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Norik Systems DECT NR+ USB Dongle Built Around Nordic nRF9151 SiP
Forgix Packs RP2354 MCU and Trion T8 FPGA into a $50 Teensy-Size Board
NXP Combines AM/FM Radio and AI Audio Processing in One Chip
GPX10 Pro AI Processor Delivers Always-On Edge AI Below 100µW
Prevent Post-Launch Application Failures with Real-World Network Simulation
The Approach to AI Infrastructure Is the Real Bubble
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
VIEWE’s dual-chip ESP32-P4 and ESP32-C6 platform targets HMI, edge AI, multimedia, and industrial IoT applications with rich m...
The new conga-TC300 COM is based on Intel Core Series 3 processors, offering up to 41 TOPS within a 12 W to 28 W TDP envelope for...
The CEXD-INTRBL open robotic system utilizes Intel Core Ultra (Series 3) architecture and delivers up to 180 TOPS AI performance,...
Forlinx Embedded launches an M.2 AI module with NXP Ara240, 16GB RAM, and PCIe Gen4, enabling high-throughput edge AI and...
The new UNISYST MRAM family unifies code and data storage in a single device, offering up to 2 Gb density, 400 MB/s reads, and a...
The SOM-Trizeps-X-Genio360/360P Edge AI SOMs are built on MediaTek's 6 nm Genio 360/360P IoT processors, offering cost-effective...
The new processors combine Zen 5 CPU cores, AMD RDNA 3.5 GPU, and AMD XDNA 2 NPU to power AI-driven automotive and industrial...
The EPYC Embedded 2005 Series brings Zen 5 CPUs with up to 16 cores, DDR5-5600 ECC, PCIe Gen5, and 45–75W TDP for always-on e...
In this Electronics-Lab exclusive, Hailo CTO Avi Baum explains how rising costs are driving a pivot to efficient, low-memory...
A compact Agilex 3–based FPGA development kit featuring Nios V, USB Blaster III, HDMI, and Gigabit Ethernet for rapid RISC-V p...
MIPI SoundWire I3S is a two-pin, multi-drop audio interface specification that unifies control and data, enabling high bandwidth...
With a total of seven environmental and inertial sensors facilitated by Bosch, Infineon, and Sensirion, the fully open-source...
