Low-power COM Express Module with AMD Ryzen™ Embedded V1000/R1000 SoC

IBASE Technology Inc., a leading provider of industrial motherboards and embedded solutions, announces the launch of the ET977 low-power COM Express Compact Type 6 modules, which are based on the AMD Ryzen™ Embedded SoC to enable next-generation embedded designs. The series targets a wide range of applications including AIoT, retail, medical, transportation, automation and gaming fields.

“The ET977 COM Express module allows IBASE customers to deliver compact embedded solutions with a new class of performance and power efficiency,” said Wilson Lin, Director of IBASE Product Planning Department. “Built with the AMD Ryzen™ Embedded V1000/R1000 SoC, it is very suitable for modular designs and platforms that require high scalability to meet customers’ time-to-market needs.”

The new ET977 provides powerful computing with ‘Zen’ CPU cores and excellent image processing performance with the integrated AMD Radeon Vega graphics with 3 compute units to deliver stunningly visual experiences. It features four (V1000) or three (R1000) independent displays (HDMI/DVI/DP, LVDS or eDP) with up to 4K UltraHD resolutions and two DDR4 SO-DIMM slots for up to 32GB memory and with ECC compatibility.

The unit provides a wealth of advanced connectivity options including 2x serial, 4x USB 3.1, 8x USB 2.0, and 2x SATA 6Gb/s ports, as well as high-speed PCIe 3.0 lanes. Measuring 125mm x 95 mm, the Computer-on-Module is available in V1807B and V1605B variants for high computing and R1606G variant for low-power applications. Both Windows 10 and Linux Ubuntu are supported.

ET977 FEATURES:

• Onboard AMD Ryzen™ Embedded V1000/ R1000 processor
• 2x DDR4-2400 SO-DIMM sockets, Max. 32GB, ECC compatible
• Supports up to 4x independent displays (HDMI/DVI/DisplayPort, LVDS, and eDP) via the carrier board
• 4x USB 3.1, 8x USB 2.0, 2x SATA III
• Supports TPM 2.0

For more information, please visit www.ibase.com.tw

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