolated probing system. The R&S RT-ZISO will set new standards in isolated probe technology, delivering unprecedented accuracy, sensitivity, dynamic range, and bandwidth for next generation wide bandgap (WBG) power designs with SiC and GaN.
The R&S RT-ZISO provides precise differential measurements of up to ±3 kV on reference voltages of ±60 kV with a rise time of < 450 ps and suppresses fast common-mode signals that can distort and interfere with accurate measurements. Its power-over-fiber architecture galvanically isolates the device under test (DUT) from the measurement setup, providing a much higher common-mode rejection ratio (CMRR) than conventional differential probes. Its key features include bandwidth options of 100 MHz to 1 GHz (upgradeable), a CMRR of > 90 dB (> 30 000:1) at 1 GHz, an input and offset range of ±3 kV, a common mode range of ±60 kV, and a sensitive input range of ±10 mV.
The R&S RT-ZISO isolated probe is the perfect addition to the Rohde & Schwarz oscilloscope portfolio. With the instruments of the next generation MXO series (MXO 4, MXO 5, MXO 5C), the probe enables measurements with the world’s fastest acquisition in the time and spectrum domain, thanks to the oscilloscopes’ hardware-based acceleration. In combination with the R&S RTO6, design engineers can use the probe for complex analysis tasks that take advantage of the oscilloscope’s high performance and advanced measurement capabilities.
The R&S RT-ZISO is ideal for a wide range of applications, including switching analysis of power converters with WBG materials, double-pulse testing, floating measurements, shunt measurements, inverter design, and motor drive analysis. The isolated probing system comes with a range of probe tips for different measurement needs, including the micro-miniature coaxial (MMCX) connector, square pins, wide square pins and the isolated passive prober. All connectors are rated for CAT III voltages up to 1000 V. It is the first passive isolated prober on the market that allows users to quickly access the test point without designated connectors. In addition, the use of long bandable cables allows the tips to access the DUT at various angles with no additional mechanical stress.
R&S RT-ZPMMCX passive probe with MMCX connector
Along with the R&S RT-ZISO, Rohde & Schwarz is also presenting a new type of passive probe with MMCX connector. The R&S RT-ZPMMCX supports a bandwidth range of > 700 MHz with input voltages of ±60 V DC and 30 V (RMS), making it the ideal complement to the R&S RT-ZISO isolated probing system for low-side gate measurements. The MMCX probe has a very low capacitive load of < 4 pF, which helps to maintain the best signal integrity for preserving the switching waveform shape and timing.
The R&S RT-ZISO isolated probing system and the R&S RT-ZPMMCX passive probe are both available from Rohde & Schwarz. Visitors to the PCIM Europe International Exhibition and Conference, June 11 to 13, 2024, in Nuremberg, Germany, can experience them live at the company’s booth 619 in hall 7.
This is a Half-bridge module based on the LM5104 chip, which is a high-voltage gate driver. This High-Voltage Gate Driver is designed to drive both the high-side and the low-side N-channel MOSFETs in a synchronous buck configuration. The floating high-side driver can work with supply voltages up to 100V. The high-side and low-side gate drivers are controlled from a single PWM input. Each state change is controlled adaptively to prevent shoot-through issues. In addition to the adaptive transition timing, an additional delay time can be added, proportional to an external setting resistor. An integrated high-voltage diode is provided to charge the high-side gate drive bootstrap capacitor. A robust level shifter operates at high speed while consuming low power and providing clean level transitions from the control logic to the high-side gate driver. Undervoltage lockout is provided on both the low-side and the high-side power rails.
The user must take care of the following:
Bootstrap capacitor value depends on the input frequency
Choose the right MOSFET as per Load Current/Voltage
Choose the Right Value for delay resistor R4-RT, Depending on MOSFET Gate Capacitance. Refer to Datasheet for more info.
Features
Power Supply Load up to 48V (Limited Due to Capacitor Volt)
Power Supply Gate Driver 9V to 14V DC
Load Up to 5Amps (Higher with Cooling Fan)
Drives Both a High-Side and Low-Side N-Channel MOSFET
Adaptive Rising and Falling Edges with Programmable
Additional Delay
Under Voltage Threshold 7V
Adjustable Delay 90 to 200nS (RT(R4) 10K to 100K)
Operating Frequency Input up to 1000Khz
Single Input Control
Bootstrap Supply Voltage Range up to 118-V DC
Fast Turnoff Propagation Delay (25 ns Typical)
Drives 1000-pF Loads With 15-ns Rise and Fall Times
Supply Rail Under Voltage Lockout
On Board Power LED
Screw Terminals for Load Supply and Load
Header Connector for Input signal and Gate Driver Supply
This is an automotive-grade self-oscillation 50% duty cycle half-bridge module built using the AUIR2085S chip from Infineon. The project consists of 2 x N-channel MOSFETs, and the module provides a primary side control solution to enable Half-Bridge DC-bus converters. The module is a self-oscillating half-bridge driver with 50% duty cycle ideally suited for 10V – 15V half-bridge DC-bus converters. The board is also suitable for push-pull converters. Each channel frequency is equal to fOSC, which can be set by selecting RT (R2+PR1) & CT-(C7), Dead-time can be controlled through proper selection of CT range from 50ns to 200ns. Internal soft-start increases the pulse width during power-up and maintains pulse width matching for the high and low outputs throughout the start-up cycle. Typically, the soft-start duty cycle varies beginning from 5-10% ramping up to about 50% over 1000 cycles. The AUIR2085S initiates a soft start at power up and after every overcurrent condition. Undervoltage lockout prevents operation if VCC is less than 7.5V.
Features
Power Supply 10V to 14V DC
Integrated 50% duty cycle oscillator and half-bridge driver
Adjustable switching frequency 84Khz to 260Khz
Undervoltage lockout prevents operation if VCC is less than 7.5V.
+/- 1A drive current capability optimized for low-charge MOSFETs
Adjustable dead-time 50ns – 200ns (Read Data Sheet for More Info)
High and low side pulse width matching to +/- 25ns
The components like transistors Q1, Q2, the external transformer, and the capacitors C4, C5, C9, and C10 make up a so-called single-ended, push-pull converter. This converter operates the potential-isolating transformer with an alternating voltage in which both half-oscillations are used for energy transmission.
Frequency Adjust
A Trimmer potentiometer is provided to adjust the frequency from 84Khz to 200Khz. The module supports higher frequencies up to 500Khz, read the datasheet of the AUIR2185S chip to learn more about frequency and dead time adjustment. For 500Khz Output CT should be 100pF and RT10kΩ.
Applications
DC-DC Converters, Push-Pull Drivers
High Voltage Converters
HEV Auxiliary Converter
Battery Management Converters
The recommended range of timing resistors RT is between 10kΩ and 100kΩ and the range of timing capacitor CT is between 47pF and 470pF. Timing resistor values less than 10kΩ should be avoided. The value of the timing capacitor determines the amount of dead time between the two output drivers: the lower the CT, the shorter the dead time, and vice versa. It is not recommended to use a timing capacitor below 47pF, for best performance keep the timing components physically as close as possible to the AUIR2085S. Separated ground and VCC traces to the timing components are encouraged.
The addition of a camera module or developer board improves the device’s ability to record and interpret visual data, allowing for more advanced and diverse applications. With the rise in visual recognition techniques, the selection of camera modules becomes a crucial part also considering its compatibility with MCUs. Fulfilling these advanced requirements, the upcoming LILYGO has come up with a solution. The LILYGOs T-Camera-Plus-S3 ESP32-S3 Camera Development Board features a camera supporting resolution of up to 2 Million Pixels (IR-Cut Night Vision), a 1.3-inch capacitive touch display, a speaker [FUET2122], power supply cable and a Bluetooth/WI-FI antenna [3rd Generation].
Specifications of LILYGOs T-Camera-Plus-S3 ESP32-S3 Camera Development Board
It supports ESP32-S3R8 with a radio frequency of 2.4 GHz and becomes a versatile option for any IoT-based MCU. Dual-core Xtensa LX7 is the CPU of the ESP32-S3 chip. Xtensa is a line of CPUs designed by Intel specifically for low-power applications. LX7 refers to the specific CPU architecture within the Xtensa family.
Some of its key features:
Low Power Consumption
Integrated Wi-FI and Bluetooth
Support for Cameras
Frame Buffer Support: To facilitate quicker processing and manipulation, the ESP32-S3 may feature dedicated memory for storing image data taken by the camera.
Hardware Offloading: The chip has hardware accelerators designed specifically for image processing tasks thereby removing the processing burden of the CPU Cores.
Scalable Image Processing: It allows image manipulation tasks by leveraging hardware accelerators and adjusting processing based on complexity.
Serial Camera Control Interface (SCCI): It’s a simple serial interface which uses fewer pins. It is used for battery-powered applications with lower-resolution image capture.
Digital MIPI Camera Interface (DCAM): DCAM is a complex interface with multiple data lines. It is used for High resolution images or video captures.
Multiple Peripherals like SPI, I2C, GPIO, ADC, etc.
The camera operates at a voltage of 3.3V and it features a micro USB cable to interface it with any development boards. It showcases a reset button on board which is helpful during its testing phases and with the support of ESP32 it is easily programmed using popular platforms like Arduino IDE and Visual Studio Code.
Wireless Connectivity
The LILYGO Camera development board likely supports all three of those wireless technologies:
WI-FI 802.11: This allows the board to connect to the internet through a wireless router. This is useful for applications that need to send or receive data over the internet, such as streaming video from the camera or controlling the camera remotely.
BLE 5+ & Bluetooth Mesh: The BT Low Energy allows the users for short-range communication between devices whereas the BT Mesh Networking creates a network of BT devices that can communicate with each other such as a network of sensors for smart home automation.
Memory
The memory structure of T Camera Plus S3:
PSRAM (Pseudo Static RAM): The 8MB of PSRAM provides additional workspace for your application to run more complex algorithms or store temporary data while the camera is in use.
Flash: The 16MB of flash memory provides storage for the operating system, your application code, and any images or videos captured by the camera.
TF Card Slot: this enables storage of large amounts of image and video data captured by the camera during operation.
You can refer to the pin diagram for more details:
The Lilygo T-Camera-Plus-S3 development board has become a viable option for creating camera-based IoT prototypes. The combination of ESP32-S3 microcontroller, built-in camera capability, and a variety of wireless connectivity options enables developers to create a variety of applications ranging from smart surveillance systems to visual data analysis tools. The T-Camera-Plus-S3 provides a platform for rapid prototyping and development. Its compatibility with popular programming environments such as Arduino IDE and Visual Studio Code streamlines the development process. For more details, refer to the product page.
The MYC-J7A100T is a System-on-Module (SoM) designed by MYIR. It is based on the Xilinx Artix-7 XC7A100T FPGA chip, a field-programmable gate array that can be customized for various applications. FPGA is faster than regular Microcontrollers since they use parallel processing to execute multiple tasks at a time. This makes MYC-J7A100T a high-density and high-speed circuit board.
Architectural Features of Xilinx Artix-7 XC7A100T FPGA chip:
Parallel execution of tasks.
Process Technology: 28 nm which allows higher performance & lower power consumption.
It appears that the datasheet has more details one can refer to.
It features three types of onboard memory; The 512MB DDR3 memory(fastest) is used as the main memory for running applications. The 32MB QSPI FLASH (medium) is used for program storage and configuration settings. Meanwhile, the 32KB EEPROM (slowest) is utilized for storing data that requires infrequent updates, as well as user-specific data and configuration settings.
The SoM connects through a 260-pin MXM gold-finger-edge-card connector with a 0.5mm pitch. This connector is compatible with MYIR’s standard baseboard, which comes with the MYD-J7A100T development board. Additionally, it has 4 pairs of GTP high-speed transceiver interfaces and one JTAG interface. Notably, the GTP connections allow for high-speed communication with external devices, whereas the JTAG interface is crucial for development and debugging.
The SoM provides 178 configurable FPGA IOs to perform various functions depending on the user’s application.
These 178 IOs are divided into 4 banks as follows:
Operating Range is Fixed (3.3V)
Bank 13 with 35 IO pins
Bank 14 with 45 IO pins
Operating Range is user-configurable (1.2V~3.3V)
Bank 15 with 48 IO pins
Bank 16 with 50 IO pins
Bottom View of MYC-J7A100T
Development Board: MYD-J7A100T
The MYD-J7A100T is the development board that supports SoM MYC-J7A100T. It operates at a voltage of 5V/3A and works efficiently in temperatures ranging from -40 to 80 degrees celsius.
The development board MYD-J7A100T features:
Its expansion board
Interfacing with MYC-J7A100T SOM via a 0.5mm pitch 260-pin MXM gold-finger-edge-card connector socket.
2 x Gigabit Ethernet ports.
2 x SFP+ interfaces;
Used in networking for higher speed transmission over long ranges via fiber optics & copper connections.
1 x PCIe 2.0 interface.
HDMI input and output interfaces.
1 x DVP camera interface.
1 x Micro SD slot.
1 x USB-UART interface.
1 x FAN interface.
1 x 2.5mm pitch 2x 20-pin IO expansion interface.
Top View of MYD-J7A100T
Bottom View of MYD-J7A100T
The Functional Block Diagram of the Development Board and SoM chip:
We evaluate the functional block diagram of the SoM MYC-J7A100T, represented by the blocks in the blue region, using the development board MYD-J7A100T. The entire diagram illustrates the Development Board’s structure.
The MYC-J7A100T SoM and the MYD-J7A100T development board, both designed by MYIR, provide a platform for a wide range of applications. The employment of Xilinx Artix-7 XC7A100T FPGA chip in SoM board provides high-density, high-speed processing with customizable features. The pairing of the development board with SoM allows for efficient prototyping allowing users to work in industrial automation, communications, embedded systems, or other high-speed applications.
For more information about the SoM & development board, please visit the MYIRs product page.
Oak Development Technologies introduces the upgraded IcyBlue Feather FPGA Board, Version 2, featuring hardware enhancements and the modern USB Type-C connector. Powered by the Lattice Semi iCE5LP4K FPGA, this open-hardware board provides a versatile platform for FPGA development, now with improved connectivity and compatibility.
“IcyBlue combines the capabilities of the iCE40 FPGA with the popular Adafruit Feather form factor, expanding the possibilities for FPGA design,” says Seth Kerr, spokesperson for Oak Development Technologies. “With support for a wide range of sensors and add-ons, including Adafruit Feather wings, IcyBlue simplifies the FPGA learning curve, offering a seamless experience for both beginners and experienced developers.”
The original IcyBlue Feather debuted in February last year, offering a distinct FPGA feather tailored for the Lattice Semi iCE5LP4K. While maintaining the same FPGA core, the new iteration introduces significant enhancements. Key among these is adopting the modern USB Type-C connector for streamlined data and power connectivity, alongside various undisclosed “hardware bug fixes.”
usb type c connectivity
Notably, the redesign retains all the features of its predecessor: two hardware I2C and SPI blocks that do not consume FPGA resources, two user-addressable single-color LEDs, an RGB LED, and 22 general-purpose input/output (GPIO) pins accessible via Feather-format breadboard-friendly headers.
In one of our previous posts, we wrote about the Milk-V Mars it’s a StarFive JH7110 powred SBC with a dual-core U74 processor, up to 8GB of LPDDR4 RAM, and features storage options like eMMC, Micro SD, and SPI Flash. Additionally, it features HDMI 2.0, PoE, and other capabilities.
At the time of writing the company did not release any specific operating system for this SBC, but that changed today as Canonical released Ubuntu 24.04 Server to the compact Milk-V Mars. The Milk-V Mars, Milk-V’s second RISC-V offering after the powerful 64-core Milk-V Pioneer, is designed to match the Raspberry Pi 3 Model B in both size and performance. It features the StarFive JH7110 quad-core RISC-V chip, a processor already compatible with a custom Ubuntu image on the StarFive VisionFive 2.
The Milk-V Mars uses a custom Ubuntu 24.04 Server version, different from the one for the VisionFive 2. You can install it onto the Mars’ built-in storage, an external drive, or a USB stick. But at the time of writing booting from a microSD card is currently necessary for all installations until a firmware update becomes available.
Milk-V Mars SBC Specifications
Processor: StarFive JH7110 quad-core RISC-V SoC
Memory:
Up to 8GB LPDDR4 RAM
eMMC module (removable)
Micro SD card slot
SPI Flash
Networking:
Gigabit Ethernet (with PoE support)
M.2 E-Key slot for Wi-Fi/Bluetooth module
Display & Video:
HDMI 2.0 port (up to 4K resolution)
2x MIPI DSI interfaces
Video decoder (4K@60fps H.264/H.265)
Video encoder (1080p@30fps H.265)
Other I/O:
3x USB 3.0 ports
1x USB 2.0 port
40-pin GPIO header
Operating System: Ubuntu 24.04 Server (custom image)
Form Factor: Raspberry Pi 3 Model B compatible
You can download the Milk-V Mars Ubuntu 24.04 image and a live installer from the Ubuntu RISC-V website. The site also offers images for other RISC-V platforms, including AllWinner Nezha, Microchip PolarFire SoC Icicle Kit, SiFive Unmatched, and more.
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