SECO, the company behind the brilliant UDOO X86, recently announced the release of another version of the board which is being called the UDOO X86 II SBC. While the UDOO x86 development board which was introduced in a crowdfunding campaign has grown in leaps and bounds with several...

The IWR6843 antenna-on-package (AoP) evaluation module (EVM) is an easy-to-use mmWave sensor EVM with integrated, short-range, wide field-of-view (FoV) AoP technology, which enables direct connectivity to the mmWave sensors carrier card platform (MMWAVEICBOOST) and allows for...

IBASE Technology Inc. (TPEx: 8050), a world leading provider of industrial computers and embedded computing solutions, releases the IB918 3.5-inch Disk-Size SBC based on the AMD Ryzen™ Embedded V1000/R1000 SoC. The IB918 allows system designers to create feature rich systems...

The BlueNRG-M0 is a very low power network processor module for Bluetooth® low energy v4.2. The BlueNRG-M0 is an easy to use Bluetooth® low energy master/slave network processor module, compliant with Bluetooth v4.2. The BlueNRG-M0 module supports multiple roles simultaneously, and...

Zak Kemble build another great project. This time it's a bench power supply with a laptop brick input. The power supply needed sufficient cooling so he added a small Fan and a controller a the edge of the board. He writes: Many years ago (September 2009) I made a simple bench power...

Adam Bender writes: Designing a custom lithium battery pack is a fun way to learn about electricity and engineering. Lithium batteries can be used for countless applications including electric bikes, scooters, vehicles, backup power suppliers, off the grid solutions, and much more....

Tesmo Kickstand weighs only 17g yet able to hold up to 17.6lbs, and the reusable design gives you the mobile convenience than ever. Tesmo Kickstand is a great little accessory for your laptop, but not limited. It can easily be used on tablets and mobile phones as well. It's a...

There are several ways to design a system-on-module to carrier board interface, one method is to design an LGA (Land Grid Array) module, which have to be soldered straight unto the carrier board, and enables much more compact system-on-modules, and that’s exacty what TechNexion has...