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SolidRun’s Fanless Industrial PCs Feature AMD Ryzen AI 300 Mobile AI SoC

SolidRun’s Fanless Industrial PCs Feature AMD Ryzen AI 300 Mobile AI SoC

SolidRun has expanded its modular IPC lineup with the Bedrock RAI300, powered by AMD Ryzen AI 300 processors, targeting edge AI...

Comm and Networking IoT Memory by Debashis Das
Milk-V Titan Brings High-Performance RISC-V to the Mini-ITX Motherboard

Milk-V Titan Brings High-Performance RISC-V to the Mini-ITX Motherboard

Milk-V Titan is a mini-ITX RISC-V motherboard with an octa-core 2 GHz CPU, PCIe Gen4, ECC DDR4 support, and server-grade features...

Cables & Connectors Components Memory by Sayantan Nandy
HBM4 Is Here: Samsung Begins Mass Production of Commercial Units

HBM4 Is Here: Samsung Begins Mass Production of Commercial Units

The high-bandwidth memory 4 (HBM4) delivers consistent 11.7 Gbps transfer speeds on its 1c DRAM process node with a 4 nm logic...

ICs Memory Semiconductors by Electronics-Lab Staff
MYIR MYC-CZU3EG-V3 SoM Powered by AMD Zynq UltraScale+ MPSoC

MYIR MYC-CZU3EG-V3 SoM Powered by AMD Zynq UltraScale+ MPSoC

MYIR introduces the MYC-CZU3EG-V3 SoM with AMD Zynq UltraScale+ XCZU3EG, featuring Cortex-A53/R5 cores, FPGA fabric, DDR4, eMMC,...

Digital ICs ICs Memory by Sayantan Nandy
Diptyx ESP32-S3 Open-Source Dual-Screen E-Reader Funded

Diptyx ESP32-S3 Open-Source Dual-Screen E-Reader Funded

An ESP32-S3 e-reader with dual e-ink displays, open hardware and firmware, microSD storage, and a foldable book-style design...

Displays IoT Memory by Sayantan Nandy
Advantech 3.5-Inch SBC Features Qualcomm QCS6490 or QCS5430 SoC For Edge AI

Advantech 3.5-Inch SBC Features Qualcomm QCS6490 or QCS5430 SoC For Edge AI

The Advantech MIO-5355 is an industrial 3.5-inch SBC using Qualcomm QCS6490 or QCS5430 SoCs, offering LPDDR5 memory, rich I/O,...

Comm and Networking ICs Memory by Debashis Das
Avalue ECM-ASL3 3.5-Inch SBC Supports Intel Alder Lake-N and Amston Lake SoCs

Avalue ECM-ASL3 3.5-Inch SBC Supports Intel Alder Lake-N and Amston Lake SoCs

This rugged 3.5-inch SBC features Intel N97/i3-N305 processors, triple M.2 expansion, 2.5GbE LAN, and 9-36V input for edge AI...

Cables & Connectors Displays Memory by Debashis Das
Ryzen AI 9 HX470 Powers MINISFORUM’s AI X1 Pro-470 Mini PC

Ryzen AI 9 HX470 Powers MINISFORUM’s AI X1 Pro-470 Mini PC

Shown at CES 2026, the AI X1 Pro-470 targets creators and gamers with Radeon 890M graphics, Wi-Fi 7, OCuLink eGPU support, and up...

AI / ML Comm and Networking Memory by Sayantan Nandy
AMD Launches Ryzen AI Embedded P100 and X100 With Up to 50 TOPS AI Power

AMD Launches Ryzen AI Embedded P100 and X100 With Up to 50 TOPS AI Power

AMD is bringing its "Ryzen AI" branding to the embedded sector, with Zen 5 CPUs, RDNA 3.5 graphics, and an XDNA 2 NPU for Edge AI...

AI / ML Memory Software by Debashis Das
SK Hynix’s Latest Automotive DRAM Attains ISO 26262 ASIL-D Certification

SK Hynix’s Latest Automotive DRAM Attains ISO 26262 ASIL-D Certification

The LPDDR5X automotive DRAM has achieved the highest safety integrity level for automotive systems, meeting stringent...

Automotive Business Memory by Electronics-Lab Staff
CES 2026: Intel Panther Lake-H Powers Vecow TGS-2000 Stackable Edge AI PCs

CES 2026: Intel Panther Lake-H Powers Vecow TGS-2000 Stackable Edge AI PCs

Vecow’s compact TGS-2000 series uses Intel Core Ultra Series 3 Panther Lake-H CPUs to deliver up to 100 TOPS AI performance for i...

Cables & Connectors Comm and Networking Memory by Debashis Das
CES 2026: Snapdragon X2 Plus 3nm SoCs Targets Copilot+ PCs With 80 TOPS AI and Multi-Day Battery

CES 2026: Snapdragon X2 Plus 3nm SoCs Targets Copilot+ PCs With 80 TOPS AI and Multi-Day Battery

The new platform brings the 3rd Gen Oryon CPU and an 80 TOPS NPU to the mainstream laptop market, promising multi-day battery...

Comm and Networking Memory Software by Debashis Das