Congatec presents 10 new high-end modules for embedded edge computing

congatec – a leading vendor of standardized and customized embedded computer boards and modules – today announced 10 new COM Express Type 6 modules featuring the best and latest Intel^® embedded processor technology. The four Intel^® Xeon^®, three Intel^® Core™, two Intel^® Celeron^® and one Intel^® Pentium^® processors are all based on the same Intel microarchitecture (codenamed Coffee Lake H). This enables congatec to provide all 10 new processors on one COM Express module design – the conga-TS370. A total of 14 processor module variants are now available on this single microarchitecture, offering extremely wide scalability. The spearhead in terms of computing power is the 45 watt 6-core module with 2.8 GHz Intel^® Xeon^® E-2276ME processor. It provides the highest embedded computing performance with integrated high-performance processor graphics currently available worldwide, while the 2.4 GHz Intel^® Celeron™ G4930E processor module with 35 watts sets the new price-performance benchmark.

Particularly noteworthy are the two 6-core congatec modules with a TDP of 25 watts offered on Intel^® Xeon^® E-2276ML and Intel^® Core™ i7-9850HL processors. They enable developers to create completely passively cooled embedded edge computing systems that can run up to 12 standalone virtual machines in parallel thanks to hyperthreading. This allows operation even in fully sealed systems, under the harshest environmental conditions and with the highest IP protection. The same applies to the two quad-core modules with Intel^® Xeon^® E-2254ML or Intel^® Core™ i3-9100HL processor as well as the Intel^® Celeron^® G4932E processor-based module, all featuring a – partly configurable – TDP of 25 watts.

“In the embedded edge computing segment, our OEM customers are now using such multicore platforms to consolidate several formerly separate systems on a single embedded edge computer. Hypervisor technology allows them to operate up to 12 virtual machines in parallel on one system,” explains Andreas Bergbauer, Product Line Manager for COM Express Modules at congatec. “These include real-time controllers (soft PLCs), Industry 4.0 gateways for tactile Internet via Time Synchronized Networking, IoT gateways for sending big data towards the cloud and central management systems, as well as vision systems, artificial intelligence (AI) and deep learning applications. In addition, there are software-defined networking functions such as intrusion prevention and detection systems that analyze data traffic parallel to the applications, thereby avoiding latencies that would arise with serial operation of analytics and applications.”

Other applications besides embedded edge computing include, of course, classic high-end medical imaging systems and HMIs as well as high-end gaming, infotainment and digital signage systems that require best-in-class computing power and throughput on a single die in tandem with the Intel^® graphics technology.

The updated Conga-TS370 and Conga-TEVAL/COMe 3.0 carrier are available now at undisclosed prices. More information may be found in Congatec’s update announcement, as well as the Conga-TS370 and Conga-TEVAL/COMe 3.0 product pages.

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