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IBM's New Mainframe Chip Runs Arm and IBM Z Instructions Natively
Radxa rCore-Q8280 SoM Packs Qualcomm Snapdragon 8cx Gen 3 and 29+ TOPS AI
KAGA FEI ES4L15MA1 - A Tiny Bluetooth 6.0 Module
Kinetic's KTS1642Q Load Switch Eases Automotive Transient Compliance
Prevent Post-Launch Application Failures with Real-World Network Simulation
The Approach to AI Infrastructure Is the Real Bubble
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
HMS Networks' PEAK brand debuts its first Automotive Ethernet device, bridging 100/1000BASE-T1 with standard Ethernet for vehicle development and...
A new IEEE 802.15.4ab-compliant 22nm CMOS implementation uses narrowband assistance to improve indoor localization performance...
The SPDT device combines 0.5 dB insertion loss, 95 dBm IIP3, and cryogenic operation for next-generation test, satellite, and...
The SDG8000A pairs 16-bit resolution and 12 GSa/s sampling with direct 5 GHz output and vector signal creation for wireless,...
Qorvo's three-part SOI switch family covers 50 MHz to 10 GHz, cutting component count and preserving signal integrity in...
The new broadband platforms integrate advanced cellular and wireless interfaces alongside dedicated hardware accelerators for...
TE Connectivity’s new connector and cable assembly family delivers data rates up to 56 Gbps PAM4, integrated power pins, and VITA ...
Waveshare CM5-ETH-RS485-4G-BASE adds dual LAN, RS485, M.2 NVMe, and 4G/5G support to Raspberry Pi Compute Module 5 for industrial...
Powered by SpacemiT K3, this compact system delivers 60 TOPS AI compute, 32GB RAM, and rich I/O for local LLM inference and edge...
Compact edge system with 16-core Ryzen AI Max+, 50 TOPS NPU, up to 128GB LPDDR5X, and 10GbE for local AI workloads without...
ADLINK’s DLAP-701 uses NVIDIA Jetson Thor with up to 128GB LPDDR5X, high-speed I/O, and industrial design for robotics, vision, a...
Featuring agentic AI, quad-band GNSS, and NTN support, the X105 enables 5G Advanced with higher efficiency, faster speeds, and...