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Modos Flow - A 60Hz E-Ink Monitor Powered by AMD Zynq 7000 SoC
GigaDevice Enters EEPROM Market with Rugged GD24CL Series
Orange Pi 6 SBC packs CIX P1 SoC, 45 TOPS AI, dual 2.5GbE, and LPDDR5
Roundup: New Digital Isolator Launches Target Industrial and Automotive Systems
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
How to Clean a Soldering Iron Tip Without Ruining It
Why PVC Remains a Go-To Material for Electronics Enclosures and Equipment Mounts
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
Three chipmakers roll out isolators addressing RS485 links, low-power quad channels, and integrated power delivery for compact...
Powered by the NXP i.MX95, the Catalina GW9200 Embedded SBC offers 10GbE, modular expansion, Linux support, and up to 2 TOPS AI...
Matter-enabled DIN rail smart switch with energy monitoring, overload protection, and support for high-power loads up to 7,680W.
A compact industrial system with DDR5 support, dual LAN ports, and wide-temperature operation targets automation, signage, and...
Fanless industrial mini-PC with Alder Lake-N/Twin Lake CPUs, dual HDMI 4K, up to 16GB LPDDR5, NVMe support, dual LAN, wide 9–36V i...
Compact RK3588 board with 6 TOPS NPU, PCIe, 8K video, multi-display output, and industrial I/O for edge AI and embedded systems.
The CEXD-INTRBL open robotic system utilizes Intel Core Ultra (Series 3) architecture and delivers up to 180 TOPS AI performance,...
The new TDB series offers a 1.27 mm half-pitch, surface-mount DIP switch solution with gold-plated contacts and a washable...
The device is the latest addition to the dsPIC33A family, featuring a 200 MHz 32-bit core, 78 ps high-resolution PWMs, and...
The company’s latest automotive multilayer ceramic capacitors (MLCCs) offer increased capacitance for their size, targeting a...
The new heat sinks target THT-TO packages and flat-surface ICs, with pre-coated thermal interface material variants available...
The new transparent film combines the companies’ proprietary technologies to enable capacitive touch and ultra-sensitive pressure ...
