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NXP’s New Battery ICs Boost EV and ESS Performance
NXP’s New Battery ICs Boost EV and ESS Performance
Analog Automotive ICs
AutoML for Embedded: A New Tool for Resource-Constrained Devices
AutoML for Embedded: A New Tool for Resource-Constrained Devices
AI / ML EDA Tools
Microchip Debuts Disaggregated NVMe RAID Accelerator
Microchip Debuts Disaggregated NVMe RAID Accelerator
Data Centers Digital ICs Memory
Broadcom Aims to Solve the Distributed AI Networking Challenge
Broadcom Aims to Solve the Distributed AI Networking Challenge
Business Comm and Networking
NXP i.MX 95 Powers Advantech’s New SMARC and OSM Modules
NXP i.MX 95 Powers Advantech’s New SMARC and OSM Modules
Industrial Robotics
Business Bytes: Industry Giants Recalibrate AI and Networking Strategies
Business Bytes: Industry Giants Recalibrate AI and Networking Strategies
Business ICs Semiconductors
MagI³C-VDLM Series Expands with 4 A and 5 A Output DC/DC Power Modules
MagI³C-VDLM Series Expands with 4 A and 5 A Output DC/DC Power Modules
Analog Power
Renesas Unveils 64-bit RZ/G3E MPU for AI-Accelerated HMI Systems
Renesas Unveils 64-bit RZ/G3E MPU for AI-Accelerated HMI Systems
Software SoM / CoM
Memory Fabric System Tackles AI Inference’s Memory Bandwidth Challenges
Memory Fabric System Tackles AI Inference’s Memory Bandwidth Challenges
Comm and Networking Data Centers Memory
Nexperia Strengthens USB-C Ecosystem with New Controllers and Diodes
Nexperia Strengthens USB-C Ecosystem with New Controllers and Diodes
USB