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Renesas Debuts Dual-Side-Cooled 650V GaN FET for 800V Data Centers
Luckfox Lyra PLC - An Industrial Linux Controller with Dual Ethernet, CAN & RS485
Efinix Extends Sapphire SoC Family With 64-Bit RISC-V Core
Nordic nRF54LC10A - An Ultra-Low-Power Multiprotocol SoC for Cost-Sensitive IoT
Polyimide Tape for PCB Masking: Avoiding Edge Lift and Residue
Prevent Post-Launch Application Failures with Real-World Network Simulation
The Approach to AI Infrastructure Is the Real Bubble
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
Single Pair Ethernet: One Twisted Pair, Full Ethernet Performance
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
Toshiba Electronics Europe GmbH, the industry leader in the miniaturisation of cutting-edge photorelays, introduced a new family...
Researchers at the University of Chicago have managed to beat the previous world record for high-temperature superconductivity...
Physicists at the National Institute of Standards and Technology (NIST) and partners have demonstrated an experimental,...
Powerful new tool facilitates first-time-right analog & high voltage design implementation in even the most challenging of...
New modulation method increases operational lifetime of switching power units through digital, highly dynamic control and the use...
A leaked Intel roadmap reveals launch plans for Intel Core and Atom processors through the end of 2021.
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with potted gel package.
The TVC series is a fully compensated harsh media pressure sensor from Merit SensorTM designed to handle today’s toughest p...
Coilcraft will introduce its new XGL4020 Series of high-performance, molded power inductors at the upcoming Applied Power...
CUI’s analog and digital MEMS microphones deliver enhanced audio quality in extremely compact packages.
At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital...
Scientists at the University of Stuttgart and the KIT succeed in important further development on the way to quantum computers.
