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Norik Systems DECT NR+ USB Dongle Built Around Nordic nRF9151 SiP
Forgix Packs RP2354 MCU and Trion T8 FPGA into a $50 Teensy-Size Board
NXP Combines AM/FM Radio and AI Audio Processing in One Chip
GPX10 Pro AI Processor Delivers Always-On Edge AI Below 100µW
Prevent Post-Launch Application Failures with Real-World Network Simulation
The Approach to AI Infrastructure Is the Real Bubble
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
Being one of the frontrunners in AI development and having an understanding of the potentials and opportunities in Edge Computing...
Shenzhen Xunlong has released introductory specs for a Rockchip RK3399 based Orange Pi 4 SBC.
David Johnson-Davies writes about his experiments with interfacing a low-cost serial GPS module directly to uLisp, to create...
The Eclypse Z7 is Digilent’s newest FPGA/SoC designed to enable systems that are ultra high-speed and highly modular, featuring X...
Aaeon’s M.2 and mini-PCIe “AI Edge Computing Modules” are based on Kneron’s energy-efficient, dual Cortex-M4-enabled KL520 AI SoC,...
An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking o...
RS has launched the first digital multimeter (DMM) in the company’s RS PRO product range to integrate a built-in thermal imager.
The performance of Pyreos single and dual channel TO-39 detectors in a compact quad channel TO-39 package Pyreos has announced...
Toshiba Electronics Europe GmbH, the industry leader in the miniaturisation of cutting-edge photorelays, introduced a new family...
Power-module designs require high power density, excep-tional thermal performance and a full feature set in order to be...
A leaked Intel roadmap reveals launch plans for Intel Core and Atom processors through the end of 2021.
The advent of smaller, lower-cost and lower-powered pressure sensors has generated a new wave of innovation, increasing...
