Month: October 2018

Libre Computer has successfully launched a smaller, less powerful follow-up to its Le Potato SBC, the “La Frite SBC. The La Frite SBC is a small version of the Le Potato SBC, that has a quad -A53, HD-only Amlogic S805X, a Raspberry Pi A+ footprint and GPIO connector, and mainline Linux...

SP209 series logic analyzers and protocol decoders offer in depth analysis of logic signals and protocols with 200MHz (5ns) timing resolution. 9-channel operation allows 8-bit parallel data to be captured along with a clock or strobe signal. SP Series is composed of two devices, SP209...

Laird’s BL651 Series contains the latest Nordic nRF52810 silicon with Bluetooth 5 Low Energy capabilities and groundbreaking ultra-low power performance. Building on Laird’s multi generation module developments utilizing Nordic silicon (BL600, BL652, BL654) – now comes the latest...

This is a LM5010 buck-boost regulator able to convert a positive input ranging from 10-50Vdc to -12V output. by Robert Bell @ www.edn.com Buck regulators find wide application as step-down regulators for converting large positive input voltages into a smaller positive output voltages....

PureThermal Mini is a hackable thermal webcam for the FLIR Lepton (2.x - 3.x) LWIR camera core. It is the result of listening to our thousands of PureThermal 1 users and giving them what they want: four mounting holes, pads for optional EM shielding, less complex circuitry, and perhaps...

STMicroelectronics has introduced two STM8* Nucleo development boards, letting the 8-bit world experience the ease of access and extensibility already proven with the STM32* Nucleo range. Leveraging the formula that has kickstarted countless STM32 embedded projects, the STM8 Nucleo...

DisplayModule introduced a tiny 2.1" E-paper display with 212x104 pixels resolution. The display can be interfaced using SPI and a Raspberry Pi shield is available for the ones that what to connect it to the popular SBC. Features Flexible and 0.3mm thickness E-Paper 2.13 Inch...

A new study about "Reduction of overheating of 2D materials" published in the Journal of Advanced Materials. The work put behind the study is credited to the researchers at the University of Illinois at Chicago College of Engineering. By joining together two-dimensional materials used...