RPGA Feather is an RP2040 and iCE40 FPGA Powered Dev Board in A Adafruit Feather From Factor

RPGA Feather by Oak Development Technologies is an RP2040 and iCE40FPGA-powered development board in an Adafruit Feather form factor. The board is tiny and features an MCP73831 1S LiPo charger, a USB 2.0 Type-C connector for power and programming, and an RGB LED driven by the FPGA

Speaking of the FPGA it’s an ultra-low-power iCE40 Ultra product family designed for mobile applications such as smartphones, tablets, and handhelds, it features 3,520 logic cells 80 Kbits of embedded Block RAM, and much more. Previously we have seen Oak Development Technologies introduce the IcyBlue Feather 2 and IcyBlue Feather, both powered by the iCE40 FPGA module.

RPGA Feather Dev Board Specifications

  • MCU: Raspberry Pi RP2040 dual-core Cortex-M0+ @ 133 MHz, 264KB SRAM
  • FPGA: Lattice Semiconductor iCE5LP4K, 3,520 logic cells, 80 Kbits EBR, 640 bits distributed RAM, 2x I2C, 2x SPI
  • Storage: 2MB QSPI flash
  • USB: USB 2.0 Type-C Host/Device (power & programming)
  • Expansion:
    • 2.54mm headers w/ RP2040
    • Up to 11x GPIOs to RP2040 (3 for bitstream programming)
    • STEMMA QT/QWIIC connector
    • 4x jumper blocks
  • Clock Management: 1x PLL, 2x oscillators
  • Misc:
    • Up to 4x LEDs (RGB, charge, CDONE, user)
    • 2x buttons (boot, reset)
  • Power:
    • 5V via USB-C
    • MCP73831 LiPo charger
  • Dimensions: 23mm x 51mm (same as Adafruit Feather)

The RPGA Feather simplifies FPGA programming by leveraging the Raspberry Pi RP2040 and CircuitPython. Three dedicated pins enable direct bitstream programming onto the iCE5LP4K FPGA. Developers can easily set up their environment with open-source tools like Yosys OSS CAD Suite and the CircuitPython Community Bundle, along with their preferred CircuitPython IDE. As an open-source hardware project, the RPGA Feather’s schematics, bill of materials, production files, and usage examples are readily available on GitHub.

The RPGA Feather, priced around $47, is available exclusively on Tindie, and offers a unique blend of RP2040 and FPGA capabilities, similar to the Pico-Ice board but with potential volume discounts.

ThingPulse’s ESP32-S3-based Compact Pendrive S3 128MB

ThingPulse has developed a USB-C plug featuring ESP32-S3, flash memory of 128MB, and capacitive touch for commands. This ThingPulse Pendrive S3 can work as a BadUSB device, sending hundreds of keystrokes per second and executing predefined commands through simple scripts. The WiFi Duck enhances this capability by providing wireless control over these scripts via a web interface, eliminating the need for physical script transfers or application installations. This device emulates a USB keyboard and connects to a WiFi network, where users can remotely manage and deploy scripts in “real-time”, significantly streamlining the process of executing complex command sequences on target systems.

Meanwhile, the Espressif ESP32-S3-MINI-1 module on the board integrates an Xtensa dual-core 32-bit LX7 microprocessor with support for 2.4GHz Wi-Fi and Bluetooth 5 (low-energy).

ThingPulse Pendrive S3 specifications:

  • Wireless module – ESP32-S3-MINI
    • CPU – Dual-core Xtensa LX7 @ 240 MHz,
    • Memory/Storage – 512 KB SRAM, 8MB on-chip flash,
    • Wireless – 2.4GHz Wi-Fi and Bluetooth 5 (LE)
    • PCB antenna
  • Storage – 128MB flash memory, addressable via SDIO/MMC or SD card interface, in 1-bit or 4-bit mode
  • USB – USB-C male connector
  • Other specs
    • WS2812B addressable RGB LED
    • Capacitive touch button (Spring)
  • USB drive plastic enclosure

TinyUSB enables the emulation feature of the pendrive module, allowing the device to mimic itself as mice, keyboards, storage, etc. The ThingPulse Pendrive S3 also supports CircuitPython, a subset of Python specifically for microcontrollers.

Features:

Applications:

  • BadUSB/ Rubber Ducky device for Key Stroke Injection/ Automation. A modified version of Super Wifi Duck (https://github.com/squix78/SuperWiFiDuck) can run Ducky Script and also simulate mouse movements. Scripts can either automatically run after plugin in or when touching the capacitive touch button
  • WiFi Dongle: networking device (see https://thingpulse.com/spicy-prototypes-esp32-s3-pendrive/)
  • WiFi Disk: memory stick with additional access over WiFi and a web server (also previous link)

While this USB might have hacking and experimental applications, it is equally useful as a memory stick. Acting as a WiFiDisk, the Pendrive S3 can be used to synchronize files on the disk to the cloud. Moreover, the WiFiDongle enabled by ESP32-S3 allows the device to have additional WiFi networking devices wherever plugged in. ThingPulse has added a capacitive touch button to the Pendrive S3 which makes triggering applications easier.

The ThingPulse Pendrive S3 is available on their website (now can be back ordered) at $25. The product page also has a small guide and videos for aiding set up and use.

Our readers can get a 5 USD discount by using this coupon code during checkout: pendrive-s3-electronics-lab

AAEON Introduces 13th Gen Intel Core Processing to the COM Express Type 10 Form Factor with its new NanoCOM-RAP

Compact, lightweight, and equipped with substantial upgrades on its predecessors, the NanoCOM-RAP represents a big step in AAEON’s adoption of cutting-edge Intel technology.

AAEON, a leading provider of Computer-on-Modules, has today announced the NanoCOM-RAP, a COM Express Type 10 CPU Module powered by 13th Generation Intel® Core™ processors. Available in SKUs ranging from the Intel® Processor U300E to the Intel® Core™ i7-1365UE CPU, the NanoCOM-RAP offers up to 10 cores, 12 threads, and high maximum turbo frequency across both its performance and efficient cores.

It is clear from the combination of high CPU performance and relatively low power consumption of its processor selection that the NanoCOM-RAP is catered towards customers that require a small, flexible, and scalable solution. This is particularly apparent in AAEON’s investment into the module’s memory and storage, where it has upgraded on the LPDDR4 offered by the NanoCOM-RAP’s predecessor by equipping the board with 16GB of LPDDR5. As a default, the NanoCOM-RAP offers two SATA drives, while additional expansion in this area can be found via four PCIe slots. 128GB of onboard NVMe is also available on an optional basis.

Key Specifications

  • Onboard LPDDR5, up to 16GB
  • Onboard NVMe, up to 128GB (Optional)
  • eDP x 1, DDI x 1 (3840 x 2160 at 60Hz)
  • USB 2.0 x 8, USB 3.2 Gen 2 x 2
  • PCIe [x1] x 4
  • 2.5GbE x 1
  • 2-Wire UART, an 8-bit GPIO, SMBus, and I2C
  • COM Express Type 10, 3.31” x 2.17” (84mm x 55mm)

Integrated Intel® UHD Graphics support dual display outputs via both DDI and eDP outputs with resolutions of up to 3840 x 2160 at 60Hz. This configuration, along with the module’s high definition audio interface lends the NanoCOM-RAP to use in the AI vision space.

AAEON’s COM express module line has become known for its flexible interface selection, and the NanoCOM-RAP continues this trend with a LAN port for Intel® Ethernet Controller I226-IT at 2.5GbE and multiple USB ports (eight USB 2.0 and two USB 3.2 Gen 2). Such a layout grants flexible options for peripheral device integration such as cameras and sensors.

The NanoCOM-RAP doesn’t lack serial communication options, listing two 2-Wire UART, an 8-bit GPIO, SMBus, and I2C, which lend the module to embedded industrial, robotic, and edge computing applications. Moreover, the module’s component design emphasizes its use in these fields, boasting a 9V ~ 15V power input range, onboard TPM 2.0, and an extremely lightweight build, weighing in at 0.15 lb. Given its already minimal 84mm x 55mm form factor, the NanoCOM-RAP therefore grants users an extremely easy route to deployment in tight spaces.

The module supports multiple operating systems, including Windows® 10 (64-bit) and Linux Ubuntu 22.04.2 with Kernel 5.19, providing flexibility for developers in different environments.

For more information about the NanoCOM-RAP, please visit the AAEON website, or contact an AAEON representative directly.

Lynred launches ATI640, easy-to-use VGA LWIR thermal imaging module for new market players in infrared

With offer of seamless IR assembly in any application, plug-and-play module makes thermal imaging more accessible to integrators of surveillance and defense, including drone systems

Lynred, a leading global provider of high-quality infrared sensors for the aerospace, defense and commercial markets, today announces the launch of ATI640, its plug-and-play, longwave infrared (LWIR) thermal imaging module with VGA resolution, for new market players seeking easier access to infrared (IR) technologies. With ATI640’s high image quality, reliability, user-friendly interface and seamless assembly, system developers can now integrate IR optronics without making a major investment or needing specialty knowledge in optical design, sensor calibration or image correction, which previously hindered wider adoption of IR technologies.

By stripping out the complexity in thermal imaging, Lynred’s ATI640 frees up the development time of system integrators, giving them more scope to focus on innovation and product quality, and thus increase their competitiveness with faster access to market.

ATI640’s plug-and-play solution makes infrared technology more accessible to new entrants in thermal imaging. In choosing this easy-to-use module, system integrators can speed-up their development of longwave infrared (LWIR) cameras and systems,” said Nadia Souhami, product unit director at Lynred. “ATI640 is the latest in a long line of thermal imaging innovations Lynred has brought to the market. We are excited about launching this module at Eurosatory and showing the power of its embedded image processing algorithms, while limiting the power consumption to just 1W. Our solution can bring smart thermal imaging with competitive advantages to any market application, drones in particular, which is a fast-growing market.”

Key product features

ATI640 is based on Lynred’s best-in-class, 640×480, 12µm pixel pitch sensor. It is designed with a SWaP-C (small Size, low Weight, low Power consumption, low Cost) core to optimize integration into optronic systems. The module is calibrated to work in shutterless mode to provide an uninterrupted video experience. Thanks to its shutterless operation and pairing with advanced image processing algorithms, ATI640 offers an excellent image quality with no trade-off on SWaP-C requirements. Its frame rate (60Hz) captures fast moving targets and produces smooth video footage. It is available with or without a lens.

Lynred will display ATI640, in conjunction with other new products, at Eurosatory, booth 5A-C155, taking place in Paris, France, June 17 – 21, 2024.

www.lynred.com

Qualcomm Announces the Edge AI RB3 Gen 2 Chip for IoT and Robotics and a “Micro-Power” Wi-Fi SoC

micro-power Wi-Fi system

Qualcomm has introduced two innovative products designed to advance the Internet of Things (IoT) and robotics projects: the RB3 Gen 2 system-on-chip (SoC) and a “micro-power Wi-Fi system” SoC. These new offerings aim to provide high-performance computing and significant power savings for embedded applications.

The RB3 Gen 2 SoC is built on the Qualcomm QCS6490 processor and delivers substantial improvements over its predecessor. It features a Kryo 670 CPU complex with a combination of high-performance and low-power cores, including one Cortex-A78 Kryo Gold Plus core running at up to 2.7GHz, three Cortex-A78 Kryo Gold cores at up to 2.4GHz, and four Cortex-A55 Kryo Silver cores at up to 1.9GHz. This configuration ensures robust performance for various IoT and robotics workloads.

The RB3 Gen 2 also boasts a sixth-generation Qualcomm AI Engine, equipped with Hexagon 770 tensor and scalar accelerators and vector processing extensions, delivering up to 12 tera-operations per second (TOPS) of AI computing power. This makes it well-suited for on-device AI tasks, enabling real-time processing and advanced machine-learning capabilities. Additionally, the SoC includes an Adreno 643L graphics processor and an Adreno 633 vision processing unit, enhancing its capabilities for computer vision and graphical applications.

Block Diagram
Block Diagram

Connectivity is another strong point of the RB3 Gen 2, which supports tri-band Wi-Fi 6E and Bluetooth 5.2 with Bluetooth Low Energy Audio. It also includes NFC support, a GNSS receiver for accurate positioning, and five camera inputs managed by a Spectra image processor. The SoC can handle up to two displays at 1080p144 on-device or 4k60 external, supporting both LPDDR5 and LPDDR4X memory. Qualcomm has committed to a 15-year availability under its longevity program, ensuring long-term support for developers and manufacturers.

Complementing the RB3 Gen 2 is the Qualcomm QCC730 SoC, a micro-power Wi-Fi solution targeting battery-powered IoT devices. According to Qualcomm, the QCC730 offers up to 88 percent power savings compared to previous-generation parts. It supports dual-band Wi-Fi connectivity and is designed to handle TCP/IP networking while maintaining low power consumption and a small form factor.

The QCC730 launches with an open-source integrated development environment (IDE) and software development kit (SDK) that includes cloud offload capabilities. This makes it easier for developers to integrate and deploy IoT applications. Qualcomm positions the QCC730 as a high-performance alternative to Bluetooth for IoT applications, given its superior power efficiency and robust networking capabilities.

Both the RB3 Gen 2 and QCC730 SoCs are designed to accelerate the development of advanced IoT solutions. The RB3 Gen 2 offers powerful AI processing and comprehensive connectivity options, while the QCC730 focuses on ultra-low power consumption for always-on, battery-powered devices. Together, these new products from Qualcomm provide a robust platform for the next generation of IoT and robotics applications.

More information on the RB3 Gen 2 is available on the Qualcomm website, along with two development boards built in partnership with Thundercomm — available to pre-order at $399 for the base Core Kit and $599 for the Vision Kit, which includes both high-and low-resolution camera sensors.

W01 U2500 by 52Pi: High-Speed Networking and NVMe Expansion for Raspberry Pi 5

52Pi W01 U2500 Compatibility

The W01 U2500 by 52Pi is a versatile HAT designed specifically for the Raspberry Pi 5, offering a unique combination of NVMe SSD expansion and USB 2.5G network capabilities. This compact solution is powered by the reliable Realtek RTL8156BG chipset, ensuring seamless integration with your Raspberry Pi 5 for high-speed data transfer and networking performance.

The W01 U2500 enables users to expand their storage capacity with NVMe SSD support, resulting in faster data access and improved system responsiveness. The built-in USB 2.5G network card provides lightning-fast connectivity, ideal for demanding applications, streaming, and online gaming. It’s important to note that the USB 2.5G Ethernet does not support the PoE protocol. Tailored for the latest Raspberry Pi model, the W01 U2500 ensures optimal compatibility. It supports installing NVMe (M-key) drives in M.2 format sizes 2230, 2242, 2260, and 2280, with no soldering required due to the included custom CNC SSD mount screw. The PCIe x1 interface supports both Gen2 and Gen3 standards, enhancing connectivity options.

52Pi W01 U2500 Interfaces
52Pi W01 U2500 Interfaces

The hollow design promotes excellent ventilation and cooling efficiency according to 52Pi. The gold-plated PCB ensures superior electrical performance and reliability, while the short trace routing of PCIe improves reliability and speed, fully meeting PCIe 3.0 signal requirements. An LED light for M.2 disk activity (“ACT”) provides clear status visibility. The board format adheres to the original Raspberry Pi HAT dimensions of 65 x 56.50 mm. The M.2 standard-compliant power system features an integrated voltage regulator delivering up to 3A for the 3.3V power rail.

In addition to the hardware, the package includes all necessary accessories such as an FPC PCIe ribbon, M2 and M2.5 screws, spacers, and an extra custom CNC SSD mount screw. The PCB also has openings for routing two Display/Camera FPC cables, providing flexibility for various project needs. With its blend of high-speed networking and NVMe SSD expansion, the W01 U2500 by 52Pi is an excellent addition for Raspberry Pi 5 users looking to enhance their system’s storage and connectivity capabilities.

The 52Pi Product W01 U2500 is now available to order on the official web store, priced at $29.99; additional information is available on the 52Pi wiki.

Qualcomm’s RB3 Gen 2 Development Kit: Advanced IoT Development Platform

RB3 Gen 2

The Qualcomm® RB3 Gen 2 Development Kit is the latest iteration in the RB3 series, designed to enhance performance and accessibility for IoT development. Powered by the advanced Qualcomm® QCS6490 Chipset, this kit offers a significant upgrade over its predecessor, with substantial improvements in AI computing and overall processing capabilities.

Key features of the Qualcomm® RB3 Gen 2 Development Kit include a powerful QCS6490 processor, which supports a variety of Linux-based distributions tailored for IoT applications. The AI computing performance has quadrupled, reaching an impressive 12 TOPS. This development kit is compatible with multiple SDKs and tools, such as the Qualcomm® Neural Processing SDK for AI, Qualcomm® Intelligent Multimedia Product SDK, and Qualcomm® Intelligent Robotics Product SDK. Additionally, it provides a comprehensive set of demo applications and tutorials to accelerate IoT application development. The kit adheres to the 96Boards specification and supports a wide array of sensors, including multiple cameras, depth sensing solutions, and various other sensors like IMU, pressure sensors, and magnetometers.

Qualcomm® RB3 Gen 2 Development Kit

The RB3 Gen 2 offers robust AI processing and computer vision capabilities, making it suitable for a broad range of IoT solutions across enterprise, robotics, industrial, and automation sectors. It features support for Qualcomm® Linux®, a complete package of OS, software, tools, and documentation specifically designed for Qualcomm’s IoT platforms. The QCS6490 chipset significantly boosts AI processing capabilities, enabling higher inferences per second, improved power efficiency, and the ability to run multiple networks simultaneously. This on-device machine learning capability, combined with edge computing, allows for near real-time processing of vast data amounts.

Qualcomm® RB3 Gen 2 Development Kit Features:

  • Advanced ISPs for superior image and video capture with single or multiple concurrent camera support.
  • AI-accelerated workplace security and visibility.
  • Multi-gigabit Wi-Fi 6E for fast, low-latency wireless connectivity.
  • Superior Bluetooth® 5.2 and LE audio with low latency and extended range.
  • Low-speed expansion for GPIOs, I2C, SPI, UART, and audio.
  • High-speed expansion for PCIe, USB, MIPI CSI/DSI, and SDIO, designed for 96Boards mezzanines.

The development kit includes hardware that complies with the 96Boards open hardware specification, allowing for a range of mezzanine-board expansions, starting with the Vision Mezzanine. The Qualcomm® Spectra™ ISP 570L image processing engine delivers exceptional photography and videography experiences. It supports connections to multiple cameras, including stereo, depth, and Time-of-Flight (ToF). The Qualcomm® Adreno™ 633 VPU provides UltraHD video encoding and decoding, while the Adreno 1075 DPU supports both on-device and external UltraHD displays. Additionally, the kit features multi-gigabit Wi-Fi 6E for fast wireless connectivity and low latency, along with advanced features such as Qualcomm® 4K QAM and support for high-speed 160MHz channels.

Block Diagram

The Qualcomm® Kryo™ 670 CPU and Qualcomm® Hexagon™ processor with a fused AI-accelerator architecture ensure powerful connections and computing performance. This makes the RB3 Gen 2 development kit ideal for various industrial and commercial IoT applications, including ruggedized handhelds, human-machine interface systems, point-of-sale systems, drones, kiosks, edge AI boxes, and connected cameras.

Qualcomm RB3 Gen 2 platform is available for pre-order now on Thundercomm for $399 (Core Kit) and $599 (Vision Kit) with a 12V wall power supply, a USB Type-C cable, mini speakers, a setup guide, and a pick tool for setting switches, and the Vision Kit also adds a mounting bracket for the high-resolution and low-resolution CSI cameras part of the kit. More details may be found on the product page.

Pomelo: Affordable and Versatile Gamma Spectroscopy Module for Hobbyists and Developers

Pomelo Gamma Radation Detector

Pomelo is an innovative radiation detector tailored for hobby-level gamma spectroscopy, designed to be both accessible and versatile. Developed to provide a complete low-power gamma-ray spectrometer, Pomelo can function independently or be seamlessly integrated into other projects, offering a broad range of applications for enthusiasts and developers alike.

The Pomelo gamma spectroscopy module is built around a set of well-defined requirements, prioritizing low cost and low power consumption. The target is to keep the component cost below 150 euros, making it an affordable option for hobbyists and educational purposes. At its core, the module utilizes a commercial off-the-shelf (COTS) scintillator and a silicon photomultiplier (SiPM), ensuring reliability and performance.

The detector assembly, branded as Pomelo Physics, comprises a CsI(Tl) scintillator measuring 10mm x 10mm x 30mm from OST Photonics and a Broadcom AFBR-S4N44P014M SiPM. This combination effectively detects gamma rays within an energy range of 50 keV to 3 MeV. To maintain accuracy and protect the SiPM from stray light, the scintillator is housed in a 3D printed dark box. Additionally, the module includes a Texas Instruments TMP126 temperature sensor to provide temperature compensation, ensuring consistent performance across varying environmental conditions.

Block Diagram
Block Diagram

Pomelo Core, the accompanying electronics module, integrates several features that enhance its functionality and ease of use. It includes a bias supply, an analog front end, and digital electronics, all essential for effective gamma ray detection and data processing. One of the standout features of Pomelo is its versatile connectivity options. The module supports USB connectivity (CDC) for data dumping to a terminal, making it straightforward to interface with laptops and other USB-equipped devices. Additionally, it features UART for interfacing with external microcontroller units (MCUs), such as Arduinos or Raspberry Pis. The onboard level shifter on the UART lines ensures compatibility with both 3.3V and 5V systems.

Pomelo is designed to be user-friendly while offering robust performance. It supports onboard histogramming and run control, enabling spectrum readout, reset functions, and timed measurements directly from the device. For more advanced applications, the module provides a list-mode data option, allowing detailed analysis of individual gamma events.

Furthermore, Pomelo includes dedicated hardware handshaking for coincidence measurements with two devices, enhancing its capability for complex experiments. The software-configurable energy threshold adds another layer of customization, allowing users to tailor the module’s sensitivity to specific requirements.

Pomelo stands out as a comprehensive solution for gamma spectroscopy, combining affordability, low power consumption, and versatile connectivity in a compact design. Its integration of commercial scintillator and SiPM components, coupled with thoughtful features like temperature compensation and coincidence measurements, makes it a powerful tool for hobbyists, educators, and developers exploring the fascinating world of gamma spectroscopy. Whether used as a standalone device or integrated into larger projects, Pomelo offers everything needed for effective gamma ray detection and analysis.

more information: https://hackaday.io/project/194457-pomelo-gamma-spectroscopy-module

Arduino Unveils Opta Digital, Analog Expansion Modules for Bigger PLC Projects

Arduino has announced two new entries in its Opta programmable logic controller (PLC) family, designed for those projects that are a little too complex for a single controller: the Opta Digital and Opta Analog Expansion Modules. These new modules offer additional pins and true analog outputs for the analog variant, enhancing the flexibility of any Opta PLC.

“Enhance your Arduino Opta’s real-time control, monitor, and predictive maintenance applications thanks to the Arduino Pro Opta Expansions,” the Arduino team writes of its latest launch. “Quickly put them to work, managing the new I/Os [Inputs/Outputs] from the Opta base unit seamlessly, taking advantage of the open and widely known Arduino ecosystem or PLC IDE IEC 61131-3 programming environment.”

Arduino launched the Opta micro PLC family in November 2022 as it looked to branch out into the industrial programmable logic controller market — complete with a new development environment with support for IEC 61131-3-standard PLC languages, including ladder logic and function block diagrams. Earlier this month, the company launched the PLC Starter Kit, which offers Opta WiFi along with Simulat8 and DIN Celsius add-ons and a 20-hour course to introduce PLCs in general and the Opta and its development environment specifically.

Expansion Socket

The new expansion modules target applications where the base Opta PLCs lack enough connectivity and deliver a cheaper and more easily managed alternative to simply adding additional PLCs into the mix. Mimicking the form factor of the Optas themselves, the expansion modules connect at the side and deliver either additional digital or analog connectivity — all managed from the base Opta using a simple library. Up to five modules can be connected to a single Opta, Arduino has confirmed, connecting side-by-side through their expansion ports.

Digital Expansion Module and Analog Expansion Module
Digital Expansion Module and Analog Expansion Module

The Arduino Opta Digital Expansion Modules come in two varieties: the D1608E offers 16 programmable inputs, which can be used as 0-24V digital or 0-10V analog inputs, and eight electromechanical relays supporting 240V AC at up to 6A; the D1608S has the same 16 voltage inputs but swaps the electromechanical relays for solid-state versions supporting 24V DC at up to 2A. The Arduino Opta Analog Expansion Module, code A0602, meanwhile, adds six analog inputs that can be configured to read voltages from 0-10V, current up to 20mA, and two of which can read temperatures from optional RTD PT100 sensors, four digital outputs with pulse-width modulation (PWM) support, and two true analog outputs supporting 0-10V or up to 20mA programmable output — a feature missing from the unexpanded Opta PLCs.

The Arduino Opta Digital Expansion Modules are the first available, with the Analog Expansion Modules to follow; the D1608E is priced at $136.80 and the D1608S at $146.40, both on the Arduino Store.

Seamless Worldwide IoT: Conexio Debuts Stratus Pro with Global Cellular Compatibility

Conexio Technologies has unveiled the Conexio Stratus Pro, an advanced cellular-based microcontroller board designed for IoT applications. This new product, available soon on Crowd Supply, features the Nordic Semiconductor nRF9161 SiP and nPM1300 PMIC in a Feather form factor, enhancing its versatility and performance for diverse projects.

The Stratus Pro integrates a Nordic Semiconductor nRF9161 system-in-package (SiP) that includes a microcontroller, LTE cellular radio, and GPS receiver. Additionally, the board houses a Nordic nPM1300 power management IC (PMIC) and a TI BQ25185 IC for charging various battery chemistries such as Li-ion, Li-Poly, and LiFePO4. An STMicroelectronics three-axis accelerometer further extends its functionality. The nRF9161 features an Arm Cortex-M33 with 1MB of flash memory and 256KB of RAM, supported by an external 16-kilobit EEPROM. The cellular modem is compatible with LTE-M and NB-IoT and is DECT NR+ ready, ensuring robust global connectivity.

Stratus Pro Back
Stratus Pro Back

Adopting the Adafruit Feather form factor, the Stratus Pro’s PCB measures 66.04 x 25.40 millimeters, offering 28 GPIO pins, a programmable push button, and an LED. It includes a SparkFun Qwiic-compatible connector for easy peripheral connections without soldering and can be programmed via USB-C or the onboard SWD/JTAG connector. Designed for seamless global use, the device supports eSIM and software SIM, providing reliable connectivity in over 100 countries. It comes with a data plan offering 500MB of cellular data and 250 SMS messages, valid for 10 years.

Conexio plans to open-source the Stratus Pro hardware design post-Crowd Supply campaign. Software examples and board design files will be available on Conexio’s GitHub, with projects built using the Nordic nRF Connect SDK on the Zephyr RTOS. Comprehensive documentation is available now, inviting users to explore the full potential of the Stratus Pro.

For more information, check out the Stratus Pro Crowd Supply campaign page. There, you can sign up for notifications for when the campaign goes live.

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