Tag: Infineon

Infineon Technologies’ new XENSIV KP276 absolute pressure sensor series covers a range of 10 kPa to 400 kPa, is highly accurate and has fast measurement and communication. The new digital sensor is intended for applications such as the measurement of manifold air pressure...

Infineon Technologies will launch a monolithically integrated linear Hall sensor which was developed entirely according to the safety standard ISO26262 for automotive applications. With just one device, the XENSIV TLE4999I3 enables the development of fault-tolerant systems that have to...

With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world...

Two linear LED controller ICs have been added to the BCR portfolio, by Infineon Technologies. The BCR601 has voltage feedback to the primary side (also known as active headroom control or AHC), for cost effective and power efficiency LED driver applications. The BCR602 targets dimmable...

600V intelligent power modules (IPMs) from Infineon make up the CIPOS Micro IPMs. They are qualified for harsh humid environments, passing 1000 hours of high voltage, high temperature and high humidity reverse bias (HV H3TRB) stress testing. This makes the energy-efficient IPM suitable...

Adding to its high current system chipset portfolio, Infineon claims to offer the industry’s first 16-phase digital PWM multiphase controller. The XDPE132G5C extends the existing portfolio which enables currents of 500 to 1000A and above for next generation CPUs, GPUs, FPGA and ASICs...

Based on Infineon's thin wafer technology, a family of 40V MOSFETs are claimed to enable "significant performance benefits" and will cover a wide voltage range. The OptiMOS 6 family has been optimized for synchronous rectification in switch mode power supplies (SMPS) for servers,...

Infineon Technologies AG is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in...