SBC-SiP-SoC-CoM category

Firefly Core-PX3-SEJ module

Firefly’s Latest Core-PX3-SEJ COM Runs Ubuntu or Android

Firefly has launched a new SODIMM-style, 67.6 x 40mm Core-PX3-SEJ module that runs Android 5.1 or Ubuntu 15.04 on a Rockchip PX3-SE. It’s a new 1.3GHz, quad-core, Cortex-A7 SoC. The 40 USD module is available in a 1GB RAM/8GB eMMC configuration on a $120, 117 x 85mm Firefly-PX3-SE development board. Other memory configurations may also be available soon.

Firefly Core-PX3-SEJ module
Firefly Core-PX3-SEJ module

The PX3-SE SoC gives the module a sandwich-style dev board and increases the operating temperature to -20 to 80 range. The Core-PX3-SEJ module is praised for its anti-corrosion gold finger expansion connector, and the dev board for its “double stud fixed” design.

Rockchip’s PX3-SE SoC was announced in May 2017. The main target of this SoC is Linux and Android-driven “mobile vehicle interconnect solutions.” The quad-A7 SoC implements a Mali-400 GPU and supports HD video.

The Firefly-PX3-SE board’s 2.4GHz WiFi and Bluetooth 4.0 are supplied separately from the compact Core-PX3-SEJ COM. Despite the lack of 4K support, there are a numerous media interfaces, including a variety of audio features. There are HDMI, CVBS, MIPI-DSI or LVDS, and a DVP camera interface. Analog, SPDIF, and I2S audio connections are available along with an onboard mic and a “phone” I/O port.

The Firefly-PX3-SE board is further provided with a GbE port, 4x USB 2.0 host ports, a micro-USB OTG port, and an 84-pin expansion header. RTC, debug, and IR are also onboard.

Specifications summary for the Firefly-PX3-SE development board with Core-PX3-SEJ module:

  • Processor : Rockchip PX3-SE (4x Cortex-A7 cores @ 1.3GHz); Mali-400 MP2 GPU
  • Memory:
    • 256MB, 512MB, 1GB, or 2GB DDR3 RAM (via Core-PX3-SEJ)
    • 4GB to 64GB eMMC flash (via Core-PX3-SEJ) with 4GB and 8GB default SKUs
    • MicroSD slot
  • Wireless:
    • 2.4GHz 802.11b/g/n with antenna
    • Bluetooth 4.0 with BLE
  • Networking: Gigabit Ethernet port (Realtek RTL8211E)
  • Display & media:
    • HDMI port with audio
    • MIPI-DSI or LVDS LCD interface
    • CVBS with video and audio
    • DVP camera interface for up to 5MP
    • 3.5mm analog audio input jack
    • SPDIF optical output
    • Microphone input
    • I2S audio I/O
    • A phone I/O interface
  • Other I/O:
    • 4x USB 2.0 host ports
    • Micro-USB 2.0 with OTG
    • Serial console debug
    • 84-pin expansion header (MIPI, LVDS, PWM, SPI, UART, ADC, I2C, I2S, GPIO)
  • Other features: RTC with battery; IR receiver; power, reset, recover buttons; acrylic rack kit
  • Power: 5V, 2A (via DC jack); PMU (via Core-PX3-SEJ)
  • Dimensions: 117 x 85mm (with 67.6 x 40mm integrated COM)
  • OS Support: Android 5.1; Ubuntu 15.04; includes Linux Buildroot/Qt

The Core-PX3-SEJ module and Firefly-PX3-SE development board are available for $80 and $140 (including module), respectively, plus shipping. More information may be found at Firefly’s Core-PX3-SEJ and Firefly-PX3-SE shopping pages.

Redefining Signal Processing with Air-T

Artificial intelligence (AI) is an area of computer science that works towards creating machines that could make decisions, react, and interact just like a human would. To be considered AI a computer must be capable of recognizing speech, learn, plan, and solve problems. To do all this a computer must have a way to perceive the world and even interact with it (move). This type of technology has been used for personal assistants such as Siri and Alexa, for customer prediction (Netflix and Pandora), for autonomous vehicles, gaming etc. However, one application that has not been exploited is for signal processing.

Deepwave Digital decided to be pioneers in using AI for signals. The company created the AIR-T (Artificial Intelligence Radio Transceiver) which is a high-power SBC that uses NVIDIA Jetson TX2 for signal processing and deep learning applications.

Nowadays we deal with an increasing number of signals, because of Wi-Fi and cellular communications, and the technology is still human dependent to select the correct frequencies. Because of this, the need for an AI to do the work for us has become increasingly high, and as it turns out the AI can do the work better than us.

The AIR-T board also includes Xilinx Artix 7 FPGA and an Analog Devices 9371 MIMO transceiver with two RX channels of 100 MHz and a couple of TX channels of 250 MHz for connectivity, the device includes Bluetooth, Wi-Fi, HDMI, GPIO/UART, USB 2.0 and 3.0 etc. It uses Ubuntu 16.04, and it can be programmed using Python or C++.

All these characteristics make the device adaptable to many applications which will allow users to create and shape different projects. This project gives users the ability to adapt to software defined radio. Deepwave said:

This versatile system can function as a highly parallel SDR, data recorder, or inference engine for deep learning algorithms. The embedded GPU allows for SDR applications to process bandwidths greater than 200 MHz in real-time.

The device is not yet on sale, and Deepwave is expected to launch a crowdfunding to commercialize the product in the future, so there is still no information about price or sellers.

The idea is to redefine how signal processing is done using machine learning.

[source]

NanoPC-T4 – A High-Performance Low Cost Single Board Computer Powered By RK3399

FriendlyElec recently released a pretty exciting hacker board which is super cheap, considering the features of the board and the price it is being sold for. The Single Board Computer (SBC) is based on Rockchip RK3399; a low power, high-performance processor. The board which is called Nano PC – T4 can be regarded as the smallest rock chip based board as it measures 100mm by 64m as compared to other RK3399 SBCs. It is different from other Nano Pi, and Nano PC SBCs produced by FriendlyElec because previous boards run on Samsung of Allwinner System on Chips (SOCs).

NanoPC-T4

The board comes with a default 4GB RAM and a whopping 16G eMMC (embedded Multi Media Card). It also works with Android 7.1 which can be exchanged for the full fledged Lubuntu Desktop version of Ubuntu. Nano PC – T4 uses the same system-on-a-chip (SoC) as Samsung’s Chromebook Plus but at a lesser price. Other features are 16 GB storage onboard bundled with a heatsink, radio antennas, a power adapter, and an acrylic case. The RK3399 SoC supplies two Cortex-A72 cores that are clocked at up to 2.0GHz, and an additional four Cortex-A53 cores clocked to 1.5GHz. There’s also a high-end ARM Mali-T864 Graphics Processing Unit (GPU) included into the device.

The board comes with an M.2 2280 connector, which allows high-speed PCIe SSDs to be used, the M.2 connector supports PCI Express 2.1, that has been wired for x4, making it possible to get I/O speeds at a very fast speed. On the other end, we have the Firefly-RK3399, which is being sold for $149 with a 2GB RAM or $209 with a 4GB RAM. Another board is the Orange Pi which goes for $109 and has a 2GB RAM. Unlike the expensive Orange Pi RK3399, the NanoPC-T4 gives a wider 0 to 80℃ temperature range, ADC interfaces, DDR4 instead of DDR3 RAM, and twice the amount of RAM for the oversight configuration.

Below are some of the device’s specifications:

  • Processor — Rockchip RK3399 (2x Cortex-A72 at up to 2.0GHz, 4x Cortex-A53 @ up to 1.5GHz); Mali-T864 GPU
  • Memory:
    • 4GB LPDDR3 RAM (dual-channel)
    • 16GB eMMC 5.1 flash
    • MicroSD slot
    • Optional NVME SSD via M.2 M-Key (see expansion section below)
  • Media:
    • HDMI 2.0a port (with audio and HDCP 1.4/2.2) for up to 4K at 60Hz
    • DisplayPort 1.2 (via USB Type-C)
    • MIPI-DSI (4-lane)
    • eDP 1.3
    • 2x, 4-lane MIPI-CSI (up to 13MP) with dual ISP support
    • 3.5mm analog audio I/O jack
  • Wireless:
    • 802.11b/g/n/ac 2.4GHz/5GHz dual-band
    • Bluetooth 4.1 dual mode
    • Dual antennas
    • IR receiver
  • Networking — Gigabit Ethernet port
  • Other I/O:
    • USB 3.0 host port
    • USB 3.0 Type-C port (can be used for DP)
    • 2x USB 2.0 host ports
    • Serial debug UART
    • 3x ADC (1.8V)
    • 12V cooling fan interface with PWM
  • Expansion:
    • 40-pin RPi compatible expansion header
    • M.2 M-Key slot with PCIe 2.1, dual operation mode, and M3 PCB nut for mounting M.2 2280
  • Other features — RTC; power, reset, recovery, boot buttons; LEDs; heatsink; acrylic case
  • Power — 12V/2A DC input jack and adapter; PMIC
  • Operating temperature — 0 to 80℃
  • Weight — 63 gm
  • Dimensions — 100 x 64mm; 10-layer PCB
  • Operating system — Android 7.1.2; Lubuntu Desktop 16.04

One major taking point for the NanoPC-T4 is the availability of two MIPI-CSI x2 making it a dual camera interface platform. This simultaneous dual camera data support is going to make the device ideal for VR and AR applications. The NanoPC-T4 has four high-performance display interfaces (DP 1.2 @60fps, HDMI 2.0,  MIPI-DSI @60fps, and eDP 1.3) on a small board and supports dual display output.

Despite the fact that the board does not have an HDMI input port or even built-in sensors, the Nano PC – T4 has a wide range of applications, some of them are advertisement machines, game machines, video conferencing, clusters, surveillance and many more. It also supports certain advanced features such as native GbE and a dual purpose USB Type C port serves as the display port.

The NanoPC-T4 is available for purchase online at a discounted price of $129 and can be bought on the product page here. The board purchase comes in a complete package. Below are some of the items present in the item package:

  • NanoPC-T4
  • Customized Heat Sink (With Screws)
  • 2x Dual-Band antenna
  • 12V 2A Universal Power Adapter
  • Acrylic case For NanoPC-T3 Plus/T4 (with Screws)

Envision a New Future for Factory Automation with AAEON’s NanoCOM-APL

(Taipei, Taiwan – June 12, 2018) – AAEON, a world-leading developer of embedded controllers and industrial solutions, launches the NanoCOM-APL, a machine vision and factory automation-focused Type 10 COM express module with onboard support for dual MIPI CSI interfaces.

The NanoCOM-APL is built around a 6th Generation Intel® Atom™, Celeron®, or Pentium® processor and features onboard LPDDR4 memory with a capacity of up to 8GB. The 7W module’s low power-consumption architecture means it can be used at the heart of hand-held, battery-powered devices and fully enclosed IP67 applications.

“Combined with an FPGA controller and an AI chip, the NanoCOM-APL is being used as the centerpiece of advanced machine vision systems that scan products to create 3D images that can be checked for faults,” noted David Hung, AAEON embedded computing division product specialist. “Because of its size and industrial operating temperature range, these systems can be used on a production line or even on a robotic arm.”

The module also features 1GbE LAN connections, optional onboard eMMC storage of up to 64Gb, a PCIe [x4] expansion slot, an LVDS, DDI, or eDP connections, and support for up to eight USB3.0 and two USB2.0 ports.

Open-Q 212A board and module

Google Reveals Four New ARM-based production Boards For Android Things 1.0

Earlier this month, Google released Android Things 1.0 and announced many consumer products that will ship in the coming months based on the stripped-down, IoT-oriented Android variant. Google uncovered four ARM-based production boards for Android Things 1.0: Innocomm’s i.MX8M based on WB10-ATIntrinsyc’s Open-Q 212A and Open-Q 624A, based on the Snapdragon 212 and 634, respectively, and the MediaTek MT8516.

The most important news with the first market-ready release of Android Things is that Google is offering free OTA security and patch updates for three years to all targeted devices. However, Google needs a licensing deal to deploy more than 100 commercial systems using the OTA updated long-term version of Android Things, and the OS itself is “managed” and tightly controlled by Google.

The modules share the same small footprints of about a 50 x 50mm. They also focus on audio features that might support integration with the Google Assistant voice agent. The first round of consumer devices using Android Things are smart speakers and automation hubs that integrate Google Assistant.

WB10-AT

InnoComm Google WB10AT COM
InnoComm Google WB10AT COM

InnoComm’s 50 x 50mm WB10-AT COM is almost identical to the WB10 module announced in March. The only difference except for the OS is that the AT version ships with 1GB LPDDR4 instead of 2GB. The WB10-AT includes a 1.5GHzCortex-A53 based NXP i.MX8M Quad SoC with a 266MHz Cortex-M4 core. It extends 8GB eMMC, 802.11ac, Bluetooth 4.2, and a GbE controller.

The WB10-AT allows HDMI 2.0 with 4K HDR support, as well as extensive audio I/O enabled by the audio-savvy i.MX8M. Audio specs include 4x SAI, DSD512, and S/PDIF.

Open-Q 212A Development Kit

Open-Q 212A board and module
Open-Q 212A board and module

Intrinsyc’s Open-Q 212A is a sandwich-style SBC designed for next-gen smart speaker and voice-controlled home hub products. There is a new 50 x 46.5mm Open-Q 212A Android Things SOM with a quad-core, Cortex-A7 Qualcomm Snapdragon 212 (SDA212) — the lowest-end SoC available for Android Things mounted on a 170 x 115mm carrier board.

The new module provides 1GB LPDDR3, 4GB eMMC, WiFi-ac, and BT 4.2. The 12V carrier board adds 2x USB host ports, a micro-USB client port, and a micro-USB debug port. It also includes a MIPI-CSI and MIPI-DSI interfaces, with the latter capable of up to 720p LCD displays. PCB antennas are also available.

Open-Q 624A Development Kit

Open-Q 624A
Open-Q 624A

This new sandwich-style kit is Google’s high-end Android Things platform. It connects a new Open-Q 624A Android Things SOM and carrier board, each of which is the same size as their Open-Q 212A counterparts.

The module extends 2GB RAM4GB eMMCWiFi-ac, BT 4.2, and a new, undocumented octa-core Snapdragon 624 SoC based on the existing Snapdragon 625. Like the Snapdragon 625, the 624 provides 8x Cortex-A53 cores at up to 1.8GHz along with an Adreno 506 GPU with support for 4K @ 30fps video. Google calls the Snapdragon 624 the SDA624, and in one place Intrinsyc refers to it as the APQ8053, which is also the name of the Snapdragon 825.

The Open-Q 624A carrier board has a feature set that is very similar to that of the similarly sized Open-Q 212A board. However, it adds a USB 3.0 Type-C port, sensor expansion and haptic output, and an optional GPS receiver, which like the module’s WiFi and Bluetooth, is available with an antenna.

MediaTek MT8516

MediaTek MT8516
MediaTek MT8516

Google refers to the MT8516 as a virtual SoM, as opposed to the other physical modules, and suggests that the module’s capabilities are directly integrated into a reference board designed for high volume applications.

Whatever the form factor, the MT8516 provides a quad-core, 1.3GHz Cortex-A35 processor with 4GB eMMC, WiFi, BT, and RF. The platform is intended for voice assistance and other audio applications and provides 4-channel I2S x2, 8-channel TDM, and 2-channel PDM input for voice input control and connected audio.

The Cortex-A35 cores draw about 33 percent less power per core and occupy 25 percent less silicon area than Cortex-A53. The -A35 design lies at the heart of NXP’s i.MX8X SoC, which is also available in two dual-core models. The i.MX8X is found on Phytec’s phyCore-i.MX 8 module.

More information may be found on this Google Android Things Supported Platforms page, as well as at these four product pages:

VAR-SOM-MX6 Development Kit

New Wireless VAR-SOM-MX6 Adds Supports For i.MX6 QuadPlus SoC

Variscite a leading SOC manufacturer from Israel, has released a new version of its wireless-enabled “VAR-SOM-MX6” module. It adds support for the i.MX6 QuadPlus SoC. Variscite is renovating the old COM once again with a model that adds support for NXP’s QuadPlus. It is going to be a new addition to the i.MX6 Solo, DualLite, Dual, and Quad versions. The module runs Linux 4.9.11 and Android 8.0 (Oreo).

VAR-SOM-MX6 module with QuadPlus support
VAR-SOM-MX6 module with QuadPlus support

The i.MX6 QuadPlus, which is also available on the Wandboard Reload SBCs, iWave’s i.MX6 COMs, and other boards. It has the same, 1.2GHz quad-core CPU as the Quad, but offers an enhanced Vivante GC2000+ GPU with 50 percent elevated graphics performance. The SoC also provides HD-resolution H.264 decode and encode.

The 2018 version of the VAR-SOM-MX6 is identical with the pin configuration as the earlier models. It has up to 4GB DDR3 RAM and data storage of 4GB to 64GB via eMMC and 128MB to 1GB NAND flash. There’s a GbE controller, although with the usual i.MX6 bandwidth limits. The 802.11n WiFi, which is accompanied by Bluetooth 4.1 with BLE, is available with optional 2×2 MIMO.

The 67.8 x 51.7mm module houses dual 24-bit LVDS interfaces with resistive touch, as well as an HDMI and DSI interfaces. The long list of peripherals includes dual CAN, SATA, PCIe, MIPI-CSI, and much more support. The module has a range of -40 to 85°C working temperatures.

VAR-SOM-MX6 eval kits

VAR-SOM-MX6 Development Kit
VAR-SOM-MX6 Development Kit

The $399 VAR-SOM-MX6 Starter Kit includes the carrier board with the VAR-SOM-MX6 module, an antenna, a debug cable, a microSD card, and a carrier board design package. The $499 Development Kit version adds a 12V power supply, an Ethernet cable, and a 7-inch resistive touch panel. The $549 Development Kit Pro advances to a 7-inch capacitive touchscreen.

The VAR-SOM-MX6 module with QuadPlus support is available now starting at $52 per unit in volume. The development kits start at $399. More information may be found in Variscite’s VAR-SOM-MX6 with the QuadPlus announcement and product page.

Orange Pi 3G IoT Board

Orange Pi 3G IoT Board- A Cost Effective IoT Hacker Board

The Shenzhen based company, Xulong who makes the famous Raspberry Pi Clone; Orange Pi has recently launched a new IoT board to expand its IoT family line. The company who launched a 4G board, the Orange Pi 4G board early this year has announced the Orange Pi 3G IoT board, an IoT board that offers worth comparison to the 4G board and comes cheaper.

Orange Pi 3G IoT Board
Orange Pi 3G IoT Board

Just like its other released boards, the Orange Pi 3G is also an open source board. The SBC (Single Board Computer) is powered by a dual Cortex-A7 MediaTek MT6572 running at 1.2GHz speed, a bit lower than the quad-core 1.3GHz MediaTek MT6737 found on the Orange Pi 4G board and higher than the single-core 1GHz RDA Micro 8810PL  found on the Orange Pi 2G board.

The Orange 3G boards provide a compromise between using the slower 2G board and the most expensive 4G board. The board will allow users to deploy IoT solution on the widely available 3G networks as compared to 4G networks. The board doesn’t just come with only 3G cellular connectivity but also includes WiFi, Bluetooth, and GPS making it an ideal candidate for use as an IoT gateway.

The board is equipped with a 512MB DDR2 RAM, an onboard 4GB eMMC memory and support for a MicroSD card. It comes equipped with the standard 40-Pin header found on the Raspberry Pi, and this will allow it to have compatibility with some Raspberry Pi Hats.

The following are the specifications listed for the Orange Pi 3G-IOT:

  • Processor — MediaTek MT6572 (2x Cortex-A7 @ 1.2GHz); Mali-4000 MP1 GPU
  • Memory/storage:
    • 512MB DDR2
    • 4GB eMMC
    • MicroSD slot with hot-plug support
  • Wireless:
    • WiFi, Bluetooth, FM, and GPS combo module
    • 3G — GSM 850/900/1800/1900; WCDMA B1/B2/B5/B8; TD-CDMA; CDMA2000
    • Mini-SIM card slot
    • WiFi/BT antenna connectors (ext. antennas may be optional)
  • Display/Media:
    • LCD interface (FWVGA via FPC ZIF connector) with capacitive touch
    • MIPI-CSI camera interface
    • 3.5mm earphone audio jack
    • Mic
    • Optional speaker
  • Other I/O:
    • USB 2.0 host port
    • Micro-USB port with power support
    • 40-pin expansion header
  • Other features — 2x LEDs
  • Power — 5V 2A via micro-USB; power button; optional battery
  • Dimensions — 68 x 52mm
  • Operating system — Android 4.4 with C, C++, Kotlin, Java, Shell, and Python support

One major talking point for the Orange Pi 3G-IoT is the OS support. It is still stuck at the ancient Android 4.4 firmware while the Orange Pi 4G already supports Android 8.1. Linux operating system support doesn’t seems to be available for the Orange Pi 3G but we can’t rule it out since the company normally release the Android SDK which also includes an Linux kernel.

The board is available for purchase at the cost of $19.90 and can be purchased online from Aliexpress.

UP AI Edge – an edge platform works across Intel CPU, GPU, VPU and FPGA

UP Bridge the Gap – a brand of AAEON Europe – is proud to bring its latest innovation at Kicksarter. Introducing UP AI Edge: an x86 computing platform works across Intel CPU, GPU,VPU and FPGA to  enable Artificial Intelligence on the Edge.

Most IT solutions available today are focused on connecting Edge devices to the cloud and these deployments face challenges related to latency, network bandwidth, reliability and security. Experts in this field agree that not all the tasks and decision-making processes can be addressed in cloud-only models.

UP AI Edge is the solution for cloud limitations by bringing AI performance and hardware acceleration not ‘at’ but ‘ON’ the Edge of the Internet of Things and of the latest technology.

UP AI Edge is the only AI on the Edge platform fully powered by Intel technology and it consists of : (more…)

Zebra SBC – ARM based Single Board Computer from VersaLogic

VersaLogic has released a rugged, lasting, simple-to-use and ready-for-deployment Zebra VL-EPC-2701 board. The Zebra single board computer is a complete Arm-based embedded computer. It features several models that are available with power-efficient, single- or dual-core i.MX6 CPUs. The Arm-based Single Board computer comes in two models; which features either NXP i.MX6 Solo (single core), or the i.MX6 DualLite (dual core) processors.

Zebra SBC

With its 95 x 95 mm size, the compact board is easy to mount and perform future upgrades. Not only that, Zebra conforms to the size and mounting points of the industry standard COM Compact format. The Zebra NXP’s single-core i.MX6 Solo comes with an onboard 512MB DDR3L RAM, while the dual-core DualLite comes with a built-in 1GB RAM, both of which are expandable up to 4GB RAM. The Zebra offers an optional 8GB microSD card with Linux and supports Linux distributions and OSes that are compatible with the Cortex-A9 based i.MX6.

This embedded computer boards provide connectivity via Gigabit Ethernet, USB, and CAN bus interfaces, as well as HDMI video support. They also provide a MikroBUS socket for expandability, and additional on-board I/O including I2C, audio, SPI, and GPIO. The Zebra embedded computer board has been programmed for a ready off-the-shelf deployment into demanding industrial, defense, and aerospace applications requiring rugged, durable, power efficient, industrial temperature.

Unlike many Arm-based modules, VersaLogic’s Zebra comes uniquely in some ways. The new product is a complete board-level computer. It requires neither additional carrier board nor, companion boards nor, connector break-out boards, or other add-ons to function. Since it was built to be exceedingly efficient, rugged and lasting, Zebra is rated for full industrial temperature operation of -40° to +85°C. Even at that, it consumes less than 3W of power during operation.

Here are the specifications of the Zebra SBC:

  • Processor — NXP i.MX6 Solo or DualLite (1x or 2x Cortex-A9 cores @ up to 800MHz);
  • Graphics – Vivante GC2000 GPU
  • Memory/storage:
    • 512MB (Solo) or 1GB (DualLite) DDR3L SDRAM soldered, expandable to up to 4GB
    • MicroSD slot (bootable) with an optional 8GB card containing Linux
    • eMMC (MLC) socket with up to 32GB optional bootable storage
  • Networking — 1x Gigabit Ethernet port with network boot, latching connector
  • Other I/O:
    • HDMI v1.4 port
    • Audio in/out jack
    • 2x USB 2.0 host ports
    • 2x CAN 2.0B ports
    • 2x serial interfaces (1x 3.3V UART; 1x RS-232 debug)
    • 8x GPIO/DIO (3.3V)
    • 1x SPI, 2x I2C, and up to 3x PWM (reduces GPIO lanes)
    • MikroBUS expansion interface for Click boards
  • Other features —
    • 6-axis accelerometer/magnetometer
    • 10-year lifecycle support
    • optional cables
    • HW customization service available on 100+ unit orders
  • Operating temperature — -40 to 85°C with 0.5 linear meters per the second airflow
  • Shock/vibration resistance — per MIL-STD-202G (vibration Method 204/214A; shock Method 213B)
  • Altitude resistance — to 4,570 meters
  • Power — 5 VDC input;
    • Consumption: 2.2W idle, 2.7W (Solo) or 3W (DualLite) typical
  • Dimensions — 95 x 95 x 20mm; compatible with COM Express Compact footprint and mounting holes
  • Weight — 62 g
  • Operating system – bootable Linux OS; compatible with other Linux and Android.

VersaLogic’s is offering an amazing 10+ year product life support for the board; this will ensure a long-term deployment in the field, free from expensive upgrades and migrations that come from products with a short disposable lifecycle.

The Zebra SBC is available for purchase starting at $196 for Solo with 512MB (VL-EPC-2701-EAK-005) or $239 for DualLite with 1GB (VL-EPC-2701-EBK-01), or $168 and $205 in OEM quantity. More information about the product is available on the product page.

Avalue ESM-APLC – An Apollo Lake board that gives option for the Celeron®N3350 or Pentium®N4200 SoC

The Apollo Lake SoC has already be used in several boards and modules. Avalue, a technology company that has launched several single board products and with focus on innovative embedded products has recently launched an embedded platform called the “ESM-APLC“, a Linux-ready COM that provides support for either the Intel Apollo Lake Celeron®N3350 or Pentium®N4200 SoC.

Avalue ESM-APLC

Avalue which isn’t new to the Apolo Lake board designs released the EQM-APL last fall, a Qseven module based on the Intel’s Apollo Lake. The ESM-APLC module to some extent inherit some similar attributes of the EQM-APL module, just like the EQM-APL module allows one to use between the Apollo Atom, Celeron or the Pentium SoC, the ESM-APLC does the same with the major exemption of the Atom SoC. The ESM-APLC drops the Apollo Lake Atom SoC in its build.

The EQM-APLC module measures at 95 x 95mm in a Type6 style shape COM Express Compact module. It is equipped with the Intel Apollo lake Pentium N4200 1.1GHz  or Celeron N3350 1.1GHz  SoC Processors both of which have a low 6W TDP. ESM-APLC supports one 204-pin DDR3L 1866 SO-DIMM (up to 8GB via single socket), and the module supplies up to 64GB of optional onboard eMMC 5.0. Extensive I/O support including 8 x USB 2.0, 4 x USB 3.0, 2 x SATA III, 1 x UART, 1 x 8-bit GPIO, 1 x SMBus, 1 x LPC and 1 x I2C.

ESM-APLC provides a triple display interface option; it supports several graphics interfaces including dual-channel 18/24-bit LVDS with support up to 1920 x 1200 @60Hz, VGA Support up to 1920 x 1200 @60Hz, HDMI support up to 3840×2160 @30Hz and DP support 4096×2160 @60Hz. HD Audio is not left behind in this wealth of features.

The module expansion port comes with 3x PCIe GEN2 x1 interfaces and an optional 4 PCIe x1 or 1 PCIe x4 that comes at the cost of sacrificing the Ethernet. The module is expected to work optimally in 0 to 60°C operation with a wide range of temperature input (9- 19V AT/ATX input with ACPI 3.0. TPM 2.0 is optional). ESM-APLC is ideal for customers who need optimized processing and graphics performance with low power consumption in a long product life solution, such as embedded board, MID/UMPC, Microserver/Server and Consumer Electronics.

The module supports either Linux Kernel 4.5 and Windows® 10 Enterprise (64-bit). The module is available for purchase with no publicly disclosed price but can be obtained by contacting Avalue. More information about the product is available on the product page, and the datasheet can be downloaded here.