Toradex, a Swiss embedded technology firm announced the world’s first embedded board built on NXP’s i.MX8M QuadMax back in Mar. 2017. Recently, Toradex has opened early access for selected customers to the SODIMM-style Apalis iMX8 module. A sign-up form offers the potential for newcomers to get an early look.
This new Linux powered, wireless-enabled Apalis iMX8 uses the QuadMax, which is the most powerful i.MX8 Quad model. Like the Quad and QuadPlus, it offers 4x 1.26GHz Cortex-A53 cores, 2x 266MHz Cortex-M4F cores for real-time processing, one or two Vivante GC7000LiteXS/VX GPUs, and a HIFI4 DSP. The QuadPlus adds a 1.6GHz Cortex-A72 core, and the Apalis i.MX8’s QuadMax provides two -A72 cores. The module supports up to 4 GB LPDDR4 RAM.
The Cortex-A cores run a “Yocto Project“ based Linux distribution provided via a BSP (Board Support Package). The M4F MCU cores run FreeRTOS which is also provided by the same BSP. With its dual GPUs, the Apalis iMX8 supports multiple-screen automotive installations. However, the module is designed for a broader range of cutting-edge computer vision systems, as well as signal processing and HMI applications. The module offers onboard, dual-band 802.11ac WiFi, and the dual-mode Bluetooth module is said to be Bluetooth 5.0 ready.
The module is equipped with 2x PCIe Gen 3 interfaces, 3x CAN, 4x SPI, 7x UART, and 8x analog inputs. The I2C count has increased to 7x, and the PWM count has advanced to 6x. You also get an IrDA connection, up to 133 GPIOs, and 8- and 4-bit SDIO/SD/MMC interfaces. The Apalis iMX8’s SATA interface has moved from SATA II to III. As before, there’s a GbE (Gigabit Ethernet) controller with a second RGMII. You get a USB 3.0 host interface, and 3x USB 2.0 host ports, one of which is OTG.
The module provides a quad-lane MIPI-DSI interface and offers an HDMI 2.0a interface for up to 4K UHD 2160p. There’s also a single/dual-channel LVDS interface with up to 1920 x 1200 x 24bpp resolution and 4-wire resistive touch. One new feature is a choice of DisplayPort 1.3 or eDP 1.4. An optional 5MP camera module is supported by dual quad-lane MIPI-CSI interfaces. Analog audio I/O includes a stereo line in, mono mic in, and stereo headphone out interfaces.
The Apalis i.MX8 offers the same two carrier board options provided for the Apalis TK1: a 250 x 250mm Apalis Evaluation Board, as well as a less feature-rich, 125 x 90mm Ixora Carrier Board. The boards have real-time clocks and 7-27V DC input support. The Apalis i.MX8 appears to be ready to ship soon to qualified early access providers. You can sign up to apply for early access on the Apalis i.MX8 product page.
American microcontroller manufacturer company Microchip has unveiled an open source, mainline Linux ready “SAMA5D27 SOM” module. This module is based on a SiP implementation of its Cortex-A5-based SAMA5D27 SoC with 128MB RAM. The 40 x 38mm module is also compatible with a SOM1-EK1 dev board.
The SAMA5D27 SOM is Microchip’s first computer-on-module based on a Linux-ready application processor, and the first SiP-based module built around a SAMA5 SoC. It is mainly designed for rugged IoT applications and the module can be soldered onto a baseboard for versatile ease of use. It offers long-term availability and supports industrial grade -40 to 85°C temperature range.
The SAMA5D27 SOM1 combines the RAM-ready SAMA5D27C-D1G SiP with 64Mb of non-volatile QSPI boot flash and a 10/100 Ethernet PHY. The module also integrates a 2Kb EEPROM with pre-programmed MAC address. The SOM is further equipped with a PMIC and a 3.3V power supply. Typical power consumption ranges from 120mA to 160mA. There’s also a 60mA idle mode and an ultra-low 30mA mode.
This module has 128 GPIO pins including 2x USB 2.0 host, one USB device, and 2x SD/MMC interfaces with eMMC 4.51 support. There is also support for 10x UART, 7x SPI, 2x CAN, camera and audio interfaces, and much more.
Like the Xplained boards, the module is open source, from the mainline Linux support to the posting of open schematics, design, Gerber, and BoM files for both the SOM and the optional SOM1-EK1 development board.
The newly launched SAMA5D2 SiP is built around the Microchip SAMA5D2. The FreeRTOS-focused 128MB version uses a lower-end SAM5D22 model limited to 16-bit DDR2 RAM while the Linux-ready 512MB and 1GB versions use the higher end SAMA5D27 and SAMA5D28, respectively, with 16/32-bit DDR. All the models are renowned for offering CAN support, and because the SAMA5D28 also adds security features, it’s the only one that is pre-certified for PCI Security.
The SAMA5D has fewer I/O pins and slower performance (166-500MHz) compared to the earlier, 600MHz SAMA5D4, but the power consumption is significantly lower. The SAMA5D2 SoC can run at less than 150mW in active mode at 500MHz with all peripherals activated, and at less than 0.5mW in low power mode with SRAM and registers retention.
SOM1-EK1 development board
The SAMA5D27-SOM1-EK1 development kit is built around a baseboard with a soldered SAMA5D27-SOM1 module with the 128MB (1Gb) configuration. This board is enhanced with SD and microSD slots, as well as a 10/100 Ethernet port, a micro-USB host port, and a micro-USB device port with power input.
Additional I/O option for this dev board includes USB HSIC, CAN, JLINK, and JTAG interfaces. There’s a tamper connector, 4x push buttons, an LED, supercapacitor backup, and an ATECC508 CryptoAuthentication device. A Linux4SAM BSP is available with Linux kernel and drivers.
The ATSAMA5D27-SOM1 is available for $39, and the ATSAMA5D27-SOM1-EK1 development board is available for $245 each. The ATSAMA5D2 SiP starts at for $8.62 each. More information may be found in Microchip’s SAMA5D2 SiP and SOM announcement and launch page, which points to SOM and SiP pages, as well as the SAMA5D27-SOM1-EK1 dev board page.
If you are new into hardware or still familiarizing yourself to the hardware ecosystem, you will realize some common terms often appear which could sometimes sound confusing or something out of rocket science, but it’s not. Here’s a quick look at five common terms used in hardware products or boards and what they denote.
Let’s take a look at them –
A system in package (SiP) contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate. An example SiP can comprise several chips—such as a specialized processor, DRAM, flash memory—combined with passive components—resistors and capacitors—all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package so that few external components need to be added to make it work.
SiP dies can be stacked vertically or tiled horizontally, unlike slightly less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps.
The appeal of a SiP is that it can be compact an otherwise complex system into a very simple package, making it easier to integrate into larger systems. It also simplifies PCB layouts.
Unlike a SOC that is based on a single silicon die, SiP can be based on multiple dies in a single package. SiP is believed to provide more interconnection in the future and possibly face out SoCs.
A Package-on-a-Package stacks single-component packages vertically, connected via ball grid arrays. Packages can be discrete components (memory, CPU, other logic) or a System-in-a-Package stacked with another package for added or expanded functionality.
PoP provides more component density and also simplifies PCB design. It can also improve signal propagation since the interconnects between components is much shorter.
A System-on-a-chip (SoC) is a microchip with all the necessary electronic circuits and parts for a given system, such as a smartphone or wearable computer, into a single integrated circuit (IC).
An SoC integrates a microcontroller (or microprocessor) with advanced peripherals like graphic processing unit (GPU), Wi-Fi module, or coprocessor.
Think of an SoC as a computer package inside a chip. The SoC integrates all components of a system into one. It may contain digital, analog, mixed-signal, and often radio-frequency functions – all on a single substrate. An SoC can be based around either a microcontroller (includes CPU, RAM, ROM, and other peripherals) or a microprocessor (includes only a CPU). It is also possible for SoCs to be customized for a specific application, including whatever components, memory, or peripherals necessary, ranging from digital/analog signal ICs, FPGAs, and IOs.
One of the major advantages of an SoC is that it is usually cheaper, smaller, easy to scale, and even more energy efficient. It is easier to build around a SoC for a product than to add several components individually. Despite its obvious advantages, SoC still has a significant disadvantage – you are going to be locked into that hardware configuration for life. This could be fine for consumer products, since you don’t expect any hardware upgrade or so but would limit hacking for makers related application.
A good example of an SoC is what we have in the Raspberry Pi; The Raspberry Pi uses a system on a chip as an almost fully-contained microcomputer. SoCs can help engineers speed up a product to market and even the adoption of new protocols, such as those Bluetooth 5 SoCs, that make it easier to integrate Bluetooth 5 into new products.
System on Module (SoM) / Computer on Module (CoM)
A System on a Module (SoM) and Computer on Module usually refers to the same thing. A Computer-on-a-module is a step above an SoC. It means a computer or system packaged in a single module. CoMs usually provide every piece you need to build a complete system; they incorporate an SoC (most of the time), connectivity, multimedia and display, GPIO, operating system, and others into one single module.
SoM based designs are usually scalable. SoMs/CoMs are usually paired with a carrier board. These carrier boards are usually used to extend out the SoMs functionality or parts. A SoM helps system designers realize a fully customized electronics assembly, complete with custom interfaces and form factor without the effort of a ground-up electronics design. Customers can purchase an off-the-shelf SoM and marry it to an easy to develop custom baseboard to create a solution functionally identical to one that is fully custom-engineered.
CoMs provide a plug-and-play type advantage since a CoM can be replaced or upgraded within a carrier, without having to change the carrier. There are some benefits to the SoM approach vs. ground-up development. These include cost savings, reduced risk, a variety of CPU choices, decreased customer design requirements, and a small footprint.
Unlike an SBC, a computer-on-module is a type of single-board computer made to plug into a carrier board, baseboard, or backplane for system expansion.
Single Board Computers (SBCs)
A single-board computer (SBC) is a complete computer built on a single circuit board, with a microprocessor(s), memory, input/output (I/O) and other features required for a functional computer. Single-board computers were made as demonstration or development systems, for educational systems, or for use as embedded computer controllers.
The Canada based company Intrinsyc has announced the Open-X 8M System on Module (SOM) a month ago. Now Open-X 8M is followed up with a Mini-ITX form factor Open-X 8M Development Kit build. The kit includes a GbE port, dual USB 3.0 ports, M2 expansion, and much more user-friendly features.
The Open-X 8M SOM can run Linux and Android 8.0 on the high-end Quad model of the i.MX8M, the same model used by most of the other i.MX8M boards. The i.MX8M Quad has 4x Cortex-A53 cores, single 266MHz Cortex-M4F, VPU, and Vivante GC7000Lite GPU chips. These CPU cores can be clocked in the range of 1.3GHz to 1.5GHz.
The Open-X 8M SOM comes with 3GB LPDDR4 RAM and 16GB eMMC. It includes a wireless module with 2.4/5.0GHz 802.11a/b/g/n/ac with the support of 2×2 MU-MIMO and Bluetooth 4.1. A Gigabit Ethernet controller is also there for wired connectivity. Visual output is available with the help of the module’s 3x 100-pin connectors. There is also support for HDMI 2.0a for up to 4096 x 2160 at a 60Hz resolution and 4-lane MIPI-DSI for up to 1920 x 1080 at 60Hz. There are also dual 4-lane MIPI-CSI2 camera inputs.
The Open-X 8M SOM is moreover equipped with 2x debug UART, 2x USB 3.0, 4-bit SDIO, JTAG, and PCIe Gen2 additional I/O ports. This 3.3V module has an NXP PF4210 PMIC, and it can operate in 0 to 70°C temperature range.
The Open-X 8M SOM is the heart of the new Open-X 8M Development Kit. It has a footprint of 170 x 170mm, which classifies as Mini-ITX form factor. The board has a MIPI-DSI connector and choice for mounting an optional, smartphone-sized Open-X LCD/Touchscreen is available.
The Open-X 8M Development Kit includes USB 3.0 host, USB 3.0 Type-C, and HDMI 2.0a ports, as well as a microSD slot. A GbE port is available as an alternative to the module’s WiFi. There’s also a 3.5mm audio output jack. Dual MIPI-CSI2 connectors support is available for optional camera module attachment.
The Open-X 8M SOM and Open-X 8M Development Kit are available now. Though, pricing information is not available yet. More information may be found at Intrinsyc’s Open-X 8M SOM and Open-X 8M Development Kit product page.
Simplify industrial-grade Linux® designs with SAMA5D2 MPU-based system on module (SOM) with Microchip’s MC1409u.
There is a great deal of design effort and complexity associated with creating an industrial-grade microprocessor (MPU)-based system. The ATSAMA5D27-SOM1, which contains the ARM® Cortex®-A5 ATSAMA5D27C-D1G-CU System in Package (SiP), greatly simplifies design by integrating the power management, non-volatile boot memory, Ethernet PHY and high-speed lower power DDR2 memory onto a small, single-sided Printed Circuit Board (PCB). The SAMA5D27 SOM1 is built on a common set of proven Microchip components and limits the design rules of the main application board, reducing overall PCB complexity and cost.
SAMA5D27 ARM Cortex-A5 processor
1Gb (128MB) DDR2 DRAM
On-board power management unit
Single 3.3V supply
Pre-programmed EUI-48 MAC address
Industrial temperature range (-40 to 85°C)
40 x 38 mm Module, 0.8 mm pitch
You can solder the SOM on a mother board and take it to production, or it can be used as a reference design along with the free schematics, design and Gerber files and complete bill of materials which are available online. You can also transition from the SOM to the SiP or the SAMA5D2 MPU itself, depending on your design needs. No matter which option you select, all products are backed by Microchip’s customer-driven obsolescence policy which ensures availability for as long as needed.
The RK3399 is a low power, a high-performance processor for computing, personal mobile internet devices, and other smart device applications. Based on Big Little architecture, it integrates dual-core Cortex-A72 and quad-core Cortex-A53 with a separate NEON coprocessor and also a Mali T860 MP4 GPU all in one single package. It is the processor to beat and due to its display capabilities has made it seen applications in TV Boxes especially in China.
If you are still on the lookout for a system-on-module based on Rockchip RK3399, then another SoM to put for consideration is the OpenEmbed em3399. OpenEmbed has launched their first system-on-module referred to as the em3399 SoM board and even comes with an optional “emPAC-RK3399-EVB” evaluation board.
The em3399 SoM supports 2GB to 4GB DDR3L RAM and 16GB to 128GB eMMC 5.1. It provides support for HDMI 2.0, DisplayPort 1.2, MIPI-DSI (dual-channel) and eDP 1.3 display interfaces. It comes with a 2x MIPI-CSI camera interface, Gigabit Ethernet, USB 3.0, USB type C, USB 2.0, SPi, i2C, GPIO and several others.
The following are some of the specifications of the OpenEmbed em3399:
SoC – Rockchip RK3399 hexa-core processor with 2x Cortex-A72 cores, 4x Cortex-A53 cores, and an Arm Mali-T860MP4 GPU
Camera – 2x MIPI-CSI (up to 13MP or dual 8MP); VOP (up to 5MP)
Audio – S/PDIF output, 8-channel I2S, HDMI and DP
Connectivity – Gigabit Ethernet
USB – 2x USB 3.0 host ports or 2x USB type C, 2x USB 2.0 host
1x PCI-e x1
5x SPI, 8x I2C, 100+ GPIOs
HDMI 2.0 port with audio for up to 4K @ 60Hz
DisplayPort 1.2 with audio for up to 4K @ 60Hz
MIPI-DSI (dual-channel) at up to 2560×1600 @ 60 Hz
eDP 1.3 (4-lane)
Dimensions – 84 x 55 mm
The emPAC-RK3399-EVB evaluation board has the same footprint as the em3399 SoM and stacks on top of the module via a dual 120-pin connector. The em3399 SoM is layered between the carrier board on top and also a heatsink on the bottom.
The emPAC-RK3399-EVB development board extends the em3399 with single a Gigabyte Ethernet port, USB 3.0, and USB Type-C ports, as well as dual USB 2.0 ports. It also extends out the HDMI 2.0 port, an audio jack, and MIPI-CSI and eDP connectors. A Wireless WiFi/Bluetooth module is available, and 20 GPIO pins have been extended out as well.
The following are the specification of the emPAC-RK3399-EVB:
2x 120-pin board-to-board connectors for em3399 CPU module
Display – HDMI 2.0a port, eDP connector, DisplayPort via USB type C port (TBC)
Audio – Via HDMI, 3.5mm audio jack (mic + stereo audio)
Camera – 1x CSI connector
Connectivity – Gigabit Ethernet, WiFi & Bluetooth module
USB – 2x USB 2.0 ports, 1x USB 3.0 port, 1x USB type C port
Misc – Power, Recovery and reset buttons; 5V power LED; 2-pin RTC battery header
Power Supply – 12V DC via power barrel jack
Dimensions – 84 x 55 mm
The company provides support for Android 7.1 and a Linux distribution with an Ubuntu Core still under development. You can purchase the SoM and the evaluation board on the OpenEmbed’s Taobao page for respectively 650 CNY ($102.50) or 899 CNY (~$142 US) for the 2GB/16GB configuration and 950 CNY ($151) or 1,199 CNY ($189) or for the 4GB/32GB models.
Last year (2017), NXP announced its new applications processors, the i.MX 8 series. The i.MX 8M family of applications processors based on Arm® Cortex®-A53 and Cortex-M4 cores provide industry-leading audio, voice and video processing for applications that scale from consumer home audio to industrial building automation and mobile computers. NXP announced a select group of partners that have been engaged in the development of an ecosystem for the i.MX 8M family processor. Taiwan based Innocomm Mobile Technology was one of those selected partners among others and have announced their NXP i.MX 8M quad-core system-on-module – called WB10 with wireless and wired connectivity options.
Innocomm WB10 is a next generation Wireless System-on-Module powered by the NXP i.MX 8M SoC. It offered advanced video processing capabilities and designed for application in the areas of internet audio, home entertainment, smart speakers among many others. With inbuilt Wi-Fi, Bluetooth and Ethernet connectivity options, the WB10 can quickly find applications in the trending areas of Internet of Things (IoT) and Industrial applications.
The WB10 is a small module and measured at just 50 x 50 mm. The WB10 module comes with only 2GB LPDDR4 RAM and an 8GB eMMC flash memory. It provides onboard support for WiFi 802.11 a/b/g/n/ac, Ethernet controller with MIMO 2 x 2 and Bluetooth 4.2. Apart from impressive connectivity options, you also get a host of other interfaces like – USB 3.0 host, USB 2.0 device, 2x I2C, 3x UART, GPIO, PWM, SPI, and PCIe interfaces.
The WB10 has an impressive audio and video interfaces with is Media I/O expressed via three 80-pin connectors that include an HDMI 2.0a supporting 4K and HDR, as well as MIPI-DSI, 2x MIPI-CSI, SPDIF Rx/Tx, 4x SAI, and the high-end DSD512 audio interface.
The following are some of the SoM specifications:
Processor – NXP i.MX8M Quad, Cortex-A53 x 4 + M4
4K + HDR
RAM – 2GB LPDDR4
Flash Memory – 8GB eMMC Flash
Wi-Fi 802.11 a/b/g/n/ac
MIMO 2×2 / BT 4.2
Dimension – 50 x 50 mm
USB 3.0/2.0 Host
USB 2.0 Device
80 pins x 3, board to board connectors
Although no official software support has been provided, it is expected the SoM should support the usual Android and Linux BSPs as seen in most modules. A development carrier board is made available by the company to extend the SoM interfaces and will surely make development easier. The module connects to the carrier board through three 80-pin board-to-board connectors exposing many of the I/Os provided by the latest NXP processor.
At this point, no pricing or availability information is provided for the WB10. More information about the module can be found on the product page.
The Zynq 7000 family based on the All Programmable SoC architecture are processor-center platforms that offer software, hardware and I/O programmability in a single chip.
iWave Systems which has released several Altera based FPGA system on modules has just announced its SODIMM (Small Outline Dual In-Line Memory Module) form-factor Xilinx Zynq based module known as the iWave’s iW-RainboW-G28M. The iW-RainboW-G28M features the Xilinx Zynq 7000 series SOC with Dual Cortex A9 CPU @ 866MHz, 85K FPGA logic cells, and up to 125 FPGA IOs.
The iWave iW-RainboW-G28M is compatible with the Zynq Z-7007S, Z-7014S, Z-7010, and Z-7020 SoC. Equipped with an onboard 512 Mbytes of NAND Flash, 512Mbytes of DDR3 SDRAM, Gigabit Ethernet, USB 2.0 ports, an optional Micro SD slot, and an optional WIFI/Bluetooth module with a form-factor of 67.6 mm x 37 mm plug-in SODIMM style. It supports -40 to 85oC temperatures and powered through the SOM edge connector with a 3.3 DC Volt.
The following are the SOM specifications:
Xilinx Zyng 7000 SoC
Single/Dual Cortex A9 @ up to 866MHz
Up to 85K logic cells
SoC Compatibility –
Compatible with Z-7007S, Z-7014S, Z-7010, and Z-7020
512 MB DDR3 and expandable to 1GB
512 MB NAND Flash
An Optional QSPI Flash
Optional Micro SD Slot/eMMC (Optional)
Zynq PS & PL Interfaces –
Gigabit Ethernet x1 Port
USB 2.0 OTG x 1 Port
SD (4bit) x 1 Port
60 LVDS/120 SE FPGA IOs
SOM Features –
PMIC with RTC
Gigabit Ethernet Transceiver
USB 2.0 Transceiver
Optional Wi-Fi and Bluetooth Module
OS Support –
Power Supply –
Temperature Support –
-400C to +850C
6mm x 37mm
The iW-RainboW-G28M has applications in the areas of Industrial Automation, Machine Vision, Control & Measurement, Scientific Instruments and Medical Instruments. For pricing and availability, please contact iWave directly iW-RainboW-G28M SODIMM SOM.
NextThing Co., is a hardware company that has the goal to create things that would inspire creativity, and help people chase their own ideas of what needed to exist. After producing their world’s first $9 computer C.H.I.P, they are ready now to launch a new product!
C.H.I.P Pro, the newest addition to the Next Thing Co. family, is powered by GR8, a system-in-package (SiP) that was designed by Next Thing Co. GR8 features a 1GHz Allwinner R8 ARM Cortex-A8 processor, Mali400 GPU, and 256MB of Nanya DDR3 DRAM. in a 14mm x 14mm FBGA package. C.H.I.P. Pro is a system-on-module (SoM) that has 512MB of high-speed NAND storage flashed with NextThing Co.’s GadgetOS. Gadget is an Open Source Linux-based OS, software toolchain, and cloud infrastructure which is designed to bring the speed, openness, and productivity of modern software development to the world of embedded hardware. C.H.I.P Pro can be powered by USB or battery, intelligently managed by the AXP209 power management unit.
The Pro also features 802.11 b/g/n WiFi, Bluetooth 4.2, and is fully certified by the FCC. This board will be available in December at supposedly any quantity for $16.
C.H.I.P Pro design defines two possibilities of installations; either in a product or in a single board computer designed for a breadboard. Its SMT-ready castellated edges and elements on both sides will make reflow soldering not so preferable. Instead, header pins, a ‘debug board’, and two C.H.I.P Pro units are introduced in one package for only 49$ to make soldering easier and to start installing the unit in applications. Due to its size and efficiency, it could be a good competitor for Raspberry Pi Zero.
C.H.I.P. was designed to be used in computer powered products, but it was recognized later that it wasn’t always the best fit. Many of the design choices of C.H.I.P make it hard to build into products. C.H.I.P. Pro addresses this issue, implements feature requests from the community, and is engineered to embed in products. C.H.I.P. and C.H.I.P. Pro are similar in many important ways, but they differ in some features. Here are C.H.I.P Pro advantages:
USB Breakout for PCB Designs incorporating USB based peripherals
Breadboard and SMT Placeable
A complete suite of certifications: WiFi Alliance, Bluetooth Consortium, FCC, CE, ROHS
Based on GR8 making it 76% smaller than C.H.I.P.
Better power consumption with ~3mA suspend to RAM
C.H.I.P. Pro is powered by GR8, a system-in-package provides a powerful application processor and DDR3 SRAM which eliminates the need for high-speed routing and reduces manufacturing complexity. GR8 is $6 in any quantity and includes the Allwinner AXP209 power management unit.
GR8 also features many popular peripheral interfaces: Two-Wire Interface, two UARTs (one 2-wire and one 4-wire), SD Card-ready SPI, two PWM outputs, a 6-bit ADC, I2S digital audio, S/PDIF IEC-60958 digital audio output, two HS/FS/LS USB PHYs (one USB 2.0 Host and one USB 2.0 OTG), a CMOS Sensor Interface.
Although it is doubtless that C.H.I.P. Pro will be installed and used in various projects, making GR8 module available for customers is something huge. Providing a jellybean part that contains an entire Linux system makes it possible to add the power of open software into any project and it opens the door for more applications to come.
Further details can be reached at C.H.I.P Pro and GR8 datasheets and at NextThing Co. forums.