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ST Pairs Vibration-Immune Gyroscopes With Dual Accelerometers
Grapple Probe - An Isolated USB CMSIS-DAP Debug Probe with UART and I2C
CHC5 is an Open Modular Camera System with Interchangeable Sensors and Lens Mounts
Microchip's 65V Monitors Add Energy Accumulation to 48V Designs
Polyimide Tape for PCB Masking: Avoiding Edge Lift and Residue
Prevent Post-Launch Application Failures with Real-World Network Simulation
The Approach to AI Infrastructure Is the Real Bubble
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
Single Pair Ethernet: One Twisted Pair, Full Ethernet Performance
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
A compact Raspberry Pi TV Stick carrier board converts CM5 into a plug-in HDMI system with USB-C power, dual USB 3.0, and support...
Compact 30×30mm SoM using MediaTek Genio 360P with 7.4 TOPS AI, octa-core CPU, rich I/O, and up to 8GB LPDDR4x for edge AI and ...
Compact M.2 DNPU accelerator delivers high-efficiency AI with up to 40 eTOPS and seamless integration with NXP's i.MX95 SoM for...
The SMARC 2.2 SmarCore iQ6 integrates Qualcomm’s IQ-615 processor, LPDDR4X memory, and multiple high-speed interfaces for i...
The Grinn AstraSOM-261x is an Edge AI SoM built on the Synaptics Astra SL2610 processor, packing a 1 TOPs NPU and advanced...
The SOM-Trizeps-X-Genio360/360P Edge AI SOMs are built on MediaTek's 6 nm Genio 360/360P IoT processors, offering cost-effective...
The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer...
iWave’s iG-RainboW-G69M pairs a TI AM62Lx OSM Size-SF SoM with a compact carrier board, offering dual GbE, display, USB, and L...
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with...
The BPI-SM9 16-ENC-A3 pairs the BM1688 AI chip with multimedia and I/O for multi-stream video analytics and edge AI applications.
The new COM is powered by Intel Core Ultra Series 3 processors, delivers up to 180 platform TOPS AI acceleration, and features...
The LLM-8850 module enhances edge systems with strong INT8 AI processing, multi-channel 8K video handling, and efficient cooling...