Researchers expand microchip capability with new 3D inductor technology

Researchers expand microchip capability with new 3D inductor technology

Smaller is better when it comes to microchips, researchers said, and by using 3D components on a standardized 2D microchip...


Isabellenhütte introduces new range of 1 – 6mΩ resistors in smallest chip sizes available on the market

Isabellenhütte introduces new range of 1 – 6mΩ resistors in smallest chip sizes available on the market

Isabellenhütte has developed a new range of precision resistors in standard sizes with resistances ranging from 1 to 6 mOhm for ...


Maxim Integrated MAX2270x Ultra-High CMTI Isolated Gate Drivers

Maxim Integrated MAX2270x Ultra-High CMTI Isolated Gate Drivers

Maxim MAX2270x Ultra-High CMTI Isolated Gate Drivers are single-channel isolated gate drivers with ultra-high common-mode...


Driving down the on resistance of silicon carbide transistors

Driving down the on resistance of silicon carbide transistors

UnitedSiC has developed silicon carbide transistors in standard packages with the world’s lowest on resistance.


WIN SOURCE – A good place to buy cost-effective components online

WIN SOURCE – A good place to buy cost-effective components online

There are thousands of different electronic component distributors and suppliers around the world, who sell similar parts with a...


CoolSiC™ MOSFET evaluation board for motor drives up to 7.5 kW

CoolSiC™ MOSFET evaluation board for motor drives up to 7.5 kW

Silicon carbide (SiC) is en route to mainstream for applications like photovoltaic and uninterruptable power supplies.


New Broadband Hybrid Silicon-InGaAs Photodetectors

New Broadband Hybrid Silicon-InGaAs Photodetectors

Marktech Optoelectronics, Inc.


The MLX90821 measures pressures that dip down to 50 mbars

The MLX90821 measures pressures that dip down to 50 mbars

Melexis has designed a relative pressure sensor IC that can operate in and measure very low pressures in automotive applications.


Wafer-level camera module measures only 0.65 x 0.65 x 1.158mm

Wafer-level camera module measures only 0.65 x 0.65 x 1.158mm

OmniVision Technologies has released a fully packaged, wafer-level camera module measuring just 0.65×0.65mm and 1.158mm tall.


ELECTRONIC ALCHEMY launches campaign for the First Electronics 3D Printer

ELECTRONIC ALCHEMY launches campaign for the First Electronics 3D Printer

Today, ELECTRONIC ALCHEMY , a startup that emerged from university research launched a crowdfunding campaign for their eForge...


Give The Gift Of Real-World Coding Skills To Tweens This Holiday Season

Give The Gift Of Real-World Coding Skills To Tweens This Holiday Season

Let’s Start Coding Offers Customizable Electronic Kits That Teach Kids 8-12 Real Code in a Hands-on Way Remember how much fun you ...


Semiconductors by mixos
Samsung unveils 12-layer 3D-TSV chip packaging technology

Samsung unveils 12-layer 3D-TSV chip packaging technology

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking o...