Forlinx FET3562J-C is A Rockchip RK3562(J) based SoM with Dual Etherne

Forlinx FET3562J-C is A Rockchip RK3562(J) based SoM with Dual Etherne


Forlinx FET3562J-C is a Rockchip RK3562/RK3562J-based System On Module (SoM) designed for IoT, automation, and consumer electronic applications. The SoC used in the module is built with the latest 22nm process with ARM Cortex-A53 cores running at up to 2GHz, which makes it very power-efficient. In terms of storage, it can be configured with LPDDR4 RAM and can be configured with up to 16GB eMMC storage.

Additionally, it features 1 TOPS NPU, Ethernet, Wifi, Bluetooth, LVDS, MIPI DSI, and much more. Making this device useful for applications like IoT, automation, and consumer electronic applications.

Previously we have written about SoMs like the MYIR MYC-J7A100T the Stefano Viola iCE40 FPGA SoM, the MYIR Artix-7 XC7A100T FPGA SoM and much more feel free to check those out if you are interested in the topic.

The company offers a System on Module (SoM) that can be configured with either the RK3562J or the RK3562 SoC. The RK3562 features 2.0GHz ARM Cortex-A53 cores and a 1 TOPS NPU, delivering higher processing speeds. In contrast, the RK3562J has cores clocked at up to 1.8GHz, ensuring reliable operation in a temperature range of -40 to +85°C, but it does not include an NPU. This SoM supports various graphics and compute acceleration technologies, including OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, and Vulkan 1.1. It is also equipped with a dedicated 2D hardware engine and a high-quality JPEG encoder and decoder.

The company also offers a carrier board, to you can attach the som and access all its functionality that is shown above.

Forlinx FET3562J-C SoM and Carrier Board specifications

  • SOM Specifications
    • Processor Options:
      • Rockchip RK3562J:
        • CPU: 4× Cortex-A53 @ 1.8GHz
        • NPU: None
      • Rockchip RK3562:
        • CPU: 4× Cortex-A53 @ 2.0GHz
      • NPU: 1TOPS INT8, supports INT4/INT8/INT16/FP16
    • Graphics and Video:
      • GPU: Mali-G52-2EE
        • Supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.0/1.1
      • VPU:
        • Hard encode: H.264, 1920×1080 @ 60fps
        • Hard decode: H.265, VP9 (4096×2304 @ 30fps); H.264 (1920×1080 @ 60fps)
    • Memory:
      • RAM: 1GB/2GB LPDDR4
      • Storage: 8GB/16GB eMMC
    • Flashing:
        • USB OTG
    • Display Interfaces:
      • MIPI DSI: 1x, 4 lanes, up to 2048×1080 @ 60Hz
      • LVDS: 1x, VESA/JEIDA, up to 800×1280 @ 60Hz
      • RGB: 1x, RGB888, up to 2048×1080 @ 60Hz
    • Camera Interfaces:
      • MIPI CSI: 4x lanes, supports up to 4 CSI inputs
    • Audio:
      • Built-in codec, sampling rate 48KHz to 192KHz, supports mono speaker (1.3W), stereo phone output (32 Ohm), 2 single-end MIC
      • SAI: 3x (SAI0~SAI2), supports I2S/PCM/TDM
      • PDM: 1x, up to 8 channels, 192KHz sampling rate
      • SPDIF: 1x, supports 16/20/24-bit audio data
    • Networking:
      • Ethernet: 2x (1x RGMII, 1x RMII)
      • USB: 1x USB 2.0 Host, 1x USB 3.0 Host/Slave
      • PCIe: 1x PCIe 2.1 (multiplexed with USB 3.0)
    • Other Interfaces:
      • SD Card: 1x SDIO 3.0
      • UART: 10x
      • CAN: 2x CAN 2.0B
      • SPI: 3x
      • I2C: 5x
      • PWM: 16x
      • ADC: 16x (2x SARADC with 8 channels each)
      • GPIO: 79x
    • Power Input:
      • DC 5V
    • Operating Temperature:
      • RK3562J: -40℃ to +85℃
      • RK3562: 0℃ to +70℃
    • Packaging:
      • Board-to-board connector (3× 80-pin, 0.5mm pitch, combined height 2.0mm)
    • OS Support:
      • Linux 5.10.198
      • Android (TBD)
  • OK3562-C/OK3562J-C Carrier Board Specifications
    • Display Interfaces:
      • MIPI DSI: 1x, 4 lanes, capacitive TP, supports backlight adjustment
      • LVDS: 1x, 4 lanes, capacitive TP, supports backlight adjustment
    • Camera Interfaces:
      • MIPI CSI: 3x (4 lanes + 2 lanes + 2 lanes)
    • Audio:
      • Mono speaker (1.3W), stereo earphone output (32 Ohm), earphone recording + on-board MIC recording
    • Networking:
      • WiFi: Dual-band 1×1 802.11ac + Bluetooth 4.2
      • Ethernet: 2x RJ45 (1x Gigabit, 1x Fast Ethernet)
    • USB:
      • USB 2.0: 3x (Host mode via USB hub)
      • USB 3.0: 1x (Host/Slave mode switchable)
    • Expansion:
      • PCIe: 1x PCIe 2.1 (RC mode, 5Gbps)
      • 4G: 1x mini PCIe slot with USB 2.0 signal
    • Other Interfaces:
      • CAN: 2x CAN 2.0B with galvanic isolation
      • SPI: 1x box header
      • TF Card: 1x up to SDR104
      • PWM: 1x for backlight control
      • ADC: 13x pin headers
      • Key ADC: 4x (one SARADC for 4 keys)
      • RTC: 1x (CR2032)
      • User GPIO: 1x (key input + LED output)
      • RS485: 2x with galvanic isolation
      • UART Debug: 2x (Type-C connector)
      • JTAG Debug: 1x
    • Power – 12V
    • Dimensions – Not Mentioned

The company has not released any pricing information for the Forlinx FET3562J-C SoM. More information about the Rockchip RK3562(J) system-on-module and associated development board can be found on the product page.

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About Debashis Das

Tech Content Creator | Hardware Design Engineer | IoT Enthusiast | Digital Storyteller | Video Creator | From crafting digital dialogues at Semicon Media to orchestrating online engagement at, my journey is about making tech talk interesting and accessible. In the quiet corners of the day, I advocate for easier tech education, one tutorial at a time. Let's connect and keep the digital dialogue going!

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