Ampere debuts 80-core ARM server processor
Technology

Ampere debuts 80-core ARM server processor

Ampere Computing LLC has announced a 64-bit ARM-based processor for servers comprising 80 cores and targeting 7nm manufacturing process technology. By Peter Clarke  @ eenewseurope.com Altra is a follow-up to the 32-core Skylark processor, otherwise known as eMAG, which has been...

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J.Flex, A Lithium-Ion Battery That Is Flexible
Technology

J.Flex, A Lithium-Ion Battery That Is Flexible

A Busan-based company has been developing J.Flex, an advanced lithium-ion battery that is ultra-thin, flexible, and rechargeable for the past few years now. The company used terms like bend, roll, twist, scrunch, fold, flex to describe the battery. EJ Shin, head of strategic planning...

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3D silicon-integrated microcapacitors have unprecedented performance
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3D silicon-integrated microcapacitors have unprecedented performance

Picosun Group, global provider of leading AGILE ALD® (Atomic Layer Deposition) thin film coating solutions, reports record performance of silicon-integrated, three-dimensional deep trench microcapacitors manufactured using its ALD technology. Increasing efficiency and performance...

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In and out with 10-minute electrical vehicle recharge
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In and out with 10-minute electrical vehicle recharge

Researchers at Penn State have developed a fast charging technique to charge a battery in in electric vehicle in just ten minutes. By Nick Flaherty @ www.eenewspower.com The fast charging technique uses a self-heating battery design to provide faster charging at 60ºC, while cooling...

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Google officially lays claim to quantum supremacy
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Google officially lays claim to quantum supremacy

A quantum computer reportedly beat the most powerful supercomputers at one type of calculation. Google researchers report that their quantum computer, Sycamore, has performed a calculation that can’t be achieved with any classical computer. The quantum chip (shown) must be cooled to...

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Samsung unveils 12-layer 3D-TSV chip packaging technology
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Samsung unveils 12-layer 3D-TSV chip packaging technology

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @...

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Wi-Fi 6 milestone reached
Technology

Wi-Fi 6 milestone reached

Wi-Fi 6, the newest generation of Wi-Fi connectivity, reached a significant milestone a few days ago with official certification. The Wireless Broadband Alliance (WBA) is the not-for-profit industry body for the Wi-Fi ecosystem whose members include BT, AT&T and Google. The...

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Shaping light electronically with a Smartlens
Technology

Shaping light electronically with a Smartlens

A team of researchers reports on a dynamically tuneable lens capable of achieving almost any complex optical function. Camera performance on mobile devices has proven to be one of the features that most end-users aim for. The importance of optical image quality improvement, and the...

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