App Note: Heat sink mounting guide

App Note: Heat sink mounting guide

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Fairchild Semiconductor’s app note on proper heat sink mounting to achieve lower thermal resistance between the package and its heat sink. Link here (PDF)

This document provides guidelines for mounting heat sinks for the proper thermal management of power semiconductor devices in field applications. This document describes heat sink mounting methods, considerations, contact thermal resistance, and mounting torque for various packages

App Note: Heat sink mounting guide – [Link]

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