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SparkPNT GNSS Disciplined Oscillator Delivers Sub-Nanosecond Timing
u-blox Launches MAYA-W5 and NORA-W5 Wi-Fi 6 Module Families
PZSDR P047 SDR Board Packs AMD ZU47DR RFSoC and 8×8 RF Channels
Efinix Ti125 FPGA Targets Compact, Power-Sensitive Edge AI
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
How to Clean a Soldering Iron Tip Without Ruining It
Why PVC Remains a Go-To Material for Electronics Enclosures and Equipment Mounts
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and r...
GIGABYTE GA-PICO3350 may be the smallest motherboard from the company so far.
Shenzhen Xunlong Software launched Orange Pi AI Stick 2801 neural compute stick last year for $69.
VersaLogic Corp., the embedded industry’s most trusted computer company, has announced a new SWaP-optimized embedded computing s...
iLife MP8 micro PC looks to be the smallest Win10 mini PC, powered by an Intel Celeron N4100 quad-core Gemini Lake processor with...
ULX3S is a fully open source, compact, robust, and affordable FPGA dev board equipped with a balanced selection of additional...
NXP Semiconductors has announced the industry’s first crossover MCU, i.MX RT1170 28nm fully-depleted silicon-on-insulator (...
NXP LS1043A quad-core Cortex-A53 communication processor was introduced in 2014, while NXP LS1046A quad-core Cortex-A72 SoC was...
Trenton Systems is prepping a compact, Linux-friendly “Ion Mini PC” with 8th or 9th Gen Coffee Lake options and up to 32GB DDR4, S...
Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other...
An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking o...
IBASE Technology, a global provider of Industrial motherboards and embedded computing solutions, reveals the IB919 3.5-inch...