Join the Community
Main Menu
World’s First IEEE 802.15.4ab Receiver Debuts from imec
Espressif ESP32-S31 CoreBoard and Korvo Kits Target AIoT, HMI, and Smart Audio Apps
Menlo Micro's MM5800 Brings Micromechanical Switching to 70 GHz
Υouyeetoo R1 v3.0 Combines Rockchip RK3588S SBC and NFC Support
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
How to Clean a Soldering Iron Tip Without Ruining It
Why PVC Remains a Go-To Material for Electronics Enclosures and Equipment Mounts
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
Multipurpose Motor Driver Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
A compact industrial system with DDR5 support, dual LAN ports, and wide-temperature operation targets automation, signage, and...
Fanless industrial mini-PC with Alder Lake-N/Twin Lake CPUs, dual HDMI 4K, up to 16GB LPDDR5, NVMe support, dual LAN, wide 9–36V i...
Compact RK3588 board with 6 TOPS NPU, PCIe, 8K video, multi-display output, and industrial I/O for edge AI and embedded systems.
The CEXD-INTRBL open robotic system utilizes Intel Core Ultra (Series 3) architecture and delivers up to 180 TOPS AI performance,...
The new TDB series offers a 1.27 mm half-pitch, surface-mount DIP switch solution with gold-plated contacts and a washable...
The device is the latest addition to the dsPIC33A family, featuring a 200 MHz 32-bit core, 78 ps high-resolution PWMs, and...
The company’s latest automotive multilayer ceramic capacitors (MLCCs) offer increased capacitance for their size, targeting a...
The new heat sinks target THT-TO packages and flat-surface ICs, with pre-coated thermal interface material variants available...
The new transparent film combines the companies’ proprietary technologies to enable capacitive touch and ultra-sensitive pressure ...
Tektronix has added extreme temperature probe tips to its IsoVu isolated current probe platform, enabling direct current...
Built around TI’s AM62Lx processor, this compact SoM offers Cortex-A53 performance, Linux support, and multiple interfaces for I...
Compact AM62 OSM-MF module combines Cortex-A53 processing, RTOS support, PRU I/O, and industrial interfaces for automation, HMI,...