Tag Archives: Qualcomm

VIA Snapdragon 820 Based SOM now compatible with Linux

VIA Technologies known for its array of embedded boards and solutions has announced the release of a Linux Board Support Package (BSP) based on the Yocto 2.0.3 for the VIA SOM-9×20 module.

The VIA SOM 9×20 module was custom designed and meant for the Android platform and so migrating to a Linux framework was something that was inevitable and less tedious to achieve as compared to migrating to a different framework.

According to the Richard Brown, the Vice-president of International Marketing at VIA, he says that –

The release of the Linux BSP gives our customers an additional option for the development of Edge AI systems and devices powered by the Qualcomm® Snapdragon™ 820E Embedded Platform

The Linux BSP is expected to provide features like:

  • Supports UFS boot
  • Supports HDMI display
  • Supports AUO MIPI capacitive touch panels through the USB interface
  • AUO 10.1” B101UAN01.7 (1920×1200)
  • Supports COM as debug port
  • Supports two Gigabit Ethernet
  • Supports Mic-in and stereo 2W speaker
  • Supports built-in Wi-Fi 802.11 a/b/g/n/ac, Bluetooth 4.1, and GPS
  • Supports MIPI CSI camera OV13850

The VIA SOM 9×20 module is one of those modules you can’t afford to pass you by. At the heart of the module is the powerful Qualcomm Snapdragon 820E embedded platform, the high performance embedded platform designed to power the next generation of mobile devices and applications with low power consumption, and an array of possible connectivity.

 

The SOM 9×20 module measures at about 82 x 45mm in a SODIMM styled form factor. It features four Cortex-A72-like cores Kryo cores: two at 2.2GHz and two at 1.6GHz. The SoC is boosted with an integrated Adreno 530 GPU at 624MHz, Hexagon 680 DSP, and 14-bit Spectra ISP. The module ships with an inbuilt 64GB eMMC Flash memory, 4GB LPDDR4 in a POP package, rich I/O and display expansion options through its MXM 3.0 314-pin connector.

It supports USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO through the MXM connector. Other possibilities include interfaces for  MIPI-CSI and LCD touchscreen, dual speakers, and a mini-PCIe slot.

VIA also announced a $569 price for the evaluation kit package, which combines the Snapdragon 820 based module with its SOMDB2 Carrier Board. In order to simplify the design, testing, and deployment of intelligent Edge AI applications, VIA is making the SOM 9X20 module to be available as part of its Edge AI Developer Kit, which features a SOMDB2 Carrier Board and optional 13MP camera module that is optimized for intelligent real-time video capture, processing, and edge analysis.

The kit is available in two configurations from the VIA Embedded online store at:

  • VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with 13MP CMOS Camera Module (COB 1/3.06” 4224×3136 pixels): US$629 plus shipping
  • VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board: US$569 plus shipping
  • Optional 10.1” MIPI LCD touch panel: US$179 plus shipping.

The Linux BSP for the VIA SOM 9X20 module is available now, and also an upgraded android 8.0 is available as well. More information about the product is available on the product page.

VIA Smart Recognition Module Recognizes Emotion, Face, Age & Gender

VIA Technologies, a global leader in the development of embedded platform and system solutions have announced its VIA Smart Recognition Platform powered by the Qualcomm Snapdragon 820 embedded platform. The VIA Recognition platform offers a robust development suite for Vision-based applications with the possibility of developing applications that can be used for detecting facial expression, faces, age and even the gender type of an individual. The VIA Technologies announced the VIA Smart Recognition Platform during the Embedded World 2018.

The Platform provides support for object and facial recognition, emotion detection, age and gender detection. Apart from that, the platform can be used for people counting and tracking. Applications for VIA Recognition Platform can be found in office buildings for staff access control and be delivering personalized adverts in retail signage kiosks.  Others areas of note can be in traffic monitoring (counting of vehicles), security screening in airports and VIP places, payment authentication, surveillance and others. The platform’s advanced AI algorithm ensures speed and accuracy.

VIA_SOM-9X20_module Carrier Board

The VIA Smart Recognition platform is based on its VIA SOM-9×20 module powered by the Qualcomm Snapdragon 820 and coupled with a SOM-DB2 evaluation board. The significant difference with this current setup and the earlier SOM module is the pre-loaded facial and object recognition stack. The SOM-9×20 module features a Qualcomm Snapdragon 820 with 4x Cortex-A72-like cores Kryo cores, two of those run at 2.2GHz and the last two at 1.6GHz. Measuring at 82mm x 45mm, the module features a 64GB eMMc Flash memory, 4GB LPDDR4 SDRAM, a 624MHZ Adreno 530 GPU, and a Hexagon 680 DSP. It offers rich I/P and display interface through its MXM 3.0 314-pin connector including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO. It comes with a wireless module that includes Wi-Fi 802.11 a/b/g/n/ac, Bluetooth 4.1 and a separate GPS/GNSS RF receiver with an antenna connector.

The carrier (SOM-DB2 expansion) I/O board is expected to help in accelerating system development. The board extends out the module interfaces, including 2x Ethernet 2x USB 3.0, micro-USB 2.0, HDMI, and a microSD. The VIA Smart Recognition Platform comes with a BSP that features Android 7.1.1 as well as the VIA Smart ETK (Embedded Tool Kit) comprising some APIs, including Watchdog Timer (WDT) for safeguarding against system crashes, GPIO access, RTC for auto-power on, and a sample app. A BSP supporting Linux Kernel 3.18.44 is also under development.

According to Richard Brown, VP International Marketing of VIA Technologies, “Computer vision technologies such as facial and object recognition are becoming a vital tool for boosting public safety and convenience everywhere from check-in counters and security screening in airports to self-service kiosks and payment authentication systems in supermarkets. The VIA Smart Recognition Platform speeds up the development and deployment of tailor-made systems that harness these cutting-edge technologies to deliver innovative new customer services and experiences.”

The VIA SOM-9X20 module and SOM-DB2 evaluation board are available now on VIA Technologies site, but you have to contact them for the prices. For inspiration on usage in computer vision, check out the VIA Smart Recognition Turnkey System brochure and VIA SOM-9X20 Machine Vision Platform brochure.