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23 May 2015


Smaller than a standard playing card, the DragonBoard™ 410c packs a lot in a tiny footprint, including a quad-core 1.2Ghz Snapdragon 410 processor, 1GB RAM, 8GB eMMC storage, Wifi, GPS, and Bluetooth.

The DragonBoard™ 410c offers a fully integrated solution of hardware and software that is designed to erase technical limitations and offer unparalleled versatility for any project.

The DragonBoard™ 410c was designed to inspire the limitless possibilities of your imagination. Don’t be afraid to think big.

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DragonBoard™ 410c – The Dragon Is Coming – [Link]

23 May 2015

Teardown of Given RF pillcam.

Another pill-cam teardown – [Link]

23 May 2015

What’s inside the a 1987 vintage Sharp X68000 personal computer / gaming system from Japan?
Sold exclusively in Japan from 1987 to 1993 this 10MHz 68000 based boasted graphics capability superior to the Amiga and Atari ST. The powerful graphics enabled pixel-perfect ports of clasic games arcade games, and the machine was highly sought after by gamers. Running a custom operating system called Human68K, it even had 3D goggle support.

EEVblog #746 – Sharp X68000 Retro Computer Teardown – [Link]

22 May 2015


by Darren Quick @ gizmag.com:

Expanding on previous research into electronic devices that dissolve in water once they have reached the end of their useful life, researchers at the University of Illinois have developed a new type of “transient” electronic device that self-destructs in response to heat exposure. The work is aimed at making it easy for materials from devices that usually end up in landfill to be recycled or dissolved completely.

The research involved a group led by aerospace engineering professor Scott R. White teaming up with John A. Rogers, who previously led work in the development of transient electronics that biodegrade in water. These previous devices dissolved in water after a predetermined period of time, which was related to the thickness of outer protective layers encapsulating the actual electronics. But using heat as a trigger has now enabled the creation of electronic devices that can be prompted to self-destruct on demand.

Things heat up for self-destructing electronic devices – [Link]

22 May 2015

This design is a battery management circuit, which involves the use of CAN/LIN interface. The system addresses the matter about managing rechargeable batteries. This design features an 8-output hardware configurable, high side/low switch with 16-bit serial input control using the serial peripheral interface (SPI). Two of the outputs are directly controlled using a microcontroller which are applicable in pulse-width modulation. The design also features high-speed CAN interface that is use to convert digital protocol information into an analog CAN communication.

The RD9Z1-638-4Li reference design is a Battery Management System (BMS) for 4-Cell Li-Ion battery applications featuring the MM9Z1_638 Battery Sensor Module. The RD9Z1-638-4Li is built to demonstrate the product capabilities in a 4-cell Li-Ion application where high EMC performance is required to obtain high accuracy measurements on key battery parameters. The board features an 8-pin standalone CAN transceiver to interface with others modules. Very high EMC robustness and performances are achieved by the Freescale MC33901 CAN High-Speed Transceiver. For cell balancing function and general purpose switches, the board features the Freescale MC33879 Configurable Octal Serial Switch.

The design is useful to automotive applications such as engine management, climate controls, communications and safety systems. The circuits function is suitable for a hybrid electric vehicle which monitors the condition of individual cells which make up the battery and maintains all the cells within the operating limits. It also provides information on the state of charge (SOC) and state of health (SOH) of the battery.

Intelligent 4-Cell Lithium Battery Management with CAN/LIN Interface – [Link]

22 May 2015


From a wide offer of solders from company Stannol, it´s easy to choose the most suitable type meeting your demands.

The solder matters, it is an undisputable fact confirmed daily in a development and production of electronics. Hand soldering of prototypes, automated machine soldering, soldering of small SMT components or on the in contrast soldering of big joints of massive connectors, rework, … all that wants a solder optimized for a given usage.
As we know, features of a solder wire are determined by an alloy itself (PbSn xx, SnAg xx, …) but in a considerable extent also a flux used. A flux has a big influence mainly on a soldering process, spreading of solder (often even on partially oxidized surfaces), spitting at hand soldering, etc. That´s why despite of often similar specification (according to datasheets), it is still possible to see considerable differences among solders after all. Besides the most important parameters like composition of alloy and flux properties, some features (like spitting and solder spreading) can be really evaluated only at working with a given type.

Over 130-years experience of German company Stannol give a guarantee, that in their portfolio can be found a type suitable even for your work. In a Stannol catalogue can be found favourite “universal” types suitable for the most types of works in electronics and electrotechnics (for example HS10, HF32, Kristall 400) but also specialized types suitable even for soldering of poorly solderable surfaces.

The principle of Stannol products marking is in it, that they are marked by a flux type (HS10, HF32,…) and by an alloy used (Snxx, SnPb,…). A solder wire is available in many combinations flux / alloy , that´s why it is suitable look at their properties in detail and then to choose a suitable type. On stock we keep the most favorite types with fluxes HS10, HF32 or 2630, suitable for majority of joints.

  • HS10 – no-clean flux containing halides, based on a natural resin (colophony). Outstanding properties regarding spreading and electrically safe residues. The flux is non-corrosive on non-ferrous materials. The most popular type for electronic industry.
  • HF32 no-clean halide-free flux with an activated resin (colophony). Outstanding combination of high activity, good wetting properties and small amount of residues. Residues are transparent, hard, dry and non-corrosive. Very suitable even for SMT components, high reliability of joints. Special version HF32 SMD features even lower flux content and leaves minimum residues, that´s why it´s very suitable even for rework, manual adding of components to PCB and similar.
  • 2630 – the most active no-clean flux containing halides. Usable even on places where HS10 is not sufficient. Ideal for surfaces with poor solderability as well as for soldering of bigger joints (thicker copper wires etc.).

Upon request, we´re able to provide you with another types from Stannol production, for example Kristall 400 – no-clean halide-free flux with synthetic resins, with transparent residues and good activity, able to provide excellent soldering results. In general, fluxes, which contain halides are more active and at soldering they feature better wetting. On the other side halide-free fluxes are more safe in respect of possible corrosion around a solder joint and modern fluxes already have very good wetting properties. Normally, neither halide fluxes marked as “no-clean” don´t cause corrosion around a solder joint but at certain circumstances (for example devices intended for very humid conditions) it may be necessary to wash soldered joints from flux residues.

Detailed information will provide you the attached table as well as Stannol catalogue, overview of Stannol soldering materials, overview of Stannol solder wires and overview of soldering fluxes standards.

Find the right solder for you – [Link]

22 May 2015


by Steven Keeping @ digikey.com

The wearables market is booming. Statistics aggregator web portal Statista, notes that the global market will be worth over $7 billion this year and $12.6 billion by 2018.

Although the potential rewards are high, this is not an easy market to enter. Designing smart watches or fitness bracelets is tough; consumers expect lots of functionality, smartphone connectivity, compact form-factor, light weight, and long battery life. The introduction of highly integrated, ultra-low-power microprocessors and wireless chips has eased the design process, but squeezing out all of the battery’s power remains key to a wearable product’s success.

This article takes a look at how silicon vendors help wearables designers extend battery life by offering power-frugal displays, microcontrollers (MCU), silicon radios, and power-management chips designed specifically for ultra-low-power applications.

Extending Battery Life in Wearable Designs – [Link]

22 May 2015


by elektormagazine.com:

Altium have decided to release their PCB design tool CircuitMaker as open beta. It will be available worldwide to all interested electronics designers, electronic makers and the hobbyist community as a free software offering. Anyone interested in participating in the open beta can register now at the CircuitMaker website.

The open beta testing program allows anyone to download and begin using CircuitMaker today and become part of a growing electronics design community where designs can be shared and collaborated on. The company anticipates that this open beta process will also provide feedback and input to help refine CircuitMaker and make it a useful design tool for designers in the maker community.

Altium CircuitMaker now Open Beta  – [Link]

22 May 2015


by elektormagazine.com:

SiTime Corporation has introduced a new family of µPower MEMS Oscillators for the wearable, IoT and mobile markets. Compared to an equivalent quartz oscillator the SiT8021 consumes 90% less power, is 40% smaller and 70% lighter. These best in class specifications enable the longest battery life as well as the smallest size and weight for smart watches, fitness bands, tablets, smart phones, portable audio and accessories.

The devices use the SiTime MEMs TempFlat technology which gives excellent stability against temperature changes without the need for temperature sensing and compensation networks.

Tiny µPower MHz MEMS Oscillators – [Link]

21 May 2015

The design of the circuit is a DC to DC converter. It supports up to 1.5A on VCORE. It features a DC/DC converter that provides power to MCUs. It also deals with the optimization of energy consumption by using DC/DC linear regulators and ultra-low-power saving modes. The model contains a Serial Peripheral Interface (SPI), an advanced functional safety measure that allows control and diagnostics with the MCUs.

The KIT33907AEEVB and KIT33908AEEVB evaluation boards demonstrate the functionality of the SMARTMOS MC33907 and MC33908 power system basis chips, respectively. These ICs are equipped with an intelligent power management system including safety features targeting the latest ISO26262 automotive functional safety standard. The evaluation board is a standalone board that can be used either with a compatible microcontroller or with PC. In the latter case, it is necessary to use a KITUSBSPIDGLEVME accessory interface board. The MC33907 and the MC33908 are multi-output ICs with power supply and HSCAN transceiver. These devices have been designed specifically for automotive market. All features of thse two ICs are the same except that the MC33907 is designed to support up 800 mA on VCORE, while MC33908 will support up to 1.5A on VCORE.

The DC to DC converter that supports up to 1.5A on VCORE has the following applications: electrical power steering, engine management, battery management, active suspension, gearbox, transmission, electrical vehicle (EV), hybrid electrical vehicle (HEV) and advanced driver assistance systems

Safe DC/DC Converter up to 1.5 A – [Link]





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