FLIR Lepton 3.0 & 3.5 Micro Thermal Camera Modules

27 April, 2021

3.812

Views0 Comments

FLIR Lepton 3.0 and 3.5 Micro Thermal Camera Modules offer 160 x 120 active pixels and <50mK thermal sensitivity in a small 11.8mm x 12.7mm x 7.2mm package. The 3.0 module is non-radiometric, while the 3.5 module has a radiometric thermal imaging system. Both modules feature a CCI (I²C-like) control port and video over SPI video data interface. While the 3.5 offers the same size, it also provides calibrated radiometric output across the entire 19,200 pixel array. FLIR Lepton 3.0 and 3.5 Micro Thermal Camera Modules feature low power consumption, unmatched image quality, and simple integration.

Features

Enhanced IR Sensor
- 160 x 120 active pixels
- Low operating power
- Low power standby mode
Micro Thermal Imager
- 56° lens
- Integrated digital thermal image processing
- Integrated shutter
- Fast time to image (<0.5 seconds)
- Increased scene dynamic range of +400°C (Lepton 3.5 module only)
Ease of Integration
- SPI video interfaces
- Uses standard cell phone-compatible power supplies
- Two-wire serial control interface
- 32-pin socket interface to connector

Specifications

12µm pixel size
8.7Hz effective frame rate
<50mK thermal sensitivity
Longwave infrared, 8µm to 14µm spectral range
25MHz nominal input clock range
10.5mm x 12.7mm x 7.14mm package dimensions
0.9 grams of weight
Optimum Operating Temperature Range
- -10°C to +65°C (3.0 module)
- -10°C to +80°C (3.5 module)

FLIR Lepton Camera Breakout Board v2.0

FLIR Lepton Camera Breakout Board v2.0 quickly connects all versions of the FLIR Lepton camera module to common platforms like Raspberry Pi or custom hardware. This easy-to-interface evaluation board provides onboard power supplies, generated from 3V to 5.5V, and a master clock. By using a jumper, the master clock, local power supplies, and power-up sequence components can be bypassed. FLIR Lepton Camera Breakout Board is designed for applications where SWaP, cost, and quality are critical.