Orbbec Gemini 305 And 345Lg Expand Stereo 3D Vision For Robotics
https://www.electronics-lab.com/orbbec-gemini-305-and-345lg-expand-stereo-3d-vision-for-robotics/
Orbbec introduced the compact Gemini 305 for robotic wrists and the rugged Gemini 345Lg for outdoor robotics, delivering reliable stereo 3D vision for diverse environments.
3.5-inch iBASE IB962 SBC with 14th Gen Intel Core Ultra Processors and 5G Support for Edge AI Applications
https://www.electronics-lab.com/3-5-inch-ibase-ib962-sbc-with-14th-gen-intel-core-ultra-processors-and-5g-support-for-edge-ai-applications/
The iBASE Technology IB962 is a 3.5-inch SBC built on 14th Gen Intel Core Ultra 7/5 processors from the 100 series (formerly Meteor Lake U/H). It features Intel’s 3D hybrid architecture for advanced AI and computing performance and integrates an Intel Arc GPU for efficient AI graphics processing. The SBC is designed for applications such […]
Stereo vision camera provides 3D information from a distance of approx. 20 centimeters
https://www.electronics-lab.com/stereo-vision-camera-provides-3d-information-from-a-distance-of-approx-20-centimeters/
New 3D camera Ensenso B combines short working distance, large field of view and high depth of field. IDS Imaging Development Systems introduces a new 3D camera in the Ensenso product line. With its compact, industrial-grade design and the combination of a very short working distance and a large field of view, the Ensenso B […]
Tangram Vision Self-Calibrating HiFi 3D Sensor Features ROS 2 Integration and On-Device AI
https://www.electronics-lab.com/tangram-vision-self-calibrating-hifi-3d-sensor-features-ros-2-integration-and-on-device-ai/
The Team at Tangram Vision has recently introduced Self-Calibrating HiFi 3D Sensor a cutting-edge depth sensing solution designed primarily for robotics applications. The camera module integrates high-fidelity 3D sensing with on-device AI capabilities, to provide a Plug-‘n’-Play experience for Depth Sensing and Edge AI applications. The sensor is built around the Texas Instruments Jacinto processor […]
Orbbec releases Persee N1 camera-computer kit for 3D vision enthusiasts, powered by the NVIDIA Jetson platform
https://www.electronics-lab.com/orbbec-releases-persee-n1-camera-computer-kit-for-3d-vision-enthusiasts-powered-by-the-nvidia-jetson-platform/
Orbbec’s feature-rich RGB-D camera-computer is a ready-to-use out-of-the box solution for 3D vision application developers and experimenters Orbbec, an industry leader dedicated to 3D vision systems, has developed the Persee N1, an all-in-one combination of a popular stereo-vision 3D camera and a purpose-built computer based on the NVIDIA Jetson platform, and equipped with industry-standard interfaces […]
Munich-based high-tech startup Toposens is releasing its 3D Ultrasonic Echolocation Sensor ECHO ONE
https://www.electronics-lab.com/munich-based-high-tech-startup-toposens-is-releasing-its-3d-ultrasonic-echolocation-sensor-echo-one/
The Munich based high-tech startup Toposens is announcing the market launch of its first commercial Toposens 3D COLLISION AVOIDANCE SYSTEM for mobile robots based on the proprietary Toposens 3D ultrasonic echolocation technology. This represents a key milestone for the company following more than seven years of R&D and product commercialization. Addressing the unmet need for […]
The challenge of sharing CAD files – Manage, View, and Share CAD – All In The Cloud
https://www.electronics-lab.com/the-challenge-of-sharing-cad-files-manage-view-and-share-cad-all-in-the-cloud/
In this post, we will cover one of the many reasons why hardware development is so challenging. When we think about the decision-making process for design changes in hardware, it often involves multiple stakeholders from different teams. A single change can have dramatically different levels of impact for each of these stakeholders, and more so, […]
Infineon presents the world’s first ISO26262-compliant high-resolution 3D image sensor for automotive
https://www.electronics-lab.com/infineon-presents-the-worlds-first-iso26262-compliant-high-resolution-3d-image-sensor-for-automotive/
Innovative car cockpits, seamless connectivity with new services, and improved passive safety: 3D depth sensors play a key role in monitoring systems in the vehicle cabin. They are essential to meet regulations as well as NCAP ratings and to realize the vision of the driver becoming a passenger. Infineon Technologies AG , in collaboration with […]
Melexis MLX90397 Micropower Triaxis 3D Magnetometer
https://www.electronics-lab.com/melexis-mlx90397-micropower-triaxis-3d-magnetometer/
Melexis MLX90397 Micropower Triaxis® 3D Magnetometer is a position sensor IC featuring Triaxis® Hall Technology and optimized for battery-powered designs. The MLX90397 measures magnetic fields along the three axis X, Y, and Z (Y being in a plane parallel to the surface of the die, Z being perpendicular to the surface). These measurements and the IC […]
e-con Systems™ launches a Time of Flight (ToF) camera for accurate 3D depth measurement
https://www.electronics-lab.com/e-con-systems-launches-a-time-of-flight-tof-camera-for-accurate-3d-depth-measurement/
Depth & RGB in single frame | 640×480 depth map | Frame rate – 30 fps | USB 3.1 Gen 1| Low light e-con Systems™, a leading embedded camera company, launches DepthVista – a Time of Flight (ToF) camera that comes with a combination of a ToF depth sensor for depth measurement and the AR0234 […]