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GigaDevice Enters EEPROM Market with Rugged GD24CL Series
Orange Pi 6 SBC packs CIX P1 SoC, 45 TOPS AI, dual 2.5GbE, and LPDDR5
Roundup: New Digital Isolator Launches Target Industrial and Automotive Systems
u-blox ALMA-B2 Brings Bluetooth 6.0 and Edge AI to Low-Power IoT
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
How to Clean a Soldering Iron Tip Without Ruining It
Why PVC Remains a Go-To Material for Electronics Enclosures and Equipment Mounts
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
Intel showed off "Wildcat Lake" Core Series 3 chips with 6 cores, Xe3 graphics and NPU 5 at CES 2026.
The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer...
Renesas RA6W1 RA6W2 MCUs combine Wi-Fi 6, Bluetooth LE, Cortex-M33, and Matter support for smart home and low-power IoT devices.
iWave’s iG-RainboW-G69M pairs a TI AM62Lx OSM Size-SF SoM with a compact carrier board, offering dual GbE, display, USB, and L...
ESP32-S3-based IoT kit with Wi-Fi, BLE 5.0, and SX1262 LoRa, offering long-range communication, battery and solar support, OLED...
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with...
The BPI-SM9 16-ENC-A3 pairs the BM1688 AI chip with multimedia and I/O for multi-stream video analytics and edge AI applications.
The STM32MP21 MPUs feature a 1.5 GHz Arm Cortex-A35 core and a 300 MHz Cortex-M33 core, offering high-performance, efficiency,...
The new COM is powered by Intel Core Ultra Series 3 processors, delivers up to 180 platform TOPS AI acceleration, and features...
The Intel N150–powered NestDisk is a compact mini PC and NAS with four M.2 PCIe slots, dual 2.5GbE networking, Wi-Fi 6, and s...
The new COMs come in four form factors, with the ruggedized conga-TC1000r COM Express Compact module delivering up to 180 TOPS...
$19 RISC-V SBC with JH-7110S SoC, HDMI, MIPI, Wi-Fi 6, PCIe M.2 SSD support, and Linux OS options.