HomeMemoryPage 5

Blog

Categories

CES 2026: Snapdragon X2 Plus 3nm SoCs Targets Copilot+ PCs With 80 TOPS AI and Multi-Day Battery

CES 2026: Snapdragon X2 Plus 3nm SoCs Targets Copilot+ PCs With 80 TOPS AI and Multi-Day Battery

The new platform brings the 3rd Gen Oryon CPU and an 80 TOPS NPU to the mainstream laptop market, promising multi-day battery...

Comm and Networking Memory Software by Debashis Das
Youyeetoo K1 – A Palm-Sized x86 Edge AI SBC with Intel N100 SoC

Youyeetoo K1 – A Palm-Sized x86 Edge AI SBC with Intel N100 SoC

The Youyeetoo K1 is an ultra-compact x86 Edge AI SBC with an Intel N100 CPU, dual 4K HDMI, dual GbE, M.2 NVMe/SATA, LPDDR5, and various industrial I/O

Comm and Networking Memory RF / Wireless by Debashis Das
TouchNetix AX24A Combines Touch and Force Sensing in 40-Pin Package

TouchNetix AX24A Combines Touch and Force Sensing in 40-Pin Package

The dual-sensing controller supports up to 22 touch/force buttons with force-sensing capabilities behind conductive materials,...

Displays Industrial Memory by Electronics-Lab Staff
CES 2026: Intel Debuts Wildcat Lake Core Series 3 Processors with 40 TOPS AI

CES 2026: Intel Debuts Wildcat Lake Core Series 3 Processors with 40 TOPS AI

Intel showed off "Wildcat Lake" Core Series 3 chips with 6 cores, Xe3 graphics and NPU 5 at CES 2026.

ICs IoT Memory by Debashis Das
Congatec Introduces Rugged COM Express Compact Module for Edge Applications

Congatec Introduces Rugged COM Express Compact Module for Edge Applications

The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer...

Data Centers Memory SoM / CoM by Electronics-Lab Staff
Renesas RA6W1 and RA6W2 MCUs Bring Dual-Band Wi-Fi 6 to IoT

Renesas RA6W1 and RA6W2 MCUs Bring Dual-Band Wi-Fi 6 to IoT

Renesas RA6W1 RA6W2 MCUs combine Wi-Fi 6, Bluetooth LE, Cortex-M33, and Matter support for smart home and low-power IoT devices.

Comm and Networking IoT Memory by Sayantan Nandy
iWave iG-RainboW-G69M TI AM62Lx OSM SoM with Raspberry Pi-Size Carrier Board

iWave iG-RainboW-G69M TI AM62Lx OSM SoM with Raspberry Pi-Size Carrier Board

iWave’s iG-RainboW-G69M pairs a TI AM62Lx OSM Size-SF SoM with a compact carrier board, offering dual GbE, display, USB, and L...

Cables & Connectors Memory SoM / CoM by Sayantan Nandy
Heltec WiFi LoRa 32 (V4) Expansion Kit with ESP32-S3 and SX1262

Heltec WiFi LoRa 32 (V4) Expansion Kit with ESP32-S3 and SX1262

ESP32-S3-based IoT kit with Wi-Fi, BLE 5.0, and SX1262 LoRa, offering long-range communication, battery and solar support, OLED...

Comm and Networking IoT Memory by Sayantan Nandy
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module

Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module

The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with...

Business Memory SoM / CoM by Electronics-Lab Staff
Banana Pi BPI-SM9 16-ENC-A3 SoM Features SOPHGO BM1688 AI SOC

Banana Pi BPI-SM9 16-ENC-A3 SoM Features SOPHGO BM1688 AI SOC

The BPI-SM9 16-ENC-A3 pairs the BM1688 AI chip with multimedia and I/O for multi-stream video analytics and edge AI applications.

AI / ML Memory SoM / CoM by Debashis Das
STMicroelectronics Launches MPUs for Cost and Power-Constrained Designs

STMicroelectronics Launches MPUs for Cost and Power-Constrained Designs

The STM32MP21 MPUs feature a 1.5 GHz Arm Cortex-A35 core and a 300 MHz Cortex-M33 core, offering high-performance, efficiency,...

Displays Memory by Electronics-Lab Staff
SECO Rolls Out COM Express Type 6 Module for Mission-Critical Designs

SECO Rolls Out COM Express Type 6 Module for Mission-Critical Designs

The new COM is powered by Intel Core Ultra Series 3 processors, delivers up to 180 platform TOPS AI acceleration, and features...

Memory Software SoM / CoM by Electronics-Lab Staff